NVIDIA Quadro FX 2500M

The NVIDIA Quadro FX 2500M is a mobile workstation GPU in the Quadro FX Mobile x500M generation, built around the G71 chip on the Curie architecture. The fact pack records a 90 nm TSMC process, 278 million transistors, a 196 mm² die, and a transistor density of 1.4M per mm². It was released on 2005-09-28 and its production status is end-of-life. The database lists no benchmark results, an average benchmark score of 0, and a 50th percentile placement against all GPUs. Its nearestRivals array is empty, so this entry carries no direct competitor comparisons.

How It Compares

The nearestRivals list is empty. There are therefore no rival names, no rival scores, and no deltaPct values to quote. The only relative metric in the fact pack is percentileVsAllGpus, which is set to 50. That places the Quadro FX 2500M at the median position of all GPUs in the database. Because no benchmark scores are populated, this percentile cannot be tied to a specific performance score. The list of benchmark entries is also empty, so no direct comparative analysis is possible. In short: there is no rival set in this record to compare against, and the 50th percentile is the only ranking signal.

The database’s all-GPU percentile of 50 means the entry is positioned exactly in the middle of the ranked list. Since no nearest rivals are recorded, no specific competitor can be placed ahead of or behind this GPU. The lack of a benchmark score removes any numerical basis for a percentage delta. In the available data, the only notion of “position” is this median percentile.

Who Should Consider It

This GPU is for a portable workstation rather than a fixed desktop card. The slot width is MXM Module, the bus interface is MXM-III, and the display outputs are Portable Device Dependent. The host machine must supply the MXM-III connector and the display ports. With DirectX 9.0c (9_3) API support, the part is suited to software from that API generation. The 512 MB GDDR3 frame buffer is the capacity ceiling; applications that fit within 512 MB can use the listed 8.000 GPixel/s pixel rate and 12.00 GTexel/s texture rate. At higher resolutions, the 38.40 GB/s bandwidth and 512 MB capacity become the limiting factors. The 45 W TDP and lack of auxiliary power connectors point to a power-constrained mobile chassis. This is a compatibility-oriented part for legacy workstation software, not a high-resolution modern renderer.

Users with an MXM-III-equipped portable device can consider this module as a direct form-factor match. The GPU’s DirectX 9.0c (9_3) support is the most relevant software compatibility marker. The 512 MB GDDR3 capacity and 38.40 GB/s bandwidth are the memory parameters that govern rendering workload size. The 8.000 GPixel/s and 12.00 GTexel/s rates set the fill-rate ceiling. The 45 W TDP is the power envelope, and the absence of a suggested PSU means no external supply recommendation is recorded.

Memory Subsystem

The memory subsystem is explicitly defined by four figures: 512 MB of GDDR3, a 256-bit bus, a 600 MHz memory clock, and a 38.40 GB/s bandwidth figure, with the memory clock also expressed as 1200 Mbps effective. The 256-bit interface is the data path between the GPU and the frame buffer. The 38.40 GB/s figure is the sustained transfer rate across that path. The rendering pipeline is built around 24 TMUs and 16 ROPs, producing a pixel rate of 8.000 GPixel/s and a texture rate of 12.00 GTexel/s. These fill rates depend on memory bandwidth to supply texture and pixel data. For high-resolution rendering, the 512 MB capacity is the key constraint: frame buffer, depth buffer, and intermediate render targets compete for that space. The 38.40 GB/s bandwidth must move all texture reads and writes within that capacity.

No base or boost clock is listed; the only clock value is the memory clock of 600 MHz, expressed as 1200 Mbps effective. The 256-bit bus and GDDR3 type complete the memory design. The fact pack does not list shading units, so the compute side of the GPU is not quantified. The 24 TMUs and 16 ROPs are the only rendering unit counts in the record. The 8.000 GPixel/s pixel rate is tied to the 16 ROPs, and the 12.00 GTexel/s texture rate is tied to the 24 TMUs. For higher resolutions, the bandwidth and capacity figures are the primary limits.

FAQ

Q: What architecture and chip does the Quadro FX 2500M use?

A: It uses the Curie architecture with the G71 chip. It is fabricated by TSMC on a 90 nm process, with 278 million transistors on a 196 mm² die and a transistor density of 1.4M per mm².

Q: What memory configuration is listed?

A: 512 MB of GDDR3 on a 256-bit bus, with a memory clock of 600 MHz and an effective data rate of 1200 Mbps, yielding 38.40 GB/s of bandwidth.

Q: What are the fill rates and fixed-function units?

