ATI Radeon X1650 PRO

The ATI Radeon X1650 PRO is an end-of-life AMD graphics board that uses the RV530 chip on the Ultra-Threaded SE architecture, fabricated by TSMC at 90 nm. The die measures 150 mm² and contains 157 million transistors, for a transistor density of 1.0M / mm². Released on 2007-01-31, it belongs to the Radeon R500 PCIe (X1650) generation, with the Radeon R400 PCIe as its predecessor and the Radeon R600 as its successor. The data set records a 256 MB GDDR3 frame buffer, a 128-bit memory bus, 22.40 GB/s of bandwidth, and a 50th percentile ranking among all GPUs in the database, but it includes no benchmark scores and no nearest rival entries.

Benchmark Performance

The benchmarks array in the FACT PACK is empty, so there are no workload-level scores to analyze. The average benchmark score is listed as 0, and the nearestRivals array is also empty; consequently, no exact percentage deltas can be computed against any other product. The only performance-position field is percentileVsAllGpus, which is 50. That places this card at the median of the GPU distribution in the database: as many indexed GPUs rank above it as below it in percentile terms.

This is a rank-level observation only. Without specific scores, the record does not show how the X1650 PRO behaves in any individual application. The absence of base, boost, and game clock values further limits clock-based interpretation; the only clock data present are the memory clock at 700 MHz, referenced to 1400 Mbps effective. In short, the data set provides a central rank but no measured performance deltas, and any statement such as “faster than” or “slower than” a named rival would require rival score data that the record does not contain.

Memory Subsystem

The memory subsystem is fully specified. The card has 256 MB of GDDR3 memory, a 128-bit bus, and a bandwidth of 22.40 GB/s. The memory clock is listed at 700 MHz, with an effective data rate of 1400 Mbps. For high-resolution workloads, the frame buffer capacity and bus bandwidth act as the two main constraints. A 256 MB buffer can hold only so much geometry, texture, and render-target data before data must be moved across the 22.40 GB/s link. The 128-bit bus width is the physical path for that transfer, and 22.40 GB/s is the resulting bandwidth ceiling.

There are no memory-specific benchmark numbers in the record, so this is a structural reading of the memory subsystem rather than a measured frame-rate result. Pixel and texture rates are also present in the same data record: 2.400 GPixel/s and 2.400 GTexel/s, respectively, tied to the ROP and texture-unit counts rather than to the memory bus. The data does not include a separate high-resolution test result, so the practical impact of the memory configuration cannot be quantified beyond the stated