CPU Comparison

AMD
AMD

AMD EPYC Embedded 8224P

CORE STATE Siena
CORE SPECS 24 Cores / 48 Threads
CLOCK SPEED 2.55 Base / 3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 160W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen 3 PRO 5355GE

CORE STATE Cezanne
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.6 Base / 4.2 GHz Turbo
CACHE 8 MB
MAX TDP 35W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,187
1,093
cinebench_cinebench_r15_singlecore
590
154
cinebench_cinebench_r20_multicore
17,447
4,555
cinebench_cinebench_r20_singlecore
2,462
643
cinebench_cinebench_r23_multicore
41,542
10,846
cinebench_cinebench_r23_singlecore
5,864
1,531
passmark_data_compression
681,754
152,885
passmark_data_encryption
43,619
9,564
passmark_extended_instructions
46,091
10,368
passmark_find_prime_numbers
286
31
passmark_floating_point_math
120,066
24,115
passmark_integer_math
193,256
44,665
passmark_multithread
48,873
12,761
passmark_physics
4,110
552
passmark_random_string_sorting
85,505
17,255
passmark_single_thread
2,357
3,089
passmark_singlethread
2,357
3,089

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC Embedded 8224P
3 PRO 5355GE
Core Specs
Cores
24
4 -83.3%
Threads
48
8 -83.3%
Base Clock (GHz)
2.55
3.6 +41.2%
Boost Clock (GHz)
3
4.2 +40.0%
Frequency (GHz)
2.55
3.6 +41.2%
Turbo Clock (GHz)
3
4.2 +40.0%
Multiplier
25.5
40 +56.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
8 MB
Power
TDP (W)
160
35 -78.1%
PPT
—
47 W
Configurable TDP
155-225 W
—
Architecture
Architecture
Zen 4c
Zen 3
Codename
Siena
Cezanne
Generation
EPYC (Zen 4c (Siena))
Ryzen 3 (Zen 3 (Cezanne))
Process Size
5 nm
7 nm
Transistors
17,750 million
10,700 million
Die Size
2x 73 mm²
180 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
51.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP6
AMD Socket AM4
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
—
Radeon Vega 6
Other
Market
Server/Workstation
Desktop
Production Status
Active
Active
Part Number
100-000001418
100-000001751
Package
FC-LGA4844
µOPGA-1331
Tj Max
—
95°C
Bundled Cooler
None
—
View EPYC Embedded 8224P Details View Ryzen 3 PRO 5355GE Details