INTEL

Intel Core i3-2357M

Intel processor specifications and benchmark scores

2
Cores
4
Threads
GHz Boost
17W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 2C / 4T
Base Clock 1300 GHz
L3 Cache 3 MB (shared)
TDP 17W
Architecture Sandy Bridge
Socket Intel BGA 1023
nm
Process 32 nm
Released Jun 2011

Intel Core i3-2357M Specifications

Core i3-2357M Core Configuration

Processing cores and threading

The Intel Core i3-2357M features 2 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
4
SMP CPUs
1

i3-2357M Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Core i3-2357M benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core i3-2357M by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1300 GHz
Boost Clock
N/A
Multiplier
13x

Intel's Core i3-2357M Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the i3-2357M processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core i3-2357M's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
3 MB (shared)

Sandy Bridge Architecture & Process

Manufacturing and design details

The Intel Core i3-2357M is built on Intel's 32 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in i3-2357M incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Sandy Bridge
Codename
Sandy Bridge
Process Node
32 nm
Foundry
Intel
Transistors
624 million
Die Size
149 mm²
Generation
Core i3 (Sandy Bridge)

Sandy Bridge Instruction Set Features

Supported CPU instructions and extensions

The Core i3-2357M by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AES-NI
Intel 64
VT-x
VT-d

i3-2357M Power & Thermal

TDP and power specifications

The Intel Core i3-2357M has a TDP (Thermal Design Power) of 17W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
17W

Intel BGA 1023 Platform & Socket

Compatibility information

The Core i3-2357M uses the Intel BGA 1023 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel BGA 1023
Package
rPGA
DDR5

Intel BGA 1023 Memory Support

RAM compatibility and speeds

Memory support specifications for the i3-2357M define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core i3-2357M determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Dual-channel

Intel's Core i3-2357M Integrated Graphics

Built-in GPU specifications

The Intel Core i3-2357M includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the i3-2357M provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Intel HD 3000
Graphics Model
Intel HD 3000

Core i3-2357M Product Information

Release and pricing details

The Intel Core i3-2357M is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core i3-2357M by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Jun 2011
Market
Mobile
Status
End-of-life

Core i3-2357M Benchmark Scores

No benchmark data available for this CPU.

About Intel Core i3-2357M

The Intel Core i3-2357M is a 32 nm mobile processor from Intel’s Sandy Bridge generation. It uses the Intel BGA 1023 socket, has 2 cores and 4 threads, and runs at a 1300.00 MHz base clock with no boost clock listed. The part carries a 17 W TDP, integrates Intel HD 3000 graphics, supports DDR3 dual-channel memory, and is marked end-of-life. In the database it sits at the 50th percentile of all CPUs, although its average benchmark score is listed as 0 and no nearest rival records are stored.

Single-Thread vs Multi-Thread Behavior

Single-thread performance is defined by the 1300.00 MHz base clock and the Sandy Bridge core design. Because no boost clock is listed, there is no short-duration frequency headroom; a single active thread runs at the same 1300.00 MHz ceiling as all four threads. The cache layout provides 64 KB of L1 per core and 256 KB of L2 per core, with 3 MB of shared L3 cache. In latency-sensitive single-threaded workloads, the shared L3 can help reduce memory stalls, but the low clock remains the dominant limit. The result is a part that is usable for everyday responsive tasks rather than high-frequency single-thread work.

Multi-thread behavior comes from 4 threads spread across 2 physical cores. This allows the scheduler to keep two threads resident per core, which can improve throughput when workloads have multiple parallel streams. However, 4 threads are not a replacement for physical core count in heavy parallel compute. The 1300.00 MHz clock applies across all cores, so multi-threaded throughput is capped by the same clock used for single-threaded work. For ordinary multitasking, the extra threads help keep background activity moving while the main thread handles the foreground task. For large rendering, encoding, or scientific workloads, the low clock and only 2 physical cores become the limiting factor.

The single-thread versus multi-thread split matters most for understanding where this CPU can still feel adequate. Light web browsing, office documents, and media playback tend to rely on one or two active threads, and the 1300.00 MHz clock is the main constraint. Workloads that can use all 4 threads, such as file compression or older multi-threaded applications, get a modest throughput advantage over a pure 2-thread dual-core chip. But the absence of a boost clock means there is no hidden reserve of performance for either type of workload.

Power and Thermals

The processor is rated at a 17 W TDP. That places it in a low-power mobile class, especially for a dual-core design with integrated graphics. The silicon is built on Intel’s 32 nm process node, with 624 million transistors on a 149 mm² die. Those figures describe a compact chip with a relatively small thermal footprint. The mobile market segment reinforces the intent: this is not a desktop part and should not be cooled like one.

