CPU Comparison

A

AMD

AMD

AMD EPYC 8124P

CORE STATE Siena

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.45 Base / 3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 125W

ARCHITECTURE Zen 4c

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max 385

CORE STATE Strix Halo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

3,085

1,579

cinebench_cinebench_r15_singlecore

435

222

cinebench_cinebench_r20_multicore

12,856

6,583

cinebench_cinebench_r20_singlecore

1,814

929

cinebench_cinebench_r23_multicore

30,611

15,674

cinebench_cinebench_r23_singlecore

4,321

2,212

passmark_data_compression

468,411

224,838

passmark_data_encryption

30,743

10,491

passmark_extended_instructions

29,666

19,254

passmark_find_prime_numbers

222

100

passmark_floating_point_math

72,395

37,490

passmark_integer_math

123,513

54,901

passmark_multithread

36,014

18,441

passmark_physics

3,356

1,429

passmark_random_string_sorting

64,067

23,526

passmark_single_thread

2,271

2,056

passmark_singlethread

2,271

2,056

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 8124P

AI Max 385

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.45

3.6 +46.9%

Boost Clock (GHz)

3

5 +66.7%

Frequency (GHz)

2.45

3.6 +46.9%

Turbo Clock (GHz)

3

5 +66.7%

Multiplier

24.5

36 +46.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

32 MB (shared)

Power

TDP (W)

125

55 -56.0%

Configurable TDP

120-150 W

45-120 W

Architecture

Architecture

Zen 4c

Zen 5

Codename

Siena

Strix Halo

Generation

EPYC (Zen 4c (Siena))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

17,750 million

—

Die Size

2x 73 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Six-channel

Quad-channel

Memory Bandwidth

230.4 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP6

AMD Socket FP11

PCIe

Gen 5, 96 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$639

—

Part Number

100-000001135

100-000001424

Package

FC-LGA4844

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

View EPYC 8124P Details View Ryzen AI Max 385 Details