CPU Comparison

AMD
AMD

AMD Ryzen 3 4300G

CORE STATE Renoir
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.8 Base / 4 GHz Turbo
CACHE 4 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2020
VS
AMD
AMD

Ryzen 9 9955HX

CORE STATE Fire Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
845
4,922
cinebench_cinebench_r15_singlecore
119
694
cinebench_cinebench_r20_multicore
3,522
20,510
cinebench_cinebench_r20_singlecore
497
2,895
cinebench_cinebench_r23_multicore
8,387
48,834
cinebench_cinebench_r23_singlecore
1,184
6,894
passmark_data_compression
137,681
753,225
passmark_data_encryption
8,176
38,386
passmark_extended_instructions
9,148
59,765
passmark_find_prime_numbers
20
296
passmark_floating_point_math
17,577
140,152
passmark_integer_math
29,737
218,727
passmark_multithread
9,849
57,640
passmark_physics
454
2,792
passmark_random_string_sorting
14,503
79,529
passmark_single_thread
2,425
4,459
passmark_singlethread
2,425
4,459

DETAILED SPECIFICATIONS

SPECIFICATION
3 4300G
9 9955HX
Core Specs
Cores
4
16 +300.0%
Threads
8
32 +300.0%
Base Clock (GHz)
3.8
2.5 -34.2%
Boost Clock (GHz)
4
5.4 +35.0%
Frequency (GHz)
3.8
2.5 -34.2%
Turbo Clock (GHz)
4
5.4 +35.0%
Multiplier
38
25 -34.2%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
4 MB (shared)
64 MB (shared)
Power
TDP (W)
65
55 -15.4%
PPT
61-88 W
74-101 W
Configurable TDP
45 W
75 W
Architecture
Architecture
Zen 2
Zen 5
Codename
Renoir
Fire Range
Generation
Ryzen 3 (Zen 2 (Renoir))
Ryzen 9 (Zen 5 (Fire Range))
Process Size
7 nm
4 nm
Transistors
9,800 million
16,630 million
Die Size
156 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
89.6 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket AM4
AMD Socket FL1
Chipsets
AMD 300 Series, AMD 400 Series, AMD 500 Series
PCIe
Gen 3, 16 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Vega 6
Radeon 610M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
100-000000144
100-000001028
Package
µOPGA-1331
µFC-BGAFL1
Tj Max
95°C
100°C
Bundled Cooler
None
View Ryzen 3 4300G Details View Ryzen 9 9955HX Details