CPU Comparison
AMD
AMD Ryzen 3 3250U
CORE STATE
Dali
CORE SPECS
2 Cores / 4 Threads
CLOCK SPEED
2.6 Base / 3.5 GHz Turbo
CACHE
4 MB (shared)
MAX TDP
15W
ARCHITECTURE
Zen
PROCESS
14 nm
LAUNCH DATE
2020
VS
INTEL
Core i7-10875H
CORE STATE
Comet Lake-H
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2.3 Base / 5.1 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
45W
ARCHITECTURE
Comet Lake
PROCESS
14 nm
LAUNCH DATE
2020
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
3 3250U
i7-10875H
Core Specs
Cores
2
8
+300.0%
Threads
4
16
+300.0%
Base Clock (GHz)
2.6
2.3
-11.5%
Boost Clock (GHz)
3.5
5.1
+45.7%
Frequency (GHz)
2.6
2.3
-11.5%
Turbo Clock (GHz)
3.5
5.1
+45.7%
Multiplier
26
23
-11.5%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
4 MB (shared)
16 MB (shared)
Power
TDP (W)
15
45
+200.0%
PL1
—
45 W
PL2
—
80 W
Configurable TDP
12-25 W
35-62 W
Architecture
Architecture
Zen
Comet Lake
Codename
Dali
Comet Lake-H
Generation
Ryzen 3
(Zen (Raven Ridge))
Core i7
(Comet Lake-H)
Process Size
14 nm
14 nm
Transistors
3,500 million
—
Die Size
148 mm²
177.5 mm²
Foundry
GlobalFoundries
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
38.4 GB/s
46.9 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FP5
Intel BGA 1440
Chipsets
—
HM470, QM480, WM490
PCIe
Gen 3
Gen 3, 16 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon Vega 3
UHD Graphics
Other
Market
Mobile
Mobile
Production Status
Active
Active
Launch Price
—
$450
Part Number
YM3250C4T2OFG
SRJ8F
Package
FP5
FC-BGA1440
Tj Max
95°C
100°C