AMD Ryzen 3 30 vs AMD Ryzen Embedded 9700X Comparison

AMD
AMD

AMD Ryzen 3 30

CORE STATE Mendocino
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.4 Base / 4.1 GHz Turbo
CACHE 4 MB (shared)
MAX TDP 15W
ARCHITECTURE Zen 2
nm
PROCESS 6 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen Embedded 9700X

CORE STATE Granite Ridge
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.8 Base / 5.5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 65W
ARCHITECTURE Granite Ridge
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

passmark_data_compression
135,834
N/A
passmark_data_encryption
6,461
N/A
passmark_extended_instructions
6,075
N/A
passmark_find_prime_numbers
20
N/A
passmark_floating_point_math
14,448
N/A
passmark_integer_math
29,846
N/A
passmark_multithread
9,027
N/A
passmark_physics
436
N/A
passmark_random_string_sorting
14,431
N/A
passmark_single_thread
2,465
N/A
passmark_singlethread
2,465
N/A

Analysis: AMD Ryzen 3 30 vs AMD Ryzen Embedded 9700X

The Verdict

The database shows two completely different AMD processors that happen to share a similar naming convention. The AMD Ryzen 3 30 is a mobile-first, low-power chip built on the older Zen 2 architecture, while the AMD Ryzen Embedded 9700X is a desktop-class embedded processor using the latest Zen 5 design. The recorded data indicates these chips target entirely different workloads and system designs.

For users seeking a compact, power-efficient mobile solution, the Ryzen 3 30 delivers a measured average benchmark score of 20,137, placing it at the 74th percentile among all CPUs in the database. Its nearest rivals include the Intel Core Ultra 7 165U at 20,249 (0.6% slower in the comparison direction), the Intel Core i7-9700K at 20,271 (0.7% slower), the AMD EPYC 7713P at 20,024 (0.6% faster), and the Intel Core i7-11800H at 19,998 (0.7% faster). These tightly clustered scores place the Ryzen 3 30 squarely in the middle of a competitive pack of mainstream and mobile processors.

The Ryzen Embedded 9700X, by contrast, has no recorded benchmark scores in the database and sits at the 50th percentile with an average score of zero. Its specifications, however, tell a clear story: 8 cores, 16 threads, a 3.80 GHz base clock, a 5.50 GHz boost clock, and a 65-watt TDP. This is a high-throughput, multi-threaded workhorse designed for embedded systems that need substantial compute density. The data suggests the 9700X would likely dominate in multi-threaded workloads, but without benchmark scores in the database, direct performance comparisons cannot be quantified.

The verdict from the data is straightforward: the Ryzen 3 30 is for portable, low-power devices where battery life and thermal constraints matter more than raw throughput. The Ryzen Embedded 9700X is for stationary embedded platforms that require maximum processing capability, ECC memory support, and PCIe Gen 5 connectivity. Each chip fits its intended market segment, and the specification gap between them reflects fundamentally different design philosophies.

Architecture Differences

The architectural divide between these two processors is substantial. The Ryzen 3 30 uses the Zen 2 architecture with the Mendocino codename, manufactured on a 6 nm process node at TSMC with a die size of 100 mm². The Ryzen Embedded 9700X employs the Zen 5 architecture under the Granite Ridge codename, built on a 4 nm process node at the same foundry, with a die size of 70.6 mm² and 8,315 million transistors. The newer process node and smaller die size for the 9700X indicate a significantly denser and more advanced transistor layout.

Cache hierarchies differ markedly between the two. The Ryzen 3 30 provides 64 KB of L1 cache per core, 512 KB of L2 cache per core, and 4 MB of shared L3 cache. The Ryzen Embedded 9700X increases each level: 80 KB of L1 per core, 1 MB of L2 per core, and 32 MB of shared L3 cache. That eightfold increase in L3 capacity gives the 9700X a substantial advantage for workloads that benefit from large working sets residing on-chip.

Core and thread counts further separate the designs. The Ryzen 3 30 has 4 cores and 8 threads, while the 9700X doubles both to 8 cores and 16 threads. Clock speeds also show a wide gap: the Ryzen 3 30 runs at 2.40 GHz base and 4.10 GHz boost, whereas the 9700X operates at 3.80 GHz base and 5.50 GHz boost. The 9700X's boost clock is 1.40 GHz higher, which translates to significantly faster single-thread execution potential.

