NVIDIA GeForce GTS 450 Rev. 2
NVIDIA graphics card specifications and benchmark scores
At a Glance
NVIDIANVIDIA GeForce GTS 450 Rev. 2 Specifications
GeForce GTS 450 Rev. 2 GPU Core
Shader units and compute resources
The NVIDIA GeForce GTS 450 Rev. 2 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
GTS 450 Rev. 2 Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the GeForce GTS 450 Rev. 2's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The GeForce GTS 450 Rev. 2 by NVIDIA dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
NVIDIA's GeForce GTS 450 Rev. 2 Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The GeForce GTS 450 Rev. 2's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
GeForce GTS 450 Rev. 2 by NVIDIA Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the GTS 450 Rev. 2, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
GTS 450 Rev. 2 Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the NVIDIA GeForce GTS 450 Rev. 2 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
Fermi 2.0 Architecture & Process
Manufacturing and design details
The NVIDIA GeForce GTS 450 Rev. 2 is built on NVIDIA's Fermi 2.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the GTS 450 Rev. 2 will perform in GPU benchmarks compared to previous generations.
NVIDIA's GeForce GTS 450 Rev. 2 Power & Thermal
TDP and power requirements
Power specifications for the NVIDIA GeForce GTS 450 Rev. 2 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the GeForce GTS 450 Rev. 2 to maintain boost clocks without throttling.
GeForce GTS 450 Rev. 2 by NVIDIA Physical & Connectivity
Dimensions and outputs
Physical dimensions of the NVIDIA GeForce GTS 450 Rev. 2 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
NVIDIA API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the NVIDIA GeForce GTS 450 Rev. 2. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
GeForce GTS 450 Rev. 2 Product Information
Release and pricing details
The NVIDIA GeForce GTS 450 Rev. 2 is manufactured by NVIDIA as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the GeForce GTS 450 Rev. 2 by NVIDIA represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
GeForce GTS 450 Rev. 2 Benchmark Scores
No benchmark data available for this GPU.
About NVIDIA GeForce GTS 450 Rev. 2
The NVIDIA GeForce GTS 450 Rev. 2 is a Fermi 2.0 graphics card built around the GF116 chip, fabricated by TSMC on a 40 nm process. The die contains 1,170 million transistors across a 238 mm² area, giving a transistor density of 4.9M / mm². It was released on 2011-03-14 as part of the GeForce 400 generation, with the GeForce 200 listed as its predecessor and the GeForce 500 as its successor. The production status is end-of-life, and the database places the card at the 50th percentile of all GPUs.
Benchmark Performance
The benchmarks array in the FACT PACK is empty, and the average benchmark score is 0. No recorded workload averages exist for this entry, so the only summary position is the 50th percentile, which places the card at the median of all GPUs in the database. The raw specification rates provide the detailed picture. The card has 192 shading units, 32 TMUs, and 16 ROPs. These units yield an FP32 compute rate of 601.3 GFLOPS, a texture rate of 25.06 GTexel/s, and a pixel rate of 6.264 GPixel/s. The memory configuration is 902 MHz (3.6 Gbps effective) across a 128-bit bus, producing 57.73 GB/s of bandwidth. The 40 nm TSMC process is the manufacturing context for these rates; the 238 mm² die contains 1,170 million transistors. The transistor density of 4.9M / mm² relates the die size to the transistor count.
The relationship among these figures defines the card's behavior. The 57.73 GB/s memory bandwidth is the shared resource for the shading units, TMUs, and ROPs. Compute-heavy work is bounded by the 601.3 GFLOPS FP32 peak. Texture-heavy work is bounded by 25.06 GTexel/s, and fill-heavy work by 6.264 GPixel/s. Because all of these operations move data through the same 57.73 GB/s path, the memory subsystem acts as the ceiling that can limit the other rates in practice. The API list includes DirectX 12 (11_0) and OpenGL 4.6, which is the software feature set for this end-of-life part. All of the peak rates are specification maxima; the 57.73 GB/s bandwidth is the shared path for data movement.
Power and Cooling
The power specification is a TDP of 106 W. The suggested PSU is 300 W, and the board requires a single 1x 6-pin power connector. These three values together describe the electrical requirement: a power supply rated at 300 W that includes a 6-pin power connector. A 106 W TDP and a 300 W suggested PSU mean the PSU figure is a system-level recommendation, not the board's own draw. The card is a dual-slot design, and its length is 210 mm, or 8.3 inches. That length and slot width are the mechanical dimensions to check against a chassis. The bus interface is PCIe 2.0 x16. The display outputs are 2x DVI and 1x mini-HDMI 1.3a.
