AMD Ryzen 3 3200U vs Intel Xeon X5550 Comparison

AMD
AMD

AMD Ryzen 3 3200U

CORE STATE Raven Ridge
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 2.6 Base / 3.5 GHz Turbo
CACHE 4 MB (shared)
MAX TDP 15W
ARCHITECTURE Zen
nm
PROCESS 14 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Xeon X5550

CORE STATE Gainestown
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.67 Base / 3.07 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 95W
ARCHITECTURE Nehalem
nm
PROCESS 45 nm
LAUNCH DATE 2009

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
334
259
cinebench_cinebench_r15_singlecore
129
N/A
cinebench_cinebench_r23_multicore
1,786
2,580
cinebench_cinebench_r23_singlecore
765
364
geekbench_multicore
1,527
N/A
geekbench_singlecore
817
N/A
cinebench_cinebench_r20_multicore
N/A
1,083
cinebench_cinebench_r20_singlecore
N/A
152

Analysis: AMD Ryzen 3 3200U vs Intel Xeon X5550

Head-to-Head Benchmarks

The two processors split their three shared benchmark runs, with each taking a decisive win. In Cinebench R15 multi-core, the AMD Ryzen 3 3200U scores 334 against the Intel Xeon X5550's 259, a 29% advantage. That result is notable because the Xeon holds a 2x core and 2x thread advantage, yet the Ryzen's newer architecture and higher efficiency overcome that deficit in this older test. The single-core Cinebench R23 run is even more lopsided: the Ryzen posts 765 versus the Xeon's 364, a 110.2% lead—more than double the score. This reflects the massive generational gap in instructions-per-clock between Zen (Raven Ridge) and Nehalem (Gainestown), as well as the Ryzen's higher 3.50 GHz boost clock versus the Xeon's 3.07 GHz.

However, the multi-core Cinebench R23 result flips the script. Here the Xeon wins with 2580 against the Ryzen's 1786, a 30.8% margin. This is the only test where the Xeon's four physical cores and eight threads can fully stretch their legs, and the newer benchmark's scaling rewards that parallelism. The Ryzen's two cores and four threads simply run out of headroom, even with its superior per-core performance. Across the three head-to-head runs, the Ryzen wins two and the Xeon wins one, but the margins tell the real story: the Ryzen's single-core dominance is extreme, while the Xeon's multi-core win is substantial but less dramatic. In the broader picture, both chips land at the 24th percentile of all CPUs, and their average benchmark scores are nearly identical—893 for the Ryzen, 888 for the Xeon. The Ryzen's closest rival, the Intel Core i5-5300U, scores 895 (0.2% higher), while the Xeon's nearest competitor, the Intel Core i3-6100, matches its 888 exactly.

FAQ

Q: Which processor has the higher single-core performance?

A: The AMD Ryzen 3 3200U dominates. In Cinebench R23 single-core, it scores 765 versus the Xeon X5550's 364—a 110.2% advantage. This is the largest performance gap between the two in any shared benchmark.

Q: Does the Xeon X5550 ever beat the Ryzen 3 3200U?

A: Yes, in Cinebench R23 multi-core. The Xeon scores 2580 against the Ryzen's 1786, a 30.8% lead. This is the only head-to-head test the Xeon wins, and it comes from having twice the cores and threads (4C/8T vs 2C/4T).

Q: What is the average benchmark score for each processor?

A: The Ryzen 3 3200U averages 893 across its benchmark suite, while the Xeon X5550 averages 888. Both sit at the 24th percentile of all CPUs, indicating they perform at essentially the same overall level despite their different strengths.

Q: Which processor supports ECC memory?

A: Only the Intel Xeon X5550. It supports ECC memory alongside DDR3, while the AMD Ryzen 3 3200U does not offer ECC support. The Ryzen instead uses DDR4 memory.

Q: How do the memory channels compare between the two?

A: The Xeon X5550 uses triple-channel DDR3 memory, while the Ryzen 3 3200U uses dual-channel DDR4. The Ryzen's memory bandwidth is listed at 38.4 GB/s; the Xeon's bandwidth figure is not provided in the data.

Q: Are these processors still in production?

A: No. The AMD Ryzen 3 3200U is marked as "Active" in production status, while the Intel Xeon X5550 is "End-of-life." The Xeon was released in March 2009, roughly a decade before the Ryzen's January 2019 launch.

Architecture Differences

The architectural gap between these two is vast, spanning nearly two full process generations. The AMD Ryzen 3 3200U uses the Zen architecture (codename Raven Ridge) built on a 14 nm process at GlobalFoundries, packing 4,940 million transistors into a 210 mm² die. The Intel Xeon X5550 uses the Nehalem architecture (codename Gainestown) on a 45 nm process at Intel, with just 731 million transistors across a 263 mm² die. The transistor density difference is staggering—the Ryzen crams roughly 6.7x more transistors into a smaller area, which underpins its efficiency and per-core performance.

Cache layouts differ significantly. The Ryzen has 96 KB of L1 per core, 512 KB of L2 per core, and 4 MB of shared L3. The Xeon has smaller per-core caches (64 KB L1, 256 KB L2) but doubles the shared L3 to 8 MB. That larger L3 helps the Xeon in multi-threaded workloads where all cores access shared data, but it cannot compensate for the Ryzen's newer core design. Memory support also diverges: the Ryzen uses dual-channel DDR4 with 38.4 GB/s bandwidth, while the Xeon uses triple-channel DDR3 with no bandwidth figure listed. The Ryzen also supports PCIe Gen 3, whereas the Xeon is limited to Gen 2.

