AMD Ryzen 3 30 vs Qualcomm Snapdragon X2E-96-100 Comparison

The Verdict

The AMD Ryzen 3 30 is a compact, efficient mobile processor built around four Zen 2 cores with simultaneous multithreading, reaching 8 threads. Its recorded data shows a strong average benchmark score of 20,137, placing it in the 74th percentile of all CPUs in the database. It trades closely with several established desktop and mobile parts, sitting within 0.7% of the Intel Core i7-9700K and 0.6% of the AMD EPYC 7713P.

The Qualcomm Snapdragon X2E-96-100 is a fundamentally different part: an 18-core, 18-thread processor with no hyperthreading, based on the Glymur codename and built on a 3 nm process. It has no recorded benchmark scores in the database, no average score, and no nearest rivals listed. Its percentile ranking sits at 50, but that figure is derived from an empty benchmark history, meaning it reflects position rather than measured performance.

For anyone selecting between these two, the data is one-sided. The Ryzen 3 30 has a complete set of PassMark results across compression, encryption, math workloads, and single-thread tests. The Snapdragon X2E-96-100 has none. If the task requires verified performance numbers, the Ryzen 3 30 is the only option with evidence. The Snapdragon part may offer architectural advantages on paper, but without measurements, it cannot be recommended for any workload that depends on known throughput.

Architecture Differences

The two processors come from opposite ends of the design spectrum. The AMD Ryzen 3 30 uses the Zen 2 architecture under the Mendocino codename, manufactured on a 6 nm process at TSMC. It packs 4 cores with 8 threads, meaning each core can handle two instruction streams. The die size is 100 mm². Cache is organized as 64 KB of L1 per core, 512 KB of L2 per core, and 4 MB of shared L3.

The Qualcomm Snapdragon X2E-96-100 uses the Glymur codename under the Snapdragon X2 Elite generation, built on a 3 nm process, also at TSMC. It has 18 cores and 18 threads, so there is no simultaneous multithreading; each core handles a single thread. The die is substantially larger at 220 mm². Cache layout differs significantly: 288 KB of L1 per core, 16 MB of L2 per module, and 9 MB of shared L3.

Memory support also diverges. The Ryzen 3 30 uses LPDDR5 with a dual-channel bus, delivering 88.0 GB/s of bandwidth. The Snapdragon X2E-96-100 uses LPDDR5X with a triple-channel bus, delivering 228.6 GB/s. That is a major bandwidth advantage for the Qualcomm part, though no benchmark data exists to show how it translates into real-world performance.

PCIe connectivity differs as well. The Ryzen 3 30 provides PCIe Gen 3 with 4 lanes from the CPU. The Snapdragon X2E-96-100 provides PCIe Gen 5 with 12 lanes from the CPU, a generational leap and three times the lane count. Integrated graphics also differ: the AMD part uses Radeon 610M, while the Qualcomm part uses Adreno X2-90.

The socket and form factor are distinct. The Ryzen 3 30 uses AMD Socket FT6, while the Snapdragon X2E-96-100 uses Qualcomm BGA 2343. Both are mobile parts, and neither has an unlocked multiplier. The Ryzen 3 30 has a base clock of 2.40 GHz and a boost clock of 4.10 GHz, with a TDP of 15 watts. The Snapdragon X2E-96-100 has a base clock of 4.45 GHz and a boost clock of 5.00 GHz, with no TDP figure recorded.

Where Each One Wins

Based strictly on recorded data, the AMD Ryzen 3 30 wins every measurable category. It has scores for data compression, data encryption, extended instructions, prime number finding, floating point math, integer math, multithread performance, physics, random string sorting, and single-thread performance. The Snapdragon X2E-96-100 has no entries in any of these tests, so there is no basis for claiming a win in any workload.

That does not mean the Snapdragon part is without potential advantages. Its 18 cores, higher base and boost clocks, larger cache hierarchy, wider memory bus, and newer PCIe generation all point toward a design aimed at high-throughput, multi-core tasks. The 3 nm process and 228.6 GB/s of memory bandwidth suggest strong sustained performance in memory-heavy applications. But the database contains no measurements to confirm those expectations.

The Ryzen 3 30, by contrast, is a verified quantity. Its multithread score of 9,027 and single-thread score of 2,465 indicate a capable mobile processor for everyday workloads, light content creation, and general productivity. Its physics score of 436 and integer math score of 29,846 provide concrete reference points for simulation and compute tasks. For any user who needs known performance, the AMD part is the safe choice.

FAQ

Q: Which processor has better single-thread performance?

A: The AMD Ryzen 3 30 has a recorded single-thread score of 2,465. The Qualcomm Snapdragon X2E-96-100 has no recorded single-thread score, so no comparison is possible from the database.

Q: Does the Snapdragon X2E-96-100 support more memory bandwidth?

