CPU Comparison

AMD
AMD

AMD EPYC 7642

CORE STATE Rome
CORE SPECS 48 Cores / 96 Threads
CLOCK SPEED 2.4 Base / 3.4 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 225W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
AMD
AMD

Ryzen 5 7645HX

CORE STATE Dragon Range
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 4 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
5,037
2,268
cinebench_cinebench_r15_singlecore
711
320
cinebench_cinebench_r20_multicore
20,989
9,451
cinebench_cinebench_r20_singlecore
2,963
1,334
cinebench_cinebench_r23_multicore
49,975
22,504
cinebench_cinebench_r23_singlecore
7,055
3,177
passmark_data_compression
1,195,584
302,256
passmark_data_encryption
86,397
17,900
passmark_extended_instructions
68,841
22,969
passmark_find_prime_numbers
496
178
passmark_floating_point_math
181,887
48,798
passmark_integer_math
305,303
77,432
passmark_multithread
58,795
26,476
passmark_physics
5,098
1,497
passmark_random_string_sorting
114,871
34,434
passmark_single_thread
2,052
3,907
passmark_singlethread
2,052
3,907
geekbench_multicore
N/A
11,586
geekbench_singlecore
N/A
2,657

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7642
5 7645HX
Core Specs
Cores
48
6 -87.5%
Threads
96
12 -87.5%
Base Clock (GHz)
2.4
4 +66.7%
Boost Clock (GHz)
3.4
5 +47.1%
Frequency (GHz)
2.4
4 +66.7%
Turbo Clock (GHz)
3.4
5 +47.1%
Multiplier
24
40 +66.7%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
96 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
256 MB (shared)
32 MB (shared)
Power
TDP (W)
225
45 -80.0%
Configurable TDP
—
75 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Rome
Dragon Range
Generation
EPYC (Zen 2 (Rome))
Ryzen 5 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
3,800 million
6,570 million
Die Size
74 mm²
71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
83.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP3
AMD Socket FL1
PCIe
Gen 4
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
—
Radeon 610M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Part Number
100-000000074
100-000000872
Package
FCLGA-4094
µFC-BGAFL1
Tj Max
—
100°C
View EPYC 7642 Details View Ryzen 5 7645HX Details