CPU Comparison
AMD
AMD EPYC 9135
CORE STATE
Turin
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
3.65 Base / 4.3 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
200W
ARCHITECTURE
Zen 5
PROCESS
4 nm
LAUNCH DATE
2024
VS
INTEL
Core i9-10900K
CORE STATE
Comet Lake
CORE SPECS
10 Cores / 20 Threads
CLOCK SPEED
3.7 Base / 5.3 GHz Turbo
CACHE
20 MB (shared)
MAX TDP
125W
ARCHITECTURE
Comet Lake
PROCESS
14 nm
LAUNCH DATE
2020
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 9135
i9-10900K
Core Specs
Cores
16
10
-37.5%
Threads
32
20
-37.5%
Base Clock (GHz)
3.65
3.7
+1.4%
Boost Clock (GHz)
4.3
5.3
+23.3%
Frequency (GHz)
3.65
3.7
+1.4%
Turbo Clock (GHz)
4.3
5.3
+23.3%
Multiplier
36.5
37
+1.4%
SMP CPUs
2
1
-50.0%
Cache
L1 Cache
80 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
256 KB (per core)
L3 Cache
64 MB (shared)
20 MB (shared)
Power
TDP (W)
200
125
-37.5%
PL1
—
125 W
PL2
—
250 W
Configurable TDP
200-240 W
—
Architecture
Architecture
Zen 5
Comet Lake
Codename
Turin
Comet Lake
Generation
EPYC
(Zen 5 (Turin))
Core i9
(Comet Lake)
Process Size
4 nm
14 nm
Transistors
16,630 million
—
Die Size
2x 70.6 mm²
206 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Twelve-channel
Dual-channel
Memory Bandwidth
576.0 GB/s
46.9 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP5
Intel Socket 1200
Chipsets
—
H410, B460, H470, Z490
PCIe
Gen 5, 128 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Interconnect
CXL
Gen 2.0
—
Graphics
Integrated Graphics
—
UHD Graphics 630
Other
Market
Server/Workstation
Desktop
Production Status
Active
End-of-life
Launch Price
$1214
$547
Part Number
100-000001150
SRH91
Package
FC-LGA6096
FC-LGA1200
Tj Max
—
100°C