CPU Comparison

A

AMD

AMD

AMD EPYC 9734

CORE STATE Bergamo

CORE SPECS 112 Cores / 224 Threads

CLOCK SPEED 2.2 Base / 3 GHz Turbo

CACHE 256 MB (shared)

MAX TDP 340W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

8,763

4,558

cinebench_cinebench_r15_singlecore

1,237

643

cinebench_cinebench_r20_multicore

36,516

18,995

cinebench_cinebench_r20_singlecore

5,155

2,681

cinebench_cinebench_r23_multicore

86,943

45,228

cinebench_cinebench_r23_singlecore

12,274

6,385

passmark_data_compression

2,900,008

656,891

passmark_data_encryption

179,390

34,086

passmark_extended_instructions

205,925

52,958

passmark_find_prime_numbers

829

298

passmark_floating_point_math

549,045

123,833

passmark_integer_math

823,150

195,223

passmark_multithread

102,286

53,137

passmark_physics

6,747

3,448

passmark_random_string_sorting

357,638

72,894

passmark_single_thread

2,310

4,123

passmark_singlethread

2,310

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 9734

AI Max+ 395

Core Specs

Cores

112

16 -85.7%

Threads

224

32 -85.7%

Base Clock (GHz)

2.2

3 +36.4%

Boost Clock (GHz)

3

5.1 +70.0%

Frequency (GHz)

2.2

3 +36.4%

Turbo Clock (GHz)

3

5.1 +70.0%

Multiplier

22

30 +36.4%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

256 MB (shared)

64 MB (shared)

Power

TDP (W)

340

55 -83.8%

Configurable TDP

320-400 W

45-120 W

Architecture

Architecture

Zen 4

Zen 5

Codename

Bergamo

Strix Halo

Generation

EPYC (Zen 4c (Bergamo))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

71,000 million

—

Die Size

8x 73 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Twelve-channel

Quad-channel

Memory Bandwidth

460.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP5

AMD Socket FP11

PCIe

Gen 5, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$9600

—

Part Number

100-000001235

100-000001099

Package

FC-LGA6096

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

View EPYC 9734 Details View Ryzen AI Max+ 395 Details