Memory and I/O capabilities reinforce the performance-class difference. The Ryzen 3 30 supports LPDDR5 memory over a dual-channel bus with 88.0 GB/s of bandwidth and lacks ECC support. The 9700X uses DDR5, also dual-channel, with 89.6 GB/s of bandwidth and full ECC memory support. PCIe connectivity differs as well: the Ryzen 3 30 offers Gen 3 with 4 CPU lanes, while the 9700X provides Gen 5 with 24 CPU lanes, a sixfold increase in lane count and two generations of bandwidth improvement.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen Embedded 9700X has 8 cores and 16 threads, double the 4 cores and 8 threads of the AMD Ryzen 3 30.

Q: How do the boost clocks compare between the two?

A: The Ryzen Embedded 9700X boosts to 5.50 GHz, which is 1.40 GHz higher than the Ryzen 3 30's 4.10 GHz boost clock.

Q: Does either processor support ECC memory?

A: Only the Ryzen Embedded 9700X supports ECC memory. The Ryzen 3 30 does not offer ECC support and uses LPDDR5, while the 9700X uses DDR5.

Q: What is the difference in L3 cache capacity?

A: The Ryzen Embedded 9700X has 32 MB of shared L3 cache, which is eight times the 4 MB shared L3 cache of the Ryzen 3 30.

Q: Which processor uses a smaller manufacturing process?

A: The Ryzen Embedded 9700X is manufactured on a 4 nm process at TSMC, while the Ryzen 3 30 uses a 6 nm process at the same foundry.

Q: What are the PCIe capabilities of each chip?

A: The Ryzen Embedded 9700X provides PCIe Gen 5 with 24 CPU lanes, whereas the Ryzen 3 30 offers PCIe Gen 3 with only 4 CPU lanes.

Specification Differences

| Specification | AMD Ryzen 3 30 | AMD Ryzen Embedded 9700X |

|---|---|---|

| Series | None | 9000 series |

| Cores | 4 | 8 |

| Threads | 8 | 16 |

| Base Clock | 2.40 GHz | 3.80 GHz |

| Boost Clock | 4.10 GHz | 5.50 GHz |

| TDP | 15 W | 65 W |

| Socket | AMD Socket FT6 | AMD Socket AM5 |

| Architecture | Zen 2 | Zen 5 |

| Codename | Mendocino | Granite Ridge |

| Process Node | 6 nm | 4 nm |

| Transistors | Not recorded | 8,315 million |

| Die Size | 100 mm² | 70.6 mm² |

| L1 Cache | 64 KB (per core) | 80 KB (per core) |

| L2 Cache | 512 KB (per core) | 1 MB (per core) |

| L3 Cache | 4 MB (shared) | 32 MB (shared) |

| Memory Support | LPDDR5 | DDR5 |

| Memory Bandwidth | 88.0 GB/s | 89.6 GB/s |

| ECC Memory | False | True |

| PCIe | Gen 3, 4 Lanes (CPU only) | Gen 5, 24 Lanes (CPU only) |

| Integrated Graphics | Radeon 610M | Radeon Graphics |

| Market Segment | Mobile | Desktop |

| Multiplier Unlocked | False | True |

| Part Number | Unknown | 100-000001404E |

| Release Date | 2025-09-30 | 2025-10-06 |

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark results between the AMD Ryzen 3 30 and the AMD Ryzen Embedded 9700X. The Ryzen 3 30 has a full set of PassMark benchmark scores, while the 9700X has no recorded benchmark entries. This absence of comparative data means all performance analysis must rely on the specification differences and the Ryzen 3 30's position relative to its nearest rivals.

For the Ryzen 3 30, the individual PassMark scores reveal its single-thread and multi-thread capabilities. It scores 2,465 in both passmark_single_thread and passmark_singlethread tests, 9,027 in passmark_multithread, 14,448 in floating point math, 29,846 in integer math, 135,834 in data compression, 6,461 in data encryption, 6,075 in extended instructions, 20 in find prime numbers, 436 in physics, and 14,431 in random string sorting. The average benchmark score of 20,137 places it at the 74th percentile overall.

