CPU Comparison

AMD
AMD

AMD EPYC Embedded 8224P

CORE STATE Siena
CORE SPECS 24 Cores / 48 Threads
CLOCK SPEED 2.55 Base / 3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 160W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
Intel
INTEL

Xeon Phi 7210

CORE STATE Knights Landing
CORE SPECS 64 Cores / 256 Threads
CLOCK SPEED 1300 Base / 1500 GHz Turbo
CACHE
MAX TDP 215W
ARCHITECTURE Knights Landing
nm
PROCESS 14 nm
LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,187
625
cinebench_cinebench_r15_singlecore
590
88
cinebench_cinebench_r20_multicore
17,447
2,608
cinebench_cinebench_r20_singlecore
2,462
367
cinebench_cinebench_r23_multicore
41,542
6,210
cinebench_cinebench_r23_singlecore
5,864
876
passmark_data_compression
681,754
332,960
passmark_data_encryption
43,619
3,455
passmark_extended_instructions
46,091
18,359
passmark_find_prime_numbers
286
10
passmark_floating_point_math
120,066
29,356
passmark_integer_math
193,256
84,874
passmark_multithread
48,873
7,306
passmark_physics
4,110
198
passmark_random_string_sorting
85,505
8,956
passmark_single_thread
2,357
460
passmark_singlethread
2,357
460

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC Embedded 8224P
Phi 7210
Core Specs
Cores
24
64 +166.7%
Threads
48
256 +433.3%
Base Clock (GHz)
2.55
1,300 +50880.4%
Boost Clock (GHz)
3
1,500 +49900.0%
Frequency (GHz)
2.55
1,300 +50880.4%
Turbo Clock (GHz)
3
1,500 +49900.0%
Multiplier
25.5
13 -49.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
32 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
Power
TDP (W)
160
215 +34.4%
Configurable TDP
155-225 W
Architecture
Architecture
Zen 4c
Knights Landing
Codename
Siena
Knights Landing
Generation
EPYC (Zen 4c (Siena))
Xeon Phi (Knights Landing)
Process Size
5 nm
14 nm
Transistors
17,750 million
8,000 million
Die Size
2x 73 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Six-channel
Memory Bandwidth
230.4 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP6
Intel Socket 3647
PCIe
Gen 5, 96 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Other
Market
Server/Workstation
Server/Workstation
Production Status
Active
Part Number
100-000001418
SR2MESR2X4
Package
FC-LGA4844
FC-LGA3647
Bundled Cooler
None
View EPYC Embedded 8224P Details View Xeon Phi 7210 Details