CPU Comparison
AMD
AMD EPYC 9754
CORE STATE
Bergamo
CORE SPECS
128 Cores / 256 Threads
CLOCK SPEED
2.25 Base / 3.1 GHz Turbo
CACHE
256 MB (shared)
MAX TDP
360W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
VS
INTEL
Core i7-13850HX
CORE STATE
Raptor Lake-HX
CORE SPECS
20 Cores / 28 Threads
CLOCK SPEED
2.1 Base / 5.3 GHz Turbo
CACHE
30 MB (shared)
MAX TDP
55W
ARCHITECTURE
Raptor Lake
PROCESS
10 nm
LAUNCH DATE
2023
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 9754
i7-13850HX
Core Specs
Cores
128
20
-84.4%
Threads
256
28
-89.1%
Base Clock (GHz)
2.25
2.1
-6.7%
Boost Clock (GHz)
3.1
5.3
+71.0%
Frequency (GHz)
2.25
2.1
-6.7%
Turbo Clock (GHz)
3.1
5.3
+71.0%
Multiplier
22.5
21
-6.7%
SMP CPUs
2
1
-50.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
2 MB (per core)
L3 Cache
256 MB (shared)
30 MB (shared)
Power
TDP (W)
360
55
-84.7%
PL1
—
55 W
PL2
—
157 W
Configurable TDP
320-400 W
—
Architecture
Architecture
Zen 4
Raptor Lake
Codename
Bergamo
Raptor Lake-HX
Generation
EPYC
(Zen 4c (Bergamo))
Core i7
(Raptor Lake-HX)
Process Size
5 nm
10 nm
Transistors
71,000 million
—
Die Size
8x 73 mm²
257 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4, DDR5
Memory Bus
Twelve-channel
Dual-channel
Memory Bandwidth
460.8 GB/s
—
ECC Memory
Yes
Yes
DDR4 Speed
—
3200 MT/s
DDR5 Speed
—
5600 MT/s
Platform
Socket
AMD Socket SP5
Intel BGA 1964
Chipsets
—
WM790, HM770
PCIe
Gen 5, 128 Lanes(CPU only)
Gen 5, 20 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
P-Cores: 8
E-Cores: 12
E-Core Frequency
—
1500 MHz
up to 3.8 GHz
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
—
UHD Graphics 770
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$11900
$428
Part Number
100-000001234
SRMEA
Package
FC-LGA6096
FC-BGA16F
Tj Max
—
100°C
Bundled Cooler
None
—