CPU Comparison

AMD
AMD

AMD EPYC 7642

CORE STATE Rome
CORE SPECS 48 Cores / 96 Threads
CLOCK SPEED 2.4 Base / 3.4 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 225W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
AMD
AMD

Ryzen 9 8945HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
5,037
4,305
cinebench_cinebench_r15_singlecore
711
607
cinebench_cinebench_r20_multicore
20,989
17,939
cinebench_cinebench_r20_singlecore
2,963
2,532
cinebench_cinebench_r23_multicore
49,975
42,713
cinebench_cinebench_r23_singlecore
7,055
6,030
passmark_data_compression
1,195,584
646,896
passmark_data_encryption
86,397
39,600
passmark_extended_instructions
68,841
47,600
passmark_find_prime_numbers
496
267
passmark_floating_point_math
181,887
118,280
passmark_integer_math
305,303
198,352
passmark_multithread
58,795
50,251
passmark_physics
5,098
2,027
passmark_random_string_sorting
114,871
74,420
passmark_single_thread
2,052
3,963
passmark_singlethread
2,052
3,963

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7642
9 8945HX
Core Specs
Cores
48
16 -66.7%
Threads
96
32 -66.7%
Base Clock (GHz)
2.4
2.5 +4.2%
Boost Clock (GHz)
3.4
5.4 +58.8%
Frequency (GHz)
2.4
2.5 +4.2%
Turbo Clock (GHz)
3.4
5.4 +58.8%
Multiplier
24
24 0.0%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
256 MB (shared)
64 MB (shared)
Power
TDP (W)
225
55 -75.6%
Configurable TDP
—
45-75 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Rome
Dragon Range
Generation
EPYC (Zen 2 (Rome))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
3,800 million
13,140 million
Die Size
74 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
83.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP3
AMD Socket FL1
PCIe
Gen 4
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
—
Radeon 610M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
100-000000074
100-000001848
Package
FCLGA-4094
µFC-BGAFL1
Tj Max
—
100°C
View EPYC 7642 Details View Ryzen 9 8945HX Details