CPU Comparison

A

AMD

AMD

AMD EPYC Embedded 8224P

CORE STATE Siena

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.55 Base / 3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 160W

ARCHITECTURE Zen 4c

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

i

Intel

INTEL

Core Ultra 9 275HX

CORE STATE Arrow Lake-HX

CORE SPECS 24 Cores / 24 Threads

CLOCK SPEED 2.7 Base / 5.4 GHz Turbo

CACHE 36 MB (shared)

MAX TDP 55W

ARCHITECTURE Arrow Lake

nm

PROCESS 3 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,187

4,839

cinebench_cinebench_r15_singlecore

590

683

cinebench_cinebench_r20_multicore

17,447

20,163

cinebench_cinebench_r20_singlecore

2,462

2,846

cinebench_cinebench_r23_multicore

41,542

48,008

cinebench_cinebench_r23_singlecore

5,864

6,777

passmark_data_compression

681,754

618,338

passmark_data_encryption

43,619

48,016

passmark_extended_instructions

46,091

47,687

passmark_find_prime_numbers

286

457

passmark_floating_point_math

120,066

193,324

passmark_integer_math

193,256

156,314

passmark_multithread

48,873

56,415

passmark_physics

4,110

3,377

passmark_random_string_sorting

85,505

75,710

passmark_single_thread

2,357

4,727

passmark_singlethread

2,357

4,727

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC Embedded 8224P

Ultra 9 275HX

Core Specs

Cores

24

24 0.0%

Threads

48

24 -50.0%

Base Clock (GHz)

2.55

2.7 +5.9%

Boost Clock (GHz)

3

5.4 +80.0%

Frequency (GHz)

2.55

2.7 +5.9%

Turbo Clock (GHz)

3

5.4 +80.0%

Multiplier

25.5

27 +5.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

192 KB (per core)

L2 Cache

1 MB (per core)

3 MB (per core)

L3 Cache

64 MB (shared)

36 MB (shared)

Power

TDP (W)

160

55 -65.6%

PL1

—

55 W

PL2

—

160 W

Configurable TDP

155-225 W

—

Architecture

Architecture

Zen 4c

Arrow Lake

Codename

Siena

Arrow Lake-HX

Generation

EPYC (Zen 4c (Siena))

Ultra 9 (Arrow Lake-HX)

Process Size

5 nm

3 nm

Transistors

17,750 million

17,800 million

Die Size

2x 73 mm²

243 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5

Memory Bus

Six-channel

Dual-channel

Memory Bandwidth

230.4 GB/s

102.4 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket SP6

Intel BGA 2114

Chipsets

—

WM880, HM870

PCIe

Gen 5, 96 Lanes(CPU only)

Gen 5, 20 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

P-Cores: 8 E-Cores: 16

E-Core Frequency

—

2.1 GHz up to 4.6 GHz

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 13 TOPS

Graphics

Integrated Graphics

—

Arc Xe-LPG Graphics 64EU

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Part Number

100-000001418

SRVFK

Package

FC-LGA4844

FC-BGA

Tj Max

—

105°C

Bundled Cooler

None

—

View EPYC Embedded 8224P Details View Core Ultra 9 275HX Details