CPU Comparison

AMD
AMD

AMD EPYC 7663

CORE STATE Milan
CORE SPECS 56 Cores / 112 Threads
CLOCK SPEED 2000 Base / 3.5 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 240W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2021
VS
Intel
INTEL

Core i9-13900HK

CORE STATE Raptor Lake-H
CORE SPECS 14 Cores / 20 Threads
CLOCK SPEED 2.6 Base / 5.4 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 45W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
7,032
2,412
cinebench_cinebench_r15_singlecore
992
340
cinebench_cinebench_r20_multicore
29,304
10,050
cinebench_cinebench_r20_singlecore
4,137
1,418
cinebench_cinebench_r23_multicore
69,773
23,929
cinebench_cinebench_r23_singlecore
9,850
3,378
passmark_data_compression
1,447,020
329,454
passmark_data_encryption
111,725
19,198
passmark_extended_instructions
73,719
19,534
passmark_find_prime_numbers
676
110
passmark_floating_point_math
251,535
68,020
passmark_integer_math
468,096
94,120
passmark_multithread
82,087
28,194
passmark_physics
8,020
1,896
passmark_random_string_sorting
184,367
36,662
passmark_single_thread
2,606
3,810
passmark_singlethread
2,606
3,810

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7663
i9-13900HK
Core Specs
Cores
56
14 -75.0%
Threads
112
20 -82.1%
Base Clock (GHz)
2,000
2.6 -99.9%
Boost Clock (GHz)
3.5
5.4 +54.3%
Frequency (GHz)
2,000
2.6 -99.9%
Turbo Clock (GHz)
3.5
5.4 +54.3%
Multiplier
20
26 +30.0%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
256 MB (shared)
24 MB (shared)
Power
TDP (W)
240
45 -81.3%
PL1
45 W
PL2
115 W
Configurable TDP
225 W
Architecture
Architecture
Zen 3
Raptor Lake
Codename
Milan
Raptor Lake-H
Generation
EPYC (Zen 3 (Milan))
Core i9 (Raptor Lake-H)
Process Size
7 nm
10 nm
Transistors
33,200 million
Die Size
8x 81 mm²
257 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4, DDR5
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
DDR5 Speed
5200 MT/s
Platform
Socket
AMD Socket SP3
Intel BGA 1744
Chipsets
WM790, HM770
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 5, 8 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 8
E-Core Frequency
1900 MHz up to 4.1 GHz
AMD Multi-Die
CCDs
8
Cores per CCD
7
IO Process Size
12 nm
Graphics
Integrated Graphics
Iris Xe Graphics 96EU
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$6366
$697
Part Number
100-000000318100-100000318WOF
SRMJ3
Package
FCLGA-4094
FC-BGA16F
Tj Max
100°C
View EPYC 7663 Details View Core i9-13900HK Details