CPU Comparison

AMD
AMD

AMD EPYC 7543

CORE STATE Milan
CORE SPECS 32 Cores / 64 Threads
CLOCK SPEED 2.8 Base / 3.7 GHz Turbo
CACHE 256 MB (shared)
MAX TDP 225W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2021
VS
AMD
AMD

Ryzen AI Max 385

CORE STATE Strix Halo
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
5,393
1,579
cinebench_cinebench_r15_singlecore
761
222
cinebench_cinebench_r20_multicore
22,473
6,583
cinebench_cinebench_r20_singlecore
3,172
929
cinebench_cinebench_r23_multicore
53,509
15,674
cinebench_cinebench_r23_singlecore
7,554
2,212
passmark_data_compression
N/A
224,838
passmark_data_encryption
N/A
10,491
passmark_extended_instructions
N/A
19,254
passmark_find_prime_numbers
N/A
100
passmark_floating_point_math
N/A
37,490
passmark_integer_math
N/A
54,901
passmark_multithread
N/A
18,441
passmark_physics
N/A
1,429
passmark_random_string_sorting
N/A
23,526
passmark_single_thread
N/A
2,056
passmark_singlethread
N/A
2,056

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7543
AI Max 385
Core Specs
Cores
32
8 -75.0%
Threads
64
16 -75.0%
Base Clock (GHz)
2.8
3.6 +28.6%
Boost Clock (GHz)
3.7
5 +35.1%
Frequency (GHz)
2.8
3.6 +28.6%
Turbo Clock (GHz)
3.7
5 +35.1%
Multiplier
28
36 +28.6%
SMP CPUs
2
1 -50.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
256 MB (shared)
32 MB (shared)
Power
TDP (W)
225
55 -75.6%
Configurable TDP
240 W
45-120 W
Architecture
Architecture
Zen 3
Zen 5
Codename
Milan
Strix Halo
Generation
EPYC (Zen 3 (Milan))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
7 nm
4 nm
Transistors
33,200 million
Die Size
8x 81 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
LPDDR5X
Memory Bus
Eight-channel
Quad-channel
Memory Bandwidth
204.8 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP3
AMD Socket FP11
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
CCDs
8
Cores per CCD
4
IO Process Size
12 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8050S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$3761
Part Number
100-000000345100-100000345WOF
100-000001424
Package
FCLGA-4094
FC-BGA
Tj Max
100°C
View EPYC 7543 Details View Ryzen AI Max 385 Details