The nearest rival comparisons show tight competition. The Intel Core Ultra 7 165U scores 20,249, which is 0.6% higher than the Ryzen 3 30's average. The Intel Core i7-9700K scores 20,271, also 0.7% higher. On the other side, the AMD EPYC 7713P scores 20,024, which is 0.6% lower, and the Intel Core i7-11800H scores 19,998, 0.7% lower. These deltas are small enough that the Ryzen 3 30 sits in a performance band where real-world differences would be marginal.

The Ryzen Embedded 9700X, lacking any benchmark scores, cannot be positioned against the Ryzen 3 30 or any other processor in the database. Its specification sheet, however, suggests a massive performance advantage in nearly every dimension: double the cores, double the threads, higher clocks at both base and boost, more cache at every level, and a newer architecture. The 9700X's 5.50 GHz boost clock alone would likely give it a significant single-thread edge over the Ryzen 3 30's 4.10 GHz, and the 8-core/16-thread configuration with 32 MB of L3 cache points to strong multi-thread performance.

Where Each One Wins

The AMD Ryzen 3 30 wins in scenarios that prioritize power efficiency and portability. Its 15-watt TDP is a fraction of the 9700X's 65-watt TDP, making it suitable for thin-and-light mobile devices where thermal dissipation is limited. The LPDDR5 memory support aligns with low-power system design, and the compact Socket FT6 form factor enables small motherboard layouts. Its integrated Radeon 610M graphics provide basic display output without a discrete GPU, which is typical for mobile workloads like web browsing, document editing, and media consumption. The measured benchmark scores show it competes closely with mainstream desktop and mobile processors from Intel, with deltas of less than 1% against the Core Ultra 7 165U, Core i7-9700K, EPYC 7713P, and Core i7-11800H.

The AMD Ryzen Embedded 9700X wins in scenarios that demand raw processing power and system resilience. Its 8 cores and 16 threads, combined with a 5.50 GHz boost clock, position it for compute-intensive embedded applications such as industrial automation, network infrastructure, and edge servers. The ECC memory support is critical for environments where data integrity is non-negotiable, and the 24 PCIe Gen 5 lanes allow high-bandwidth connectivity for storage arrays, accelerators, and network interfaces. The unlocked multiplier offers tuning flexibility for system integrators who need to optimize performance for specific embedded workloads. The 32 MB of L3 cache reduces memory latency for frequently accessed data, and the 4 nm process node with 8,315 million transistors in a 70.6 mm² die indicates a highly efficient design despite the higher TDP.

The data implies a clear separation of use cases. The Ryzen 3 30 serves the mobile market segment, as recorded in its specifications, with performance that rivals mid-range desktop processors from the last several generations. The Ryzen Embedded 9700X serves the desktop embedded segment, where the absence of recorded benchmarks does not diminish its specification-level superiority in core count, clock speed, cache capacity, memory support, and I/O bandwidth. Users who need a small, low-power processor for a portable device should look to the Ryzen 3 30. Users who need a high-throughput embedded processor with enterprise-grade reliability features should look to the Ryzen Embedded 9700X.

DETAILED SPECIFICATIONS

SPECIFICATION
3 30
Embedded 9700X
Core Specs
Cores
4
8 +100.0%
Threads
8
16 +100.0%
Base Clock (GHz)
2.4
3.8 +58.3%
Boost Clock (GHz)
4.1
5.5 +34.1%
Frequency (GHz)
2.4
3.8 +58.3%
Turbo Clock (GHz)
4.1
5.5 +34.1%
Multiplier
24
38 +58.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
4 MB (shared)
32 MB (shared)
Power
TDP (W)
15
65 +333.3%
PPT
—
88 W
Architecture
Architecture
Zen 2
—
Codename
Mendocino
Granite Ridge
Generation
Ryzen 3 (Zen 2 (Mendocino))
Ryzen Embedded (Zen 5 (Granite Ridge))
Process Size
6 nm
4 nm
Transistors
—
8,315 million
Die Size
100 mm²
70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
LPDDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
88.0 GB/s
89.6 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FT6
AMD Socket AM5
Chipsets
—
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620, X600¹
PCIe
Gen 3, 4 Lanes(CPU only)
Gen 5, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
Radeon 610M
Radeon Graphics
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
unknown
100-000001404E
Package
FT6
FC-LGA1718
Tj Max
95°C
95°C
Bundled Cooler
—
None
View Ryzen 3 30 Details View Ryzen Embedded 9700X Details