CPU Comparison
AMD
AMD EPYC 9135
CORE STATE
Turin
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
3.65 Base / 4.3 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
200W
ARCHITECTURE
Zen 5
PROCESS
4 nm
LAUNCH DATE
2024
VS
AMD
Ryzen 9 7945HX3D
CORE STATE
Dragon Range
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
2.3 Base / 5.4 GHz Turbo
CACHE
128 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 9135
9 7945HX3D
Core Specs
Cores
16
16
0.0%
Threads
32
32
0.0%
Base Clock (GHz)
3.65
2.3
-37.0%
Boost Clock (GHz)
4.3
5.4
+25.6%
Frequency (GHz)
3.65
2.3
-37.0%
Turbo Clock (GHz)
4.3
5.4
+25.6%
Multiplier
36.5
23
-37.0%
SMP CPUs
2
1
-50.0%
Cache
L1 Cache
80 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
64 MB (shared)
128 MB (shared)
3D V-Cache
โ
1x 64MB Slice
Power
TDP (W)
200
55
-72.5%
PPT
โ
55-75 W
Configurable TDP
200-240 W
โ
Architecture
Architecture
Zen 5
Zen 4
Codename
Turin
Dragon Range
Generation
EPYC
(Zen 5 (Turin))
Ryzen 9
(Zen 4 (Dragon Range))
Process Size
4 nm
5 nm
Transistors
16,630 million
17,840 million
Die Size
2x 70.6 mmยฒ
2x 71 mmยฒ
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Twelve-channel
Dual-channel
Memory Bandwidth
576.0 GB/s
83.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP5
AMD Socket FL1
PCIe
Gen 5, 128 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
6 nm
Interconnect
CXL
Gen 2.0
โ
Graphics
Integrated Graphics
โ
Radeon 610M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$1214
โ
Part Number
100-000001150
100-000001086
Package
FC-LGA6096
ยตFC-BGAFL1
Tj Max
โ
100ยฐC