CPU Comparison

AMD
AMD

AMD EPYC 7313P

CORE STATE Milan
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 3 Base / 3.7 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 155W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2021
VS
AMD
AMD

Ryzen AI Max 385

CORE STATE Strix Halo
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,522
1,579
cinebench_cinebench_r15_singlecore
497
222
cinebench_cinebench_r20_multicore
14,679
6,583
cinebench_cinebench_r20_singlecore
2,072
929
cinebench_cinebench_r23_multicore
34,952
15,674
cinebench_cinebench_r23_singlecore
4,934
2,212
geekbench_multicore
10,636
N/A
geekbench_singlecore
1,558
N/A
passmark_data_compression
528,167
224,838
passmark_data_encryption
35,727
10,491
passmark_extended_instructions
32,784
19,254
passmark_find_prime_numbers
346
100
passmark_floating_point_math
82,260
37,490
passmark_integer_math
145,558
54,901
passmark_multithread
41,121
18,441
passmark_physics
4,229
1,429
passmark_random_string_sorting
62,596
23,526
passmark_single_thread
2,634
2,056
passmark_singlethread
2,634
2,056

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 7313P
AI Max 385
Core Specs
Cores
16
8 -50.0%
Threads
32
16 -50.0%
Base Clock (GHz)
3
3.6 +20.0%
Boost Clock (GHz)
3.7
5 +35.1%
Frequency (GHz)
3
3.6 +20.0%
Turbo Clock (GHz)
3.7
5 +35.1%
Multiplier
30
36 +20.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
128 MB (shared)
32 MB (shared)
Power
TDP (W)
155
55 -64.5%
Configurable TDP
180 W
45-120 W
Architecture
Architecture
Zen 3
Zen 5
Codename
Milan
Strix Halo
Generation
EPYC (Zen 3 (Milan))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
7 nm
4 nm
Transistors
16,600 million
Die Size
4x 81 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
LPDDR5X
Memory Bus
Eight-channel
Quad-channel
Memory Bandwidth
204.8 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket SP3
AMD Socket FP11
PCIe
Gen 4, 128 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
CCDs
4
Cores per CCD
4
IO Process Size
12 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 8050S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$913
Part Number
100-000000339100-100000339WOF
100-000001424
Package
FCLGA-4094
FC-BGA
Tj Max
100°C
View EPYC 7313P Details View Ryzen AI Max 385 Details