The 106 W TDP is the recorded thermal design point, and the dual-slot width is the recorded cooler footprint. The 40 nm process and the 1,170 million transistor count are the manufacturing context for the power and thermal behavior. The die area is 238 mm², which is the physical size of the silicon. The dual-slot cooler and 210 mm / 8.3 inches board length are the recorded physical dimensions that affect case compatibility.
How It Compares
The nearestRivals field in the FACT PACK is empty. There are no rival names, scores, or deltaPct values available for comparison, so this section cannot report percentage deltas against other products. The 50th percentile is the only positional comparison in the data set, placing the card at the median of all GPUs. The predecessor and successor fields contain only names, not scores.
The predecessor field lists GeForce 200. The GTS 450 Rev. 2 belongs to the GeForce 400 generation, so the data sequence shows it one step forward from the older GeForce 200 line. The successor field lists GeForce 500, placing this card one step before that generation in the database ordering. The GF116 chip implements the Fermi 2.0 architecture in this entry. The Rev. 2 suffix indicates a revised version within the same product name, and the production status is end-of-life. The Fermi 2.0 architecture and GF116 chip are the architectural identity of the card. The GeForce 400 generation label is the product generation for this entry. Without nearestRivals data, the comparison rests on these structural facts: a median-percentile Fermi 2.0 card positioned between two generations.
FAQ
Q: What is the TDP and power recommendation?
A: The TDP is 106 W. The suggested PSU is 300 W. The board requires a 1x 6-pin power connector, and the cooler is dual-slot.
Q: How much memory does the card have, and what is the bandwidth?
A: It has 1024 MB of GDDR5 on a 128-bit bus. The memory clock is 902 MHz, operating at 3.6 Gbps effective, and the bandwidth is 57.73 GB/s.
Q: What are the physical dimensions?
A: The board length is 210 mm / 8.3 inches, and the slot width is dual-slot.
Q: What display outputs are present?
A: Two DVI outputs and one mini-HDMI 1.3a output. The mini-HDMI port is version 1.3a.
Q: Which APIs are supported?
A: DirectX 12 (11_0) and OpenGL 4.6. The DirectX entry is listed as 12 with the 11_0 feature level.
Q: When was it released, and where does it sit in the product stack?
A: The release date is 2011-03-14. The predecessor is GeForce 200, the successor is GeForce 500, and the generation is GeForce 400.
Who Should Consider It
The 50th percentile placement defines this card as a median performer. A user who is well served by that position will find the raw rates consistent with it: 601.3 GFLOPS of FP32 compute, 6.264 GPixel/s pixel fill, and 25.06 GTexel/s texture fill. The memory subsystem provides 57.73 GB/s over a 128-bit bus with 1024 MB of GDDR5. Workloads that fit within that capacity and bandwidth are the natural operating envelope. The electrical demands are modest—106 W TDP and a 300 W suggested PSU—so a system with a 300 W PSU and one 6-pin connector meets the requirement. The physical design is dual-slot with a 210 mm / 8.3 inches length, so case clearance is the main installation consideration.
The display outputs are 2x DVI and 1x mini-HDMI 1.3a, which supports multi-monitor connections. The bus interface is PCIe 2.0 x16. DirectX 12 (11_0) support permits access to the DirectX 12 API at the 11_0 feature level, and OpenGL 4.6 is available. Because the card is end-of-life, it is a legacy choice. At high resolutions, the 1024 MB frame buffer is the first limiting factor, followed by the 57.73 GB/s bandwidth. Users should consider this card when their target workloads stay within those limits. The 238 mm² die and 1,170 million transistor count are the silicon-level reasons why those limits exist. The 40 nm process node is the lithography for the GF116 chip.
Memory Subsystem
The memory subsystem is 1024 MB of GDDR5 on a 128-bit bus. The memory clock runs at 902 MHz, with an effective data rate of 3.6 Gbps. The published bandwidth is 57.73 GB/s. The 128-bit bus determines how many bits are transferred per memory cycle; the 3.6 Gbps effective rate determines how many cycles occur per second, and together they produce the bandwidth figure. The memory type is GDDR5, and the capacity is 1024 MB.
For high resolutions, the 1024 MB capacity is the primary constraint. The pixel rate of 6.264 GPixel/s and the texture rate of 25.06 GTexel/s indicate how much output the ROPs and TMUs can generate, and all of that output moves through the same 57.73 GB/s memory path. The combination of a 128-bit bus, a 902 MHz clock, and a 3.6 Gbps effective rate is what yields the listed bandwidth. These values—capacity, bus width, clock, and bandwidth—determine how much scene data can be stored and transferred. For a successor to the GeForce 200 line and a predecessor to the GeForce 500 line, this memory configuration is the data record of the card's transfer ceiling.
The AMD Equivalent of GeForce GTS 450 Rev. 2
Looking for a similar graphics card from AMD? The AMD Radeon RX 480 offers comparable performance and features in the AMD lineup.
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