CPU Comparison
AMD
AMD EPYC 74F3
CORE STATE
Milan
CORE SPECS
24 Cores / 48 Threads
CLOCK SPEED
2.8 Base / 4 GHz Turbo
CACHE
256 MB (shared)
MAX TDP
240W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2021
VS
INTEL
Core i7-11700F
CORE STATE
Rocket Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2.5 Base / 4.9 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
65W
ARCHITECTURE
Rocket Lake
PROCESS
14 nm
LAUNCH DATE
2021
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
EPYC 74F3
i7-11700F
Core Specs
Cores
24
8
-66.7%
Threads
48
16
-66.7%
Base Clock (GHz)
2.8
2.5
-10.7%
Boost Clock (GHz)
4
4.9
+22.5%
Frequency (GHz)
2.8
2.5
-10.7%
Turbo Clock (GHz)
4
4.9
+22.5%
Multiplier
28
25
-10.7%
SMP CPUs
2
1
-50.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
256 MB (shared)
16 MB (shared)
Power
TDP (W)
240
65
-72.9%
Configurable TDP
225 W
—
Architecture
Architecture
Zen 3
Rocket Lake
Codename
Milan
Rocket Lake
Generation
EPYC
(Zen 3 (Milan))
Core i7
(Rocket Lake-S)
Process Size
7 nm
14 nm
Transistors
33,200 million
—
Die Size
4x 81 mm²
276 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Eight-channel
Dual-channel
Memory Bandwidth
204.8 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP3
Intel Socket 1200
Chipsets
—
H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
CCDs
8
—
Cores per CCD
3
—
IO Process Size
12 nm
—
Other
Market
Server/Workstation
Desktop
Production Status
Active
End-of-life
Launch Price
$2900
$298
Part Number
100-000000317100-100000317WOF
SRKNR
Package
FCLGA-4094
FC-LGA14A
Tj Max
—
100°C