A: Yes. The Snapdragon X2E-96-100 supports LPDDR5X memory on a triple-channel bus with 228.6 GB/s bandwidth, while the Ryzen 3 30 supports LPDDR5 on a dual-channel bus with 88.0 GB/s.

Q: How do the core counts compare?

A: The Snapdragon X2E-96-100 has 18 cores and 18 threads. The Ryzen 3 30 has 4 cores and 8 threads.

Q: Which processor has a smaller manufacturing process?

A: The Snapdragon X2E-96-100 is built on a 3 nm process, while the Ryzen 3 30 uses a 6 nm process. Both are manufactured by TSMC.

Q: Are there any benchmark results for the Snapdragon X2E-96-100?

A: No. The database lists no benchmark scores for the Snapdragon X2E-96-100. Its average benchmark score is 0, and it has no nearest rivals.

Q: What is the percentile ranking for each processor?

A: The Ryzen 3 30 ranks in the 74th percentile of all CPUs. The Snapdragon X2E-96-100 ranks in the 50th percentile, though this is based on an empty benchmark history.

Head-to-Head Benchmarks

There are no direct head-to-head benchmark results in the database. The wins count stands at 0 for both processors. However, the Ryzen 3 30 has a full suite of individual PassMark results that can be examined on their own terms.

The Ryzen 3 30 delivers a data compression score of 135,834, which is its strongest single result. Data encryption comes in at 6,461, and extended instructions score 6,075. Prime number finding is notably low at 20, which indicates weak performance in that specific workload. Floating point math scores 14,448, while integer math reaches 29,846. The multithread score is 9,027, and physics is 436. Random string sorting scores 14,431. Single-thread performance is recorded twice in the database, both times at 2,465.

These numbers place the Ryzen 3 30 in a competitive position against its nearest rivals. The Intel Core Ultra 7 165U has an average score of 20,249, which is 0.6% higher than the Ryzen 3 30. The AMD EPYC 7713P has an average score of 20,024, which is 0.6% lower. The Intel Core i7-9700K averages 20,271, 0.7% higher, and the Intel Core i7-11800H averages 19,998, 0.7% lower. The Ryzen 3 30 sits almost exactly in the middle of this group, within a single percentage point of all four rivals.

For the Snapdragon X2E-96-100, the absence of data means there is nothing to walk through. No compression, no encryption, no math scores, no single-thread or multithread results. The only recorded figures are architectural: 18 cores, 18 threads, 4.45 GHz base clock, 5.00 GHz boost clock, 3 nm process, 220 mm² die, 228.6 GB/s memory bandwidth, and PCIe Gen 5 with 12 lanes. Those specifications suggest a high-end part, but without benchmark results, they remain unverified claims.

Specification Differences

The two processors differ across nearly every recorded specification field.

Cores and threads: The Ryzen 3 30 has 4 cores and 8 threads. The Snapdragon X2E-96-100 has 18 cores and 18 threads.

Clock speeds: The Ryzen 3 30 has a base clock of 2.40 GHz and a boost clock of 4.10 GHz. The Snapdragon X2E-96-100 has a base clock of 4.45 GHz and a boost clock of 5.00 GHz.

Process node: The Ryzen 3 30 uses a 6 nm process. The Snapdragon X2E-96-100 uses a 3 nm process. Both are from TSMC.

Die size: The Ryzen 3 30 measures 100 mm². The Snapdragon X2E-96-100 measures 220 mm².

Cache: The Ryzen 3 30 has 64 KB L1 per core, 512 KB L2 per core, and 4 MB shared L3. The Snapdragon X2E-96-100 has 288 KB L1 per core, 16 MB L2 per module, and 9 MB shared L3.

Memory: The Ryzen 3 30 supports LPDDR5 on a dual-channel bus with 88.0 GB/s bandwidth. The Snapdragon X2E-96-100 supports LPDDR5X on a triple-channel bus with 228.6 GB/s bandwidth.

PCIe: The Ryzen 3 30 provides PCIe Gen 3 with 4 lanes. The Snapdragon X2E-96-100 provides PCIe Gen 5 with 12 lanes.

Integrated graphics: The Ryzen 3 30 uses Radeon 610M. The Snapdragon X2E-96-100 uses Adreno X2-90.

Socket: The Ryzen 3 30 uses AMD Socket FT6. The Snapdragon X2E-96-100 uses Qualcomm BGA 2343.

TDP: The Ryzen 3 30 has a TDP of 15 watts. The Snapdragon X2E-96-100 has no TDP recorded.

Part number: The Ryzen 3 30 lists its part number as unknown. The Snapdragon X2E-96-100 lists its part number as X2E96100.

Release date: The Ryzen 3 30 has a release date of September 30, 2025. The Snapdragon X2E-96-100 has a release date of April 5, 2026.

ECC memory: Both parts do not support ECC memory, and neither has an unlocked multiplier. Both are classified as mobile market segments and are currently in active production.