CPU Comparison

AMD
AMD

AMD EPYC 7702

CORE STATE Rome
CORE SPECS 64 Cores / 128 Threads
CLOCK SPEED 2000 Base / 3.35 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 200W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
AMD
AMD

Ryzen 9 8940HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.4 Base / 5.3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
5,900
4,584
cinebench_cinebench_r15_singlecore
832
647
cinebench_cinebench_r20_multicore
24,586
19,104
cinebench_cinebench_r20_singlecore
3,470
2,696
cinebench_cinebench_r23_multicore
58,539
45,488
cinebench_cinebench_r23_singlecore
8,264
6,421
passmark_data_compression
N/A
738,673
passmark_data_encryption
N/A
44,430
passmark_extended_instructions
N/A
54,674
passmark_find_prime_numbers
N/A
272
passmark_floating_point_math
N/A
125,981
passmark_integer_math
N/A
205,945
passmark_multithread
N/A
54,675
passmark_physics
N/A
2,115
passmark_random_string_sorting
N/A
85,869
passmark_single_thread
N/A
4,033
passmark_singlethread
N/A
4,033

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7702
9 8940HX
Core Specs
Cores
64
16 -75.0%
Threads
128
32 -75.0%
Base Clock (GHz)
2,000
2.4 -99.9%
Boost Clock (GHz)
3.35
5.3 +58.2%
Frequency (GHz)
2,000
2.4 -99.9%
Turbo Clock (GHz)
3.35
5.3 +58.2%
Multiplier
20
24 +20.0%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
256 MB (shared)
64 MB (shared)
Power
TDP (W)
200
55 -72.5%
Configurable TDP
—
45-75 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Rome
Dragon Range
Generation
EPYC (Zen 2 (Rome))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
3,800 million
13,140 million
Die Size
74 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
83.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP3
AMD Socket FL1
PCIe
Gen 4
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
—
Radeon 610M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
100-000000038
100-000001849
Package
FCLGA-4094
µFC-BGAFL1
Tj Max
—
100°C
View EPYC 7702 Details View Ryzen 9 8940HX Details