CPU Comparison
AMD
AMD EPYC 9734
CORE STATE
Bergamo
CORE SPECS
112 Cores / 224 Threads
CLOCK SPEED
2.2 Base / 3 GHz Turbo
CACHE
256 MB (shared)
MAX TDP
340W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
VS
INTEL
Core i7-10700K
CORE STATE
Comet Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.8 Base / 5.1 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
125W
ARCHITECTURE
Comet Lake
PROCESS
14 nm
LAUNCH DATE
2020
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 9734
i7-10700K
Core Specs
Cores
112
8
-92.9%
Threads
224
16
-92.9%
Base Clock (GHz)
2.2
3.8
+72.7%
Boost Clock (GHz)
3
5.1
+70.0%
Frequency (GHz)
2.2
3.8
+72.7%
Turbo Clock (GHz)
3
5.1
+70.0%
Multiplier
22
38
+72.7%
SMP CPUs
2
1
-50.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
256 KB (per core)
L3 Cache
256 MB (shared)
16 MB (shared)
Power
TDP (W)
340
125
-63.2%
PL1
—
125 W
PL2
—
229 W
Configurable TDP
320-400 W
—
Architecture
Architecture
Zen 4
Comet Lake
Codename
Bergamo
Comet Lake
Generation
EPYC
(Zen 4c (Bergamo))
Core i7
(Comet Lake)
Process Size
5 nm
14 nm
Transistors
71,000 million
—
Die Size
8x 73 mm²
—
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Twelve-channel
Dual-channel
Memory Bandwidth
460.8 GB/s
46.9 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP5
Intel Socket 1200
Chipsets
—
H410, B460, H470, Z490
PCIe
Gen 5, 128 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
—
UHD Graphics 630
Other
Market
Server/Workstation
Desktop
Production Status
Active
Active
Launch Price
$9600
—
Part Number
100-000001235
SRH72
Package
FC-LGA6096
FC-LGA1200
Tj Max
—
100°C
Bundled Cooler
None
—