AMD Ryzen 3 PRO 5355G vs AMD Ryzen Embedded 9900X Comparison

AMD
AMD

AMD Ryzen 3 PRO 5355G

CORE STATE Cezanne
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 4 Base / 4.2 GHz Turbo
CACHE 8 MB
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2024
VS
AMD
AMD

Ryzen Embedded 9900X

CORE STATE Granite Ridge
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 4.4 Base / 5.6 GHz Turbo
CACHE 64 MB
MAX TDP 120W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

passmark_data_compression
168,041
N/A
passmark_data_encryption
10,288
N/A
passmark_extended_instructions
11,935
N/A
passmark_find_prime_numbers
36
N/A
passmark_floating_point_math
25,245
N/A
passmark_integer_math
45,910
N/A
passmark_multithread
14,033
N/A
passmark_physics
701
N/A
passmark_random_string_sorting
18,819
N/A
passmark_single_thread
3,096
N/A
passmark_singlethread
3,096
N/A

Analysis: AMD Ryzen 3 PRO 5355G vs AMD Ryzen Embedded 9900X

The Verdict

The database comparison between the AMD Ryzen 3 PRO 5355G and the AMD Ryzen Embedded 9900X is defined by a complete absence of direct head-to-head benchmark data. The Ryzen 3 PRO 5355G holds an average benchmark score of 27,382, placing it in the 79th percentile of all CPUs, while the Ryzen Embedded 9900X has a recorded average benchmark score of zero and sits in the 50th percentile. With zero recorded wins for either processor in direct comparisons, the data cannot declare a performance victor based on measured workloads.

What the data does indicate is a stark separation of intended roles. The Ryzen 3 PRO 5355G is a 4-core, 8-thread desktop processor built on the Zen 3 architecture with a 65-watt TDP, designed for conventional desktop workloads in the AM4 ecosystem. The Ryzen Embedded 9900X is a 12-core, 24-thread processor on the Zen 5 architecture with a 120-watt TDP, targeting embedded applications on the AM5 platform. The choice between them should be driven by platform requirements and workload scale, not by benchmark scores, because the database has no recorded measurements for the Embedded 9900X to analyze.

For users constrained to the AM4 platform with DDR4 memory and PCIe Gen 3, the Ryzen 3 PRO 5355G is the only viable option in this pairing. For users needing 12 cores, 24 threads, DDR5 support, PCIe Gen 5, and an unlocked multiplier for embedded or high-throughput applications, the Ryzen Embedded 9900X is the clear structural choice, despite its lack of recorded benchmark data. The data cannot support a performance recommendation for the Embedded 9900X; it can only support a specification-based recommendation.

Architecture Differences

The two processors represent two distinct generations and design philosophies. The Ryzen 3 PRO 5355G uses the Zen 3 architecture with the Cezanne codename, manufactured on a 7 nm process at TSMC. The Ryzen Embedded 9900X uses the Zen 5 architecture with the Granite Ridge codename, manufactured on a 4 nm process, also at TSMC. The transistor counts differ substantially: the Ryzen 3 PRO 5355G packs 10,700 million transistors on a 180 mm² die, while the Ryzen Embedded 9900X carries 16,630 million transistors across a dual-die design with each die measuring 70.6 mm².

Cache hierarchies reflect the generational leap. The Ryzen 3 PRO 5355G provides 64 KB of L1 cache per core, 512 KB of L2 cache per core, and 8 MB of shared L3 cache. The Ryzen Embedded 9900X doubles the L1 to 80 KB per core, doubles L2 to 1 MB per core, and expands L3 to 64 MB, an eightfold increase in shared cache. This cache expansion is typical of the Zen 5 redesign and directly impacts workloads that depend on large working sets.

Memory support diverges completely. The Ryzen 3 PRO 5355G uses DDR4 memory on a dual-channel bus with a peak bandwidth of 51.2 GB/s. The Ryzen Embedded 9900X uses DDR5 on a dual-channel bus with a peak bandwidth of 89.6 GB/s, a 75% higher theoretical ceiling. Both processors support ECC memory, which matters for embedded and professional reliability use cases.

