CPU Comparison

AMD
AMD

AMD EPYC 7F72

CORE STATE Rome
CORE SPECS 24 Cores / 48 Threads
CLOCK SPEED 3.2 Base / 3.7 GHz Turbo
CACHE 192 MB (shared)
MAX TDP 240W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2020
VS
AMD
AMD

Ryzen 9 8945HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,518
4,305
cinebench_cinebench_r15_singlecore
637
607
cinebench_cinebench_r20_multicore
18,828
17,939
cinebench_cinebench_r20_singlecore
2,657
2,532
cinebench_cinebench_r23_multicore
44,829
42,713
cinebench_cinebench_r23_singlecore
6,328
6,030
passmark_data_compression
808,795
646,896
passmark_data_encryption
56,261
39,600
passmark_extended_instructions
46,936
47,600
passmark_find_prime_numbers
498
267
passmark_floating_point_math
108,437
118,280
passmark_integer_math
181,103
198,352
passmark_multithread
52,740
50,251
passmark_physics
6,459
2,027
passmark_random_string_sorting
102,436
74,420
passmark_single_thread
2,384
3,963
passmark_singlethread
2,384
3,963

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7F72
9 8945HX
Core Specs
Cores
24
16 -33.3%
Threads
48
32 -33.3%
Base Clock (GHz)
3.2
2.5 -21.9%
Boost Clock (GHz)
3.7
5.4 +45.9%
Frequency (GHz)
3.2
2.5 -21.9%
Turbo Clock (GHz)
3.7
5.4 +45.9%
Multiplier
32
24 -25.0%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
192 MB (shared)
64 MB (shared)
Power
TDP (W)
240
55 -77.1%
Configurable TDP
—
45-75 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Rome
Dragon Range
Generation
EPYC (Zen 2 (Rome))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
3,800 million
13,140 million
Die Size
74 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
83.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP3
AMD Socket FL1
PCIe
Gen 4
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
—
Radeon 610M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
100-000000141100-000000141WOF
100-000001848
Package
FCLGA-4094
µFC-BGAFL1
Tj Max
—
100°C
View EPYC 7F72 Details View Ryzen 9 8945HX Details