CPU Comparison
AMD
AMD EPYC 7773X
CORE STATE
Milan-X
CORE SPECS
64 Cores / 128 Threads
CLOCK SPEED
2.2 Base / 3.5 GHz Turbo
CACHE
768 MB (shared)
MAX TDP
280W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2022
VS
INTEL
Core i7-12650HX
CORE STATE
Alder Lake-HX
CORE SPECS
14 Cores / 20 Threads
CLOCK SPEED
2000 Base / 4.7 GHz Turbo
CACHE
24 MB (shared)
MAX TDP
55W
ARCHITECTURE
Alder Lake
PROCESS
10 nm
LAUNCH DATE
2022
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 7773X
i7-12650HX
Core Specs
Cores
64
14
-78.1%
Threads
128
20
-84.4%
Base Clock (GHz)
2.2
2,000
+90809.1%
Boost Clock (GHz)
3.5
4.7
+34.3%
Frequency (GHz)
2.2
2,000
+90809.1%
Turbo Clock (GHz)
3.5
4.7
+34.3%
Multiplier
22
20
-9.1%
SMP CPUs
2
1
-50.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1.25 MB (per core)
L3 Cache
768 MB (shared)
24 MB (shared)
Power
TDP (W)
280
55
-80.4%
PL1
—
55 W
PL2
—
157 W
Configurable TDP
225W
—
Architecture
Architecture
Zen 3
Alder Lake
Codename
Milan-X
Alder Lake-HX
Generation
EPYC
(Zen 3 (Milan))
Core i7
(Alder Lake-HX)
Process Size
7 nm
10 nm
Transistors
33,200 million
—
Die Size
8x 81 mm²
215 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4, DDR5
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
—
ECC Memory
Yes
No
DDR4 Speed
—
3200 MT/s
DDR5 Speed
—
4800 MT/s
Platform
Socket
AMD Socket SP3
Intel BGA 1964
Chipsets
—
HM670, WM690
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 5, 20 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
P-Cores: 6
E-Cores: 8
E-Core Frequency
—
1500 MHz
up to 3.3 GHz
AMD Multi-Die
CCDs
8
—
Cores per CCD
8
—
IO Process Size
12 nm
—
Graphics
Integrated Graphics
—
UHD Graphics 770
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$8800
—
Part Number
100-000000504WOF100-000000504
—
Package
FCLGA-4094
FC-BGA16F
Tj Max
—
100°C