CPU Comparison

A

AMD

AMD

AMD EPYC 7303

CORE STATE Milan

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 3.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 130W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,448

2,865

cinebench_cinebench_r15_singlecore

345

404

cinebench_cinebench_r20_multicore

10,200

11,938

cinebench_cinebench_r20_singlecore

1,439

1,685

cinebench_cinebench_r23_multicore

24,286

28,424

cinebench_cinebench_r23_singlecore

3,428

4,012

passmark_data_compression

428,319

399,839

passmark_data_encryption

25,167

19,947

passmark_extended_instructions

31,603

33,915

passmark_find_prime_numbers

180

169

passmark_floating_point_math

64,940

72,648

passmark_integer_math

113,422

108,717

passmark_multithread

28,572

33,441

passmark_physics

1,792

1,772

passmark_random_string_sorting

42,259

41,537

passmark_single_thread

1,460

4,052

passmark_singlethread

1,460

4,052

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 7303

AI Max PRO 385

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.4

3.6 +50.0%

Boost Clock (GHz)

3.4

5 +47.1%

Frequency (GHz)

2.4

3.6 +50.0%

Turbo Clock (GHz)

3.4

5 +47.1%

Multiplier

24

36 +50.0%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

32 MB (shared)

Power

TDP (W)

130

55 -57.7%

Configurable TDP

120-150 W

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Milan

Strix Halo

Generation

EPYC (Zen 3 (Milan))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

8,300 million

—

Die Size

2x 81 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Eight-channel

Quad-channel

Memory Bandwidth

204.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP3

AMD Socket FP11

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

CCDs

2

—

Cores per CCD

8

—

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$604

—

Part Number

100-000001288100-100001288WOF

100-000001422

Package

FCLGA-4094

FC-BGA

Tj Max

—

100°C

View EPYC 7303 Details View Ryzen AI Max PRO 385 Details