Thermal management should be straightforward. A 17 W TDP does not require a large heat sink or aggressive fan curve; a small heat pipe assembly or a capable low-profile cooler is the implied tier. Because the multiplier is not unlocked and no boost clock is present, there is no overclocking headroom to create additional heat. The integrated Intel HD 3000 GPU sits on the same processor, so sustained graphics load will add heat inside the same overall envelope. Even so, the absolute thermal ceiling is low, which makes the chip suitable for compact mobile systems.

The process node and die size also frame the efficiency story. With 32 nm manufacturing and a 17 W TDP, the chip is positioned for battery-conscious chassis. The lack of ECC memory support and the end-of-life production status further point to a mainstream mobile design rather than an enterprise or workstation component.

Benchmark Performance

The benchmarks array for the Core i3-2357M is empty, and the aggregate average benchmark score is 0. The only performance-position field populated is the 50th percentile. This places the part at the midpoint of the database’s CPU ranking. For a low-clock mobile dual-core, that midpoint ranking is consistent with the rest of the specification: it is neither a bottom-tier part nor a high-performance one.

Because no nearest rivals are stored, there are no exact percentage deltas to cite. No rival names, no rival scores, and no comparison percentages are available in the data. Without that information, any statement such as “30% ahead of” or “20% behind” would be unsupported. The benchmark result indicates only that this CPU sits at the 50th percentile of all CPUs in the database. The 0 average benchmark score should be read as a placeholder for missing scored runs, not as a literal performance measurement.

The practical takeaway from the benchmark data is simple: the measured performance profile is not recorded, but the specification sheet shows a low-frequency, energy-conscious mobile part. The 50th percentile position is the one available anchor point. It suggests that the processor is an average performer in the broad database, not a standout. Without nearest rivals, any further numeric ranking is impossible to support.

How It Compares

The nearestRivals field is empty. There are therefore no direct one-paragraph comparisons to write. The data records no competitor names, no rival benchmark scores, and no percentage differences. This means the comparison position is limited to the 50th percentile versus all CPUs in the database.

In practical terms, the specification data indicates a power-conscious mobile chip. The 17 W TDP, the 1300.00 MHz base clock, and the 2-core/4-thread layout all point in the same direction: this processor was designed for light-duty notebooks, not for competitive desktop computing. Without stored rival records, any specific comparison to another named CPU would go beyond the information in the FACT PACK. The empty nearestRivals list is itself a statement that no direct comparison candidates are defined for this chip.

FAQ

Q: What socket does this processor use?

A: It uses the Intel BGA 1023 socket.

Q: How many cores and threads does the Core i3-2357M have?

A: It has 2 cores and 4 threads.

Q: Does it have a boost clock?

A: No boost clock is listed in the data. The base clock is 1300.00 MHz.

Q: What kind of memory does it support?

A: It supports DDR3 memory with a dual-channel memory bus. ECC memory is not supported.

Q: Does the processor include integrated graphics?

A: Yes, it includes Intel HD 3000 graphics.

Q: Is the multiplier unlocked for overclocking?

A: No, the multiplier is not unlocked.

Q: When was it released?

A: The release date is 2011-05-31.

Platform and Compatibility

The platform is built around Intel BGA 1023, a socket intended for the mobile market segment. The processor belongs to the Core i3 series from the Sandy Bridge generation and is manufactured on Intel’s 32 nm process. Memory support is limited to DDR3 with a dual-channel interface. No PCIe information is provided in the data, so PCIe lane counts and revisions cannot be stated. No memory bandwidth figure is recorded either.

The integrated Intel HD 3000 GPU is part of the platform, meaning a discrete graphics card is not required for basic display output. The processor is listed as end-of-life, which indicates it is no longer in active production. The BGA 1023 socket and end-of-life status point to a platform with limited upgrade flexibility. Because the multiplier is not unlocked, overclocking is not available as a lever. In a mobile system, the CPU is effectively a fixed component, and the more practical upgrade paths would involve memory or storage rather than swapping the processor itself. The 149 mm² die size and 624 million transistor count describe the physical package, but the end-of-life status is the more relevant fact for anyone planning a new build or upgrade today.

The AMD Equivalent of Core i3-2357M

Looking for a similar processor from AMD? The AMD Ryzen 3 PRO 1200 offers comparable performance and features in the AMD lineup.

AMD Ryzen 3 PRO 1200

AMD • 4 Cores

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