CPU Comparison
AMD
AMD EPYC Embedded 2655
CORE STATE
Grado
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
2.7 Base / 4.5 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
75W
ARCHITECTURE
Zen 5
PROCESS
4 nm
LAUNCH DATE
2025
VS
INTEL
Core i7-14700HX
CORE STATE
Raptor Lake-HX
CORE SPECS
20 Cores / 28 Threads
CLOCK SPEED
2.1 Base / 5.5 GHz Turbo
CACHE
33 MB (shared)
MAX TDP
55W
ARCHITECTURE
Raptor Lake
PROCESS
10 nm
LAUNCH DATE
2024
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC Embedded 2655
i7-14700HX
Core Specs
Cores
12
20
+66.7%
Threads
24
28
+16.7%
Base Clock (GHz)
2.7
2.1
-22.2%
Boost Clock (GHz)
4.5
5.5
+22.2%
Frequency (GHz)
2.7
2.1
-22.2%
Turbo Clock (GHz)
4.5
5.5
+22.2%
Multiplier
27
21
-22.2%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
64 MB (shared)
33 MB (shared)
Power
TDP (W)
75
55
-26.7%
PL1
—
55 W
PL2
—
157 W
Architecture
Architecture
Zen 5
Raptor Lake
Codename
Grado
Raptor Lake-HX
Generation
EPYC (Zen 5 (Grado))
Core i7
(Raptor Lake-HX Refresh)
Process Size
4 nm
10 nm
Die Size
70.6 mm²
257 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
—
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
DDR5 Speed
—
5600 MT/s
Platform
Socket
AMD Socket FL1
Intel BGA 1964
Chipsets
—
WM790, HM770
PCIe
Gen 5, 28 Lanes (CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
P-Cores: 8
E-Cores: 12
E-Core Frequency
—
1500 MHz
up to 3.9 GHz
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
Radeon Graphics
UHD Graphics 770
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
100-000001911
SRMXG
Package
FC-BGA
FC-BGA16F
Tj Max
105°C
100°C
Bundled Cooler
None
—