CPU Comparison

A

AMD

AMD

AMD EPYC 8024P

CORE STATE Siena

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 2.4 Base / 3 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 90W

ARCHITECTURE Zen 4c

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,761

2,865

cinebench_cinebench_r15_singlecore

248

404

cinebench_cinebench_r20_multicore

7,338

11,938

cinebench_cinebench_r20_singlecore

1,035

1,685

cinebench_cinebench_r23_multicore

17,472

28,424

cinebench_cinebench_r23_singlecore

2,466

4,012

passmark_data_compression

232,242

399,839

passmark_data_encryption

15,809

19,947

passmark_extended_instructions

14,251

33,915

passmark_find_prime_numbers

109

169

passmark_floating_point_math

34,757

72,648

passmark_integer_math

62,128

108,717

passmark_multithread

20,556

33,441

passmark_physics

1,905

1,772

passmark_random_string_sorting

34,613

41,537

passmark_single_thread

2,371

4,052

passmark_singlethread

2,371

4,052

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 8024P

AI Max PRO 385

Core Specs

Cores

8

8 0.0%

Threads

16

16 0.0%

Base Clock (GHz)

2.4

3.6 +50.0%

Boost Clock (GHz)

3

5 +66.7%

Frequency (GHz)

2.4

3.6 +50.0%

Turbo Clock (GHz)

3

5 +66.7%

Multiplier

24

36 +50.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

32 MB (shared)

32 MB (shared)

Power

TDP (W)

90

55 -38.9%

Configurable TDP

70-100 W

45-120 W

Architecture

Architecture

Zen 4c

Zen 5

Codename

Siena

Strix Halo

Generation

EPYC (Zen 4c (Siena))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

8,875 million

—

Die Size

73 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Six-channel

Quad-channel

Memory Bandwidth

230.4 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP6

AMD Socket FP11

PCIe

Gen 5, 96 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$409

—

Part Number

100-000001136

100-000001422

Package

FC-LGA4844

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

View EPYC 8024P Details View Ryzen AI Max PRO 385 Details