CPU Comparison
AMD
AMD EPYC Embedded 8224P
CORE STATE
Siena
CORE SPECS
24 Cores / 48 Threads
CLOCK SPEED
2.55 Base / 3 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
160W
ARCHITECTURE
Zen 4c
PROCESS
5 nm
LAUNCH DATE
2023
VS
INTEL
Core i7-11700K
CORE STATE
Rocket Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.6 Base / 5 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
125W
ARCHITECTURE
Rocket Lake
PROCESS
14 nm
LAUNCH DATE
2021
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC Embedded 8224P
i7-11700K
Core Specs
Cores
24
8
-66.7%
Threads
48
16
-66.7%
Base Clock (GHz)
2.55
3.6
+41.2%
Boost Clock (GHz)
3
5
+66.7%
Frequency (GHz)
2.55
3.6
+41.2%
Turbo Clock (GHz)
3
5
+66.7%
Multiplier
25.5
36
+41.2%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
16 MB (shared)
Power
TDP (W)
160
125
-21.9%
Configurable TDP
155-225 W
—
Architecture
Architecture
Zen 4c
Rocket Lake
Codename
Siena
Rocket Lake
Generation
EPYC
(Zen 4c (Siena))
Core i7
(Rocket Lake-S)
Process Size
5 nm
14 nm
Transistors
17,750 million
—
Die Size
2x 73 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP6
Intel Socket 1200
Chipsets
—
H510, B560, Z590, Q470, H470, W480, Z490
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
—
UHD Graphics 750
Other
Market
Server/Workstation
Desktop
Production Status
Active
End-of-life
Launch Price
—
$399
Part Number
100-000001418
SRKNL
Package
FC-LGA4844
FC-LGA14A
Tj Max
—
100°C
Bundled Cooler
None
—