CPU Comparison

AMD
AMD

AMD EPYC 9965

CORE STATE Turin
CORE SPECS 192 Cores / 384 Threads
CLOCK SPEED 2.25 Base / 3.7 GHz Turbo
CACHE 384 MB (shared)
MAX TDP 500W
ARCHITECTURE Zen 5
nm
PROCESS 3 nm
LAUNCH DATE 2024
VS
AMD
AMD

Ryzen 3 7335U

CORE STATE Rembrandt-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3 Base / 4.3 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 3+
nm
PROCESS 6 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
13,775
1,078
cinebench_cinebench_r15_singlecore
1,944
152
cinebench_cinebench_r20_multicore
57,397
4,495
cinebench_cinebench_r20_singlecore
8,103
634
cinebench_cinebench_r23_multicore
136,661
10,703
cinebench_cinebench_r23_singlecore
19,293
1,511
passmark_data_compression
5,427,555
146,309
passmark_data_encryption
316,606
9,335
passmark_extended_instructions
392,159
10,314
passmark_find_prime_numbers
1,249
36
passmark_floating_point_math
1,141,430
24,298
passmark_integer_math
1,806,439
42,493
passmark_multithread
160,778
12,592
passmark_physics
19,782
647
passmark_random_string_sorting
609,901
15,361
passmark_single_thread
3,210
3,053
passmark_singlethread
3,210
3,053

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 9965
3 7335U
Core Specs
Cores
192
4 -97.9%
Threads
384
8 -97.9%
Base Clock (GHz)
2.25
3 +33.3%
Boost Clock (GHz)
3.7
4.3 +16.2%
Frequency (GHz)
2.25
3 +33.3%
Turbo Clock (GHz)
3.7
4.3 +16.2%
Multiplier
22.5
30 +33.3%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
80 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
384 MB (shared)
8 MB (shared)
Power
TDP (W)
500
28 -94.4%
Configurable TDP
450-500 W
Architecture
Architecture
Zen 5
Zen 3+
Codename
Turin
Rembrandt-R
Generation
EPYC (Zen 5c (Turin))
Ryzen 3 (Zen 3+ (Rembrandt))
Process Size
3 nm
6 nm
Die Size
208 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Twelve-channel
Dual-channel
Memory Bandwidth
576.0 GB/s
76.8 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP5
AMD Socket FP7
PCIe
Gen 5, 128 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Interconnect
CXL
Gen 2.0
Graphics
Integrated Graphics
Radeon 660M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$14813
Part Number
100-000000976
100-000000537(FP7)100-000000549(FP7r2)
Package
FC-LGA6096
FP7, FP7r2
Tj Max
95°C
View EPYC 9965 Details View Ryzen 3 7335U Details