NVIDIA Tegra 3 GPU

The NVIDIA Tegra 3 GPU is an integrated graphics processor built into the Tegra 3 system-on-chip, fabricated on TSMC's 40 nm process with the Kal-El chip and a VLIW Vec4 architecture. Released on November 8, 2011, it is now end-of-life, and its specification data shows a mid-range position in the overall GPU landscape, with a percentile ranking of 50 among all GPUs and an average benchmark score of 0.

Benchmark Performance

The Tegra 3 GPU's benchmark data is sparse: no individual benchmark scores are recorded, and the average benchmark score is 0. However, its percentile ranking of 50 places it exactly at the median of all GPUs in the database, indicating that it delivers performance typical of the mid-point of the spectrum at the time of its release. The absence of concrete scores means that direct performance comparisons must be inferred from its clock and fill-rate specifications.

The GPU operates with a base clock of 416 MHz and a boost clock of 520 MHz. The boost state provides a higher operating frequency for burst workloads, though the exact performance uplift is not quantified in the data. The pixel rate is 4.160 GPixel/s, and the texture rate is also 4.160 GTexel/s, reflecting a balanced design where pixel and texture throughput are identical. With 8 texture mapping units and 8 render output units, the GPU can process eight texels and eight pixels per clock cycle, respectively. These fill rates are modest by modern standards but were appropriate for the portable device segment the GPU was designed for.

The 10 million transistors on an 80 mm² die yield a transistor density of 125.0K per square millimeter. This density, combined with the 40 nm process, suggests a relatively simple architecture focused on low power consumption rather than raw performance. The GPU's clock speeds and fill rates align with a part intended for small screens and light graphical loads, not for high-end gaming or compute tasks.

Memory Subsystem

The Tegra 3 GPU is paired with 256 MB of DDR3 memory, which is a small capacity even for its era. The memory bus is only 32 bits wide, and the memory clock is 667 MHz, with an effective data rate of 1334 Mbps. This configuration yields a total memory bandwidth of 5.336 GB/s. The narrow bus width is a significant bottleneck: it limits the amount of data that can be transferred between the GPU and memory per clock cycle, directly capping the bandwidth figure.

For high-resolution workloads, this memory subsystem is severely constrained. A 256 MB frame buffer is insufficient for large textures or high-resolution render targets, and the 5.336 GB/s bandwidth would struggle to keep up with complex scenes that require frequent texture reads and writes. The GPU's fill rates of 4.160 GPixel/s and 4.160 GTexel/s can only be sustained if the memory subsystem can feed them, and the 32-bit bus is likely to become a limiting factor in practice. The use of DDR3 rather than a more exotic memory type also points to cost and power optimization over performance.

Who Should Consider It

Given the modest specifications, the Tegra 3 GPU is suitable only for portable devices with low-resolution displays. The 256 MB memory capacity and 5.336 GB/s bandwidth are adequate for simple UI rendering, basic 2D graphics, and lightweight 3D applications on screens with small pixel counts. The GPU's integrated nature—classified as IGP in both slot width and bus interface—means it shares system memory and relies on the host device's power and thermal management.

The display outputs are described as "Portable Device Dependent," confirming that this GPU was designed for tablets, smartphones, and similar mobile hardware. For users of legacy devices that shipped with this GPU, it can handle casual gaming and media playback at modest settings. It is not intended for desktop gaming, high-resolution output, or compute-intensive tasks. Since the production status is end-of-life, new builds should not consider this part, but those maintaining older devices may find it sufficient for basic functionality.

How It Compares

The dataset does not include any nearest rival comparisons for the Tegra 3 GPU, so a direct head-to-head analysis against specific competing products is not possible. The only positional reference is the 50th percentile ranking, which indicates that the GPU sits at the median of all GPUs in the benchmark database. This implies that half of the GPUs in the database perform better and half perform worse, but without specific rival names or scores, no further granularity can be established.

In the absence of rival data, the GPU's relative standing must be assessed through its own specifications. The 40 nm process, 10 million transistors, and 80 mm² die size are characteristic of a low-cost, low-power integrated solution. Its clock speeds and fill rates are consistent with other entry-level mobile GPUs of its generation, but the lack of benchmark scores prevents a quantitative comparison. The 50th percentile ranking suggests it is not at the bottom of the performance stack, but it also does not represent a high-performance part.

FAQ

Q: What is the process node of the NVIDIA Tegra 3 GPU?

A: The GPU is fabricated on a 40 nm process at TSMC.

Q: How much memory bandwidth does the Tegra 3 GPU have?

A: The memory bandwidth is 5.336 GB/s, derived from a 32-bit DDR3 bus with a memory clock of 667 MHz and an effective data rate of 1334 Mbps.

Q: What is the TDP of the Tegra 3 GPU?

A: The thermal design power (TDP) is 20 W.

Q: When was the Tegra 3 GPU released?

A: The release date is November 8, 2011.

Q: What is the pixel fill rate of this GPU?

A: The pixel rate is 4.160 GPixel/s, and the texture rate is also 4.160 GTexel/s.

Q: What is the architecture of the Tegra 3 GPU?

A: It uses the VLIW Vec4 architecture, built on the Kal-El chip.

Power and Cooling

The Tegra 3 GPU has a TDP of 20 W, which is low enough to be passively cooled in many portable devices. Its slot width is listed as IGP, meaning it is an integrated graphics processor that does not occupy an expansion slot. The bus interface is also IGP, confirming that it is part of a system-on-chip rather than a discrete add-in card. No power connectors are specified, and no suggested PSU is provided, which is expected for an integrated part that draws power from the host device's main power delivery system.

Because the GPU is integrated, cooling is typically handled by the device's overall thermal solution, such as a heat spreader or system fan. The 20 W TDP is a modest figure, allowing for thin and light designs without active cooling in some cases. However, sustained boost operation at 520 MHz may increase thermal output, and the device's cooling must be sufficient to handle that. The lack of a dedicated PSU recommendation further underscores that this GPU is not intended for desktop use, where a separate power supply would be required. Instead, it relies on the power management capabilities of the host system, which must be designed to accommodate the GPU's 20 W draw alongside other components.