PCIe connectivity also differs by generation. The Ryzen 3 PRO 5355G provides PCIe Gen 3 with 16 lanes from the CPU. The Ryzen Embedded 9900X provides PCIe Gen 5 with 24 lanes from the CPU, enabling significantly faster peripheral bandwidth and more expansion capacity. The embedded chip also has an unlocked multiplier, while the PRO desktop chip does not, allowing overclocking on the former. Both processors integrate graphics: the Ryzen 3 PRO 5355G uses Radeon Vega 6, while the Ryzen Embedded 9900X uses a generic Radeon Graphics solution.

Where Each One Wins

Without any recorded head-to-head benchmarks, wins must be inferred from architecture and platform characteristics. The Ryzen 3 PRO 5355G wins in efficiency-oriented desktop scenarios where 65 watts of TDP is acceptable and where the AM4 platform with DDR4 memory is already in place. Its lower core count and lower power envelope make it suited for standard desktop productivity, light content creation, and general-purpose computing where the 79th percentile average score of 27,382 indicates competitive performance against mainstream CPUs. The recorded benchmark scores for the Ryzen 3 PRO 5355G show strengths in data compression (168,041 Passmark score), integer math (45,910), and floating point math (25,245), which point to solid general-purpose compute capability.

The Ryzen Embedded 9900X wins in scenarios demanding high core counts and modern platform features. Its 12 cores and 24 threads, combined with 64 MB of L3 cache, DDR5 memory support, PCIe Gen 5 lanes, and an unlocked multiplier, position it for embedded workloads that require substantial parallel processing, large memory bandwidth, and modern I/O. The 120-watt TDP suggests it trades efficiency for throughput. The database records no benchmark scores for this chip, so performance claims cannot be made from measured data, but the specification sheet indicates a design for heavier, more sustained workloads.

The socket difference alone may decide the winner for many buyers. The Ryzen 3 PRO 5355G requires AMD Socket AM4, while the Ryzen Embedded 9900X requires AMD Socket AM5. These platforms are not interchangeable, and the choice of motherboard dictates which processor is even compatible. The release dates also differ: the Ryzen 3 PRO 5355G launched on September 4, 2024, while the Ryzen Embedded 9900X launched on October 6, 2025, over a year later.

FAQ

Q: Which processor has better benchmark scores?

A: The Ryzen 3 PRO 5355G has an average benchmark score of 27,382, placing it in the 79th percentile of all CPUs. The Ryzen Embedded 9900X has an average benchmark score of zero, with no recorded benchmarks in the database.

Q: How many cores and threads does each processor have?

A: The Ryzen 3 PRO 5355G has 4 cores and 8 threads. The Ryzen Embedded 9900X has 12 cores and 24 threads.

Q: What memory types do these processors support?

A: The Ryzen 3 PRO 5355G supports DDR4 memory with a dual-channel bus and 51.2 GB/s bandwidth. The Ryzen Embedded 9900X supports DDR5 memory with a dual-channel bus and 89.6 GB/s bandwidth. Both support ECC memory.

Q: Are these processors compatible with the same motherboard?

A: No. The Ryzen 3 PRO 5355G uses AMD Socket AM4, while the Ryzen Embedded 9900X uses AMD Socket AM5. The platforms are not interchangeable.

Q: Which processor has more cache?

A: The Ryzen Embedded 9900X has 64 MB of L3 cache, 1 MB of L2 cache per core, and 80 KB of L1 cache per core. The Ryzen 3 PRO 5355G has 8 MB of L3 cache, 512 KB of L2 cache per core, and 64 KB of L1 cache per core.

Q: Can either processor be overclocked?

A: The Ryzen Embedded 9900X has an unlocked multiplier, which supports overclocking. The Ryzen 3 PRO 5355G has a locked multiplier and does not support overclocking.

Head-to-Head Benchmarks

The database contains no head-to-head benchmark entries for these two processors. The winsA and winsB values are both zero, and the headToHeadBenchmarks array is empty. This absence of direct measurement data means the analysis must rely on the individual benchmark scores recorded for the Ryzen 3 PRO 5355G and the architectural specifications of the Ryzen Embedded 9900X.