A: The GPU has 24 TMUs and 16 ROPs. The listed pixel rate is 8.000 GPixel/s, and the listed texture rate is 12.00 GTexel/s. No shading unit count is recorded.

Q: What API support is in the fact pack?

A: DirectX 9.0c (9_3), OpenGL 2.1.2 (full), and OpenGL 3.x (partial) are listed. No Vulkan version is listed.

Q: What are the power and module specifications?

A: TDP is 45 W. Slot width is MXM Module, bus interface is MXM-III, and no auxiliary power connectors are listed. The suggested PSU field is not populated.

Q: What is the product’s status and generation?

A: It is part of the Quadro FX Mobile x500M generation, released on 2005-09-28, and its production status is end-of-life. The predecessor is Quadro FX Go, and the successor is Quadro Fermi-M.

Benchmark Performance

The benchmark data for this entry is not populated. The benchmarks array is empty and the average benchmark score field is 0. Because there are no scores, exact percentage deltas cannot be produced. The nearestRivals array is empty, so there are no rival names or deltaPct values to compare against. The only ranking signal is the percentileVsAllGpus value of 50, which places the GPU at the median of all GPUs in the database. The specification sheet provides the only throughput values: pixel rate 8.000 GPixel/s, texture rate 12.00 GTexel/s, memory bandwidth 38.40 GB/s. The pixel rate is generated by the 16 ROPs, and the texture rate by the 24 TMUs. The memory bandwidth of 38.40 GB/s is the rate at which data can be fed to those units. No statement such as “ahead by 30 percent” is possible from this data because the comparison set is empty. The 50th percentile remains the only relative performance descriptor.

The fact pack contains no percentiles relative to a specific rival because there are no rivals. The 50th percentile is therefore a global ranking, not a head-to-head result. The empty benchmarks array and the average benchmark score of 0 reinforce that no performance score has been captured. The specification-based values are the only objective performance numbers in the record. The 38.40 GB/s bandwidth is the memory throughput, and the 8.000 GPixel/s and 12.00 GTexel/s are the pixel and texture throughputs. These do not belong to a benchmark suite, but they are the data available for analysis.

Power and Cooling

The power envelope is defined by a 45 W TDP. There are no auxiliary power connectors in the fact pack, so power delivery is via the MXM-III bus interface. The slot width is MXM Module, which is the mechanical module standard for the connector. No suggested PSU is listed, so the database does not provide an official power-supply recommendation. The host device is responsible for the cooling solution; display outputs are Portable Device Dependent, meaning the host controls the physical ports. The 90 nm TSMC process, 278 million transistors, and 196 mm² die are the physical contributors to the thermal load, and the 1.4M per mm² transistor density is the process-level descriptor. With a 45 W TDP and no auxiliary power connectors, the cooling design belongs to the mobile workstation chassis, not to an add-in card.

The absence of a suggested PSU is notable; no wattage recommendation is stored in the database. The power connectors field being None is the second power-related datapoint. The MXM-III bus interface carries the module, and the slot width is the MXM Module form factor. The host system’s cooling design is implied by the Portable Device Dependent display output field. The 45 W TDP is the figure that defines the module’s thermal output. The 90 nm process and 278 million transistors are the physical design facts; the 196 mm² die and 1.4M per mm² density are the area and integration descriptors.

Ray Tracing and Feature Set

The fact pack lists no RT cores and no tensor cores. Therefore, hardware-accelerated ray tracing and tensor-based acceleration are not part of this GPU’s recorded feature set. The architecture is Curie, built on the G71 chip, and the API list is DirectX 9.0c (9_3), OpenGL 2.1.2 (full), and OpenGL 3.x (partial). No Vulkan version is present. The OpenGL 3.x support is marked as partial, so applications expecting complete OpenGL 3.x behavior have limited support. DirectX 9.0c (9_3) is the only DirectX feature level listed. No shading unit count is listed, so the shader configuration is not documented. The absence of RT and tensor cores, combined with the DirectX 9.0c and partial OpenGL 3.x API set, defines a feature set that predates modern hardware ray tracing and AI acceleration blocks.

There is no Vulkan entry, so no Vulkan version is recorded. The DirectX entry is 9.0c with feature level 9_3. The OpenGL entry shows full support for 2.1.2 but only partial support for 3.x. The architecture is Curie, and the chip is G71; both are names from the fact pack rather than benchmark findings. With no RT cores and no tensor cores, the feature set does not include dedicated hardware blocks for ray tracing or tensor workloads. The only rendering resources that are quantified are the 24 TMUs and 16 ROPs.