The most significant functional difference is the integrated graphics. The Ryzen 3 3200U includes Radeon Vega 3 graphics, making it a complete APU suitable for systems without a discrete GPU. The Xeon X5550 has no integrated graphics at all, meaning it requires a separate graphics card for any display output. Additionally, ECC memory support is exclusive to the Xeon, a standard feature for server/workstation reliability. Both processors have locked multipliers, so neither can be overclocked via multiplier adjustment.

The Verdict

The data points to a clear split: pick the AMD Ryzen 3 3200U for any workload that favors single-core performance, responsiveness, and modern platform features. Its 110.2% lead in Cinebench R23 single-core and 29% win in Cinebench R15 multi-core demonstrate that its two fast cores outperform the Xeon's four slower ones in most real-world scenarios where software isn't perfectly parallelized. The Ryzen also brings integrated graphics, DDR4 support, PCIe Gen 3, and a 15W TDP—a fraction of the Xeon's 95W—making it vastly more power-efficient and suitable for mobile or compact builds.

Pick the Intel Xeon X5550 for heavily multi-threaded workloads that can use all eight threads. Its 30.8% win in Cinebench R23 multi-core shows that when the workload scales with core count, the Xeon's 4C/8T configuration pulls ahead. It also offers ECC memory support, which is a requirement for certain server and workstation reliability scenarios. However, the Xeon is end-of-life, uses older DDR3 memory, lacks integrated graphics, and runs at nearly 6.3x the TDP of the Ryzen. For most users, the Ryzen 3 3200U is the more practical choice. But for a specific, thread-hungry, ECC-requiring build, the Xeon's multi-core edge justifies its existence.

Specification Differences

| Specification | AMD Ryzen 3 3200U | Intel Xeon X5550 |

|---|---|---|

| Cores | 2 | 4 |

| Threads | 4 | 8 |

| Base Clock | 2.60 GHz | 2.67 GHz |

| Boost Clock | 3.50 GHz | 3.07 GHz |

| TDP | 15 W | 95 W |

| Socket | AMD Socket FP5 | Intel Socket 1366 |

| Process Node | 14 nm | 45 nm |

| L1 Cache (per core) | 96 KB | 64 KB |

| L2 Cache (per core) | 512 KB | 256 KB |

| L3 Cache (shared) | 4 MB | 8 MB |

| Memory Support | DDR4 | DDR3 |

| Memory Bus | Dual-channel | Triple-channel |

| Memory Bandwidth | 38.4 GB/s | Not listed |

| ECC Memory | No | Yes |

| PCIe Version | Gen 3 | Gen 2 |

| Integrated Graphics | Radeon Vega 3 | None |

| Market Segment | Mobile | Server/Workstation |

| Production Status | Active | End-of-life |

| Release Date | 2019-01-05 | 2009-03-29 |

| Transistors | 4,940 million | 731 million |

| Die Size | 210 mm² | 263 mm² |

| Foundry | GlobalFoundries | Intel |

Where Each One Wins

The AMD Ryzen 3 3200U wins in single-threaded performance, efficiency, and platform modernity. Its 110.2% single-core lead in Cinebench R23 makes it the clear choice for everyday applications like web browsing, office work, and lightly threaded software that relies on one or two fast cores. The 29% win in Cinebench R15 multi-core further shows that even in some multi-threaded tests, the Ryzen's architectural efficiency overcomes its core deficit. The integrated Radeon Vega 3 graphics mean this chip can power a complete system without a discrete GPU, and the 15W TDP allows for fanless or ultra-low-power designs. DDR4 memory support and PCIe Gen 3 provide a modern foundation that the Xeon cannot match.

The Intel Xeon X5550 wins in heavily parallel workloads, thanks to its 4C/8T configuration delivering a 30.8% lead in Cinebench R23 multi-core. This makes it the better pick for multi-threaded rendering, encoding, or server-style batch processing where all cores are saturated. ECC memory support is a functional advantage for data integrity in critical systems. The larger 8 MB L3 cache also helps in workloads with large working sets that fit in cache. The Xeon's triple-channel memory bus provides additional bandwidth potential for memory-intensive tasks, though no bandwidth figure is listed for direct comparison. For a budget server or workstation build where power draw is not a concern, the Xeon's parallel strengths and ECC support are the deciding factors.

DETAILED SPECIFICATIONS

SPECIFICATION
3 3200U
X5550
Core Specs
Cores
2
4 +100.0%
Threads
4
8 +100.0%
Base Clock (GHz)
2.6
2.67 +2.7%
Boost Clock (GHz)
3.5
3.07 -12.3%
Frequency (GHz)
2.6
2.67 +2.7%
Turbo Clock (GHz)
3.5
3.07 -12.3%
Multiplier
26
20 -23.1%
SMP CPUs
1
2 +100.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
4 MB (shared)
8 MB (shared)
Power
TDP (W)
15
95 +533.3%
Configurable TDP
25 W
—
Architecture
Architecture
Zen
Nehalem
Codename
Raven Ridge
Gainestown
Generation
Ryzen 3 (Zen (Raven Ridge))
Xeon (Gainestown)
Process Size
14 nm
45 nm
Transistors
4,940 million
731 million
Die Size
210 mm²
263 mm²
Foundry
GlobalFoundries
Intel
Memory
Memory Support
DDR4
DDR3
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
38.4 GB/s
—
ECC Memory
No
Yes
Platform
Socket
AMD Socket FP5
Intel Socket 1366
PCIe
Gen 3
Gen 2
Graphics
Integrated Graphics
Radeon Vega 3
—
Other
Market
Mobile
Server/Workstation
Production Status
Active
End-of-life
Part Number
YM3200C4T2OFG
SLBF5
Package
FP5
FC-LGA8
Tj Max
105°C
—
View Ryzen 3 3200U Details View Xeon X5550 Details