The Ryzen 3 PRO 5355G has a complete set of Passmark benchmark scores. Its single-thread score is 3,096, its multithread score is 14,033, and its physics score is 701. In compute workloads, it records 45,910 in integer math, 25,245 in floating point math, 11,935 in extended instructions, and 10,288 in data encryption. Random string sorting scores 18,819, and data compression scores 168,041. Prime number finding scores 36. These numbers establish a baseline for a 4-core Zen 3 desktop processor.

The Ryzen Embedded 9900X has no recorded benchmark scores whatsoever. Its average benchmark score is listed as zero. This does not mean the processor is incapable of performance; it means the database has not yet collected any measurements. The 50th percentile ranking is assigned by default, not by measured performance. Any comparison of actual workload performance between these two processors is impossible from the recorded data.

The nearest rivals to the Ryzen 3 PRO 5355G provide context for its performance level. The Intel Core i7-13700H has an average score of 27,355, which is 0.1% higher. The Intel Core Ultra 5 125H scores 27,507, 0.5% higher. The AMD Ryzen 7 5800 scores 27,535, 0.6% higher. The Intel Core i5-12600K scores 27,578, 0.7% higher. These deltas are all within 1%, indicating the Ryzen 3 PRO 5355G performs essentially at parity with these mainstream desktop and mobile processors. The Ryzen Embedded 9900X has no nearest rivals recorded in the database.

Specification Differences

The two processors differ across nearly every measured specification. The Ryzen 3 PRO 5355G belongs to the 5000 series, while the Ryzen Embedded 9900X belongs to the 9000 series. Core counts differ by a factor of three: 4 cores versus 12 cores, with threads at 8 versus 24. Base clocks are 4.00 GHz versus 4.40 GHz, and boost clocks are 4.20 GHz versus 5.60 GHz, a 33% higher boost for the embedded chip. TDP rises from 65 watts to 120 watts.

Process technology differs by node size: 7 nm versus 4 nm, both at TSMC. Transistor counts grow from 10,700 million to 16,630 million. Die size changes from a single 180 mm² die to two 70.6 mm² dies. The L1 cache per core increases from 64 KB to 80 KB, L2 per core from 512 KB to 1 MB, and L3 from 8 MB to 64 MB.

Memory support changes from DDR4 to DDR5, with bandwidth rising from 51.2 GB/s to 89.6 GB/s. The memory bus remains dual-channel for both. PCIe support advances from Gen 3 with 16 lanes to Gen 5 with 24 lanes. The socket changes from AM4 to AM5. The Ryzen 3 PRO 5355G has a locked multiplier, while the Ryzen Embedded 9900X has an unlocked multiplier. Integrated graphics differ from Radeon Vega 6 to a generic Radeon Graphics solution. Release dates are September 4, 2024, for the Ryzen 3 PRO 5355G and October 6, 2025, for the Ryzen Embedded 9900X. Part numbers are 100-000001749 for the former and 100-000000662E for the latter. Both processors support ECC memory, and both are listed as active in production status.

DETAILED SPECIFICATIONS

SPECIFICATION
3 PRO 5355G
Embedded 9900X
Core Specs
Cores
4
12 +200.0%
Threads
8
24 +200.0%
Base Clock (GHz)
4
4.4 +10.0%
Boost Clock (GHz)
4.2
5.6 +33.3%
Frequency (GHz)
4
4.4 +10.0%
Turbo Clock (GHz)
4.2
5.6 +33.3%
Multiplier
40
44 +10.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
8 MB
64 MB
Power
TDP (W)
65
120 +84.6%
PPT
88 W
162 W
Architecture
Architecture
Zen 3
—
Codename
Cezanne
Granite Ridge
Generation
Ryzen 3 (Zen 3 (Cezanne))
Ryzen Embedded (Zen 5 (Granite Ridge))
Process Size
7 nm
4 nm
Transistors
10,700 million
16,630 million
Die Size
180 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM4
AMD Socket AM5
Chipsets
—
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600¹
PCIe
Gen 3, 16 Lanes(CPU only)
Gen 5, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
Radeon Vega 6
Radeon Graphics
Other
Market
Desktop
Desktop
Production Status
Active
Active
Part Number
100-000001749
100-000000662E
Package
µOPGA-1331
FC-LGA1718
Tj Max
95°C
95°C
Bundled Cooler
—
None
View Ryzen 3 PRO 5355G Details View Ryzen Embedded 9900X Details