CPU Comparison

A

AMD

AMD

AMD EPYC Embedded 3251

CORE STATE Zen

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 2.5 Base / 3.1 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen

nm

PROCESS 14 nm

LAUNCH DATE 2018

VS

i

Intel

INTEL

Core i7-8706G

CORE STATE Kaby Lake G

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.1 Base / 4.1 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 65W

ARCHITECTURE Kaby Lake

nm

PROCESS 14 nm

LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

N/A

652

cinebench_cinebench_r15_singlecore

N/A

91

cinebench_cinebench_r20_multicore

N/A

2,718

cinebench_cinebench_r20_singlecore

N/A

383

cinebench_cinebench_r23_multicore

N/A

6,472

cinebench_cinebench_r23_singlecore

N/A

913

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC Embedded 3251

i7-8706G

Core Specs

Cores

8

4 -50.0%

Threads

16

8 -50.0%

Base Clock (GHz)

2.5

3.1 +24.0%

Boost Clock (GHz)

3.1

4.1 +32.3%

Frequency (GHz)

2.5

3.1 +24.0%

Turbo Clock (GHz)

3.1

4.1 +32.3%

Multiplier

25

31 +24.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

96 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

16 MB (shared)

8 MB (shared)

Power

TDP (W)

55

65 +18.2%

Architecture

Architecture

Zen

Kaby Lake

Codename

Zen

Kaby Lake G

Generation

EPYC Embedded (Zen (Snowy Owl))

Core i7 (Kaby Lake-G)

Process Size

14 nm

14 nm

Transistors

4,800 million

—

Die Size

213 mm²

—

Foundry

GlobalFoundries

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

42.7 GB/s

—

ECC Memory

Yes

No

Platform

Socket

AMD BGA SP4r2

Intel BGA 2270

PCIe

Gen 3, 32 Lanes(CPU only)

—

Graphics

Integrated Graphics

On certain motherboards (Chipset feature)

Radeon RX Vega M GL

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Part Number

PE3251BGR88AF

—

Package

SP4r2

FC-BGA2270

Tj Max

105°C

—

Bundled Cooler

None

—

View EPYC Embedded 3251 Details View Core i7-8706G Details