CPU Comparison

AMD
AMD

AMD Ryzen 3 7335U

CORE STATE Rembrandt-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3 Base / 4.3 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 3+
nm
PROCESS 6 nm
LAUNCH DATE 2023
VS
Intel
INTEL

Xeon 6741P

CORE STATE Granite Rapids
CORE SPECS 48 Cores / 96 Threads
CLOCK SPEED 2.5 Base / 3.8 GHz Turbo
CACHE 288 MB (shared)
MAX TDP 300W
ARCHITECTURE Granite Rapids
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,078
8,624
cinebench_cinebench_r15_singlecore
152
1,217
cinebench_cinebench_r20_multicore
4,495
35,935
cinebench_cinebench_r20_singlecore
634
5,073
cinebench_cinebench_r23_multicore
10,703
85,561
cinebench_cinebench_r23_singlecore
1,511
12,079
passmark_data_compression
146,309
1,816,408
passmark_data_encryption
9,335
89,746
passmark_extended_instructions
10,314
142,682
passmark_find_prime_numbers
36
1,242
passmark_floating_point_math
24,298
358,423
passmark_integer_math
42,493
458,058
passmark_multithread
12,592
100,660
passmark_physics
647
13,890
passmark_random_string_sorting
15,361
177,322
passmark_single_thread
3,053
3,195
passmark_singlethread
3,053
3,195

DETAILED SPECIFICATIONS

SPECIFICATION
3 7335U
6741P
Core Specs
Cores
4
48 +1100.0%
Threads
8
96 +1100.0%
Base Clock (GHz)
3
2.5 -16.7%
Boost Clock (GHz)
4.3
3.8 -11.6%
Frequency (GHz)
3
2.5 -16.7%
Turbo Clock (GHz)
4.3
3.8 -11.6%
Multiplier
30
25 -16.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
112 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
8 MB (shared)
288 MB (shared)
Power
TDP (W)
28
300 +971.4%
Architecture
Architecture
Zen 3+
Granite Rapids
Codename
Rembrandt-R
Granite Rapids
Generation
Ryzen 3 (Zen 3+ (Rembrandt))
Xeon 6 (Granite Rapids-SP)
Process Size
6 nm
5 nm
Die Size
208 mm²
2x 598 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Eight-channel
Memory Bandwidth
76.8 GB/s
409.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP7
Intel Socket 4710
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 136 Lanes(CPU only)
AMD Multi-Die
IO Process Size
10 nm
Interconnect
CXL
Gen 2.0, 64 Lanes (Shared with PCI-E)
Graphics
Integrated Graphics
Radeon 660M
Other
Market
Mobile
Server/Workstation
Production Status
Active
Active
Launch Price
$4421
Part Number
100-000000537(FP7)100-000000549(FP7r2)
SRVEY
Package
FP7, FP7r2
FC-LGA18N
Tj Max
95°C
93°C
Bundled Cooler
None
View Ryzen 3 7335U Details View Xeon 6741P Details