CPU Comparison

A

AMD

AMD

AMD Ryzen 3 8300G

CORE STATE Phoenix2

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.4 Base / 4.9 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 4

nm

PROCESS 4 nm

LAUNCH DATE 2024

VS

A

AMD

AMD

Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,231

4,584

cinebench_cinebench_r15_singlecore

173

647

cinebench_cinebench_r20_multicore

5,131

19,104

cinebench_cinebench_r20_singlecore

724

2,696

cinebench_cinebench_r23_multicore

12,217

45,488

cinebench_cinebench_r23_singlecore

1,724

6,421

passmark_data_compression

164,386

738,673

passmark_data_encryption

9,259

44,430

passmark_extended_instructions

12,489

54,674

passmark_find_prime_numbers

51

272

passmark_floating_point_math

25,518

125,981

passmark_integer_math

41,070

205,945

passmark_multithread

14,374

54,675

passmark_physics

833

2,115

passmark_random_string_sorting

18,759

85,869

passmark_single_thread

3,873

4,033

passmark_singlethread

3,873

4,033

DETAILED SPECIFICATIONS

SPECIFICATION

3 8300G

9 8940HX

Core Specs

Cores

4

16 +300.0%

Threads

8

32 +300.0%

Base Clock (GHz)

3.4

2.4 -29.4%

Boost Clock (GHz)

4.9

5.3 +8.2%

Frequency (GHz)

3.4

2.4 -29.4%

Turbo Clock (GHz)

4.9

5.3 +8.2%

Multiplier

40

24 -40.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

8 MB (shared)

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

61-88 W

—

Configurable TDP

45 W

45-75 W

Architecture

Architecture

Zen 4

Zen 4

Codename

Phoenix2

Dragon Range

Generation

Ryzen 3 (Zen 4 (Phoenix))

Ryzen 9 (Zen 4 (Dragon Range))

Process Size

4 nm

5 nm

Transistors

20,900 million

13,140 million

Die Size

137 mm²

2x 71 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

83.2 GB/s

83.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket AM5

AMD Socket FL1

Chipsets

X670E, X670, B650E, B650, A620

—

PCIe

Gen 4, 14 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

1 + 3

—

E-Core Frequency

3.2 GHz up to 3.6 GHz

—

AMD Multi-Die

IO Process Size

—

6 nm

Graphics

Integrated Graphics

Radeon 740M

Radeon 610M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$176

—

Part Number

100-000001492

100-000001849

Package

FC-LGA1718

µFC-BGAFL1

Tj Max

95°C

100°C

Bundled Cooler

Wraith Stealth

—

View Ryzen 3 8300G Details View Ryzen 9 8940HX Details