CPU Comparison

AMD
AMD

AMD EPYC 4345P

CORE STATE Grado
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.8 Base / 5.5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,227
2,865
cinebench_cinebench_r15_singlecore
455
404
cinebench_cinebench_r20_multicore
13,448
11,938
cinebench_cinebench_r20_singlecore
1,898
1,685
cinebench_cinebench_r23_multicore
32,020
28,424
cinebench_cinebench_r23_singlecore
4,520
4,012
passmark_data_compression
430,813
399,839
passmark_data_encryption
22,820
19,947
passmark_extended_instructions
33,544
33,915
passmark_find_prime_numbers
194
169
passmark_floating_point_math
78,059
72,648
passmark_integer_math
124,180
108,717
passmark_multithread
37,671
33,441
passmark_physics
2,480
1,772
passmark_random_string_sorting
48,448
41,537
passmark_single_thread
4,672
4,052
passmark_singlethread
4,672
4,052

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 4345P
AI Max PRO 385
Core Specs
Cores
8
8 0.0%
Threads
16
16 0.0%
Base Clock (GHz)
3.8
3.6 -5.3%
Boost Clock (GHz)
5.5
5 -9.1%
Frequency (GHz)
3.8
3.6 -5.3%
Turbo Clock (GHz)
5.5
5 -9.1%
Multiplier
38
36 -5.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
32 MB (shared)
32 MB (shared)
Power
TDP (W)
65
55 -15.4%
PPT
88 W
Configurable TDP
45-120 W
Architecture
Architecture
Zen 5
Zen 5
Codename
Grado
Strix Halo
Generation
EPYC (Zen 5 (Grado))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
4 nm
4 nm
Transistors
8,315 million
Die Size
70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
89.6 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM5
AMD Socket FP11
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon Graphics
Radeon 8050S
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$329
Part Number
100-000001556
100-000001422
Package
FC-LGA1718
FC-BGA
Tj Max
95°C
100°C
Bundled Cooler
None
View EPYC 4345P Details View Ryzen AI Max PRO 385 Details