CPU Comparison

AMD
AMD

AMD EPYC 8124P

CORE STATE Siena
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.45 Base / 3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 125W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen 9 8940HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.4 Base / 5.3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,085
4,584
cinebench_cinebench_r15_singlecore
435
647
cinebench_cinebench_r20_multicore
12,856
19,104
cinebench_cinebench_r20_singlecore
1,814
2,696
cinebench_cinebench_r23_multicore
30,611
45,488
cinebench_cinebench_r23_singlecore
4,321
6,421
passmark_data_compression
468,411
738,673
passmark_data_encryption
30,743
44,430
passmark_extended_instructions
29,666
54,674
passmark_find_prime_numbers
222
272
passmark_floating_point_math
72,395
125,981
passmark_integer_math
123,513
205,945
passmark_multithread
36,014
54,675
passmark_physics
3,356
2,115
passmark_random_string_sorting
64,067
85,869
passmark_single_thread
2,271
4,033
passmark_singlethread
2,271
4,033

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 8124P
9 8940HX
Core Specs
Cores
16
16 0.0%
Threads
32
32 0.0%
Base Clock (GHz)
2.45
2.4 -2.0%
Boost Clock (GHz)
3
5.3 +76.7%
Frequency (GHz)
2.45
2.4 -2.0%
Turbo Clock (GHz)
3
5.3 +76.7%
Multiplier
24.5
24 -2.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
64 MB (shared)
64 MB (shared)
Power
TDP (W)
125
55 -56.0%
Configurable TDP
120-150 W
45-75 W
Architecture
Architecture
Zen 4c
Zen 4
Codename
Siena
Dragon Range
Generation
EPYC (Zen 4c (Siena))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
5 nm
5 nm
Transistors
17,750 million
13,140 million
Die Size
2x 73 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
83.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP6
AMD Socket FL1
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
6 nm
Graphics
Integrated Graphics
—
Radeon 610M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$639
—
Part Number
100-000001135
100-000001849
Package
FC-LGA4844
µFC-BGAFL1
Tj Max
—
100°C
Bundled Cooler
None
—
View EPYC 8124P Details View Ryzen 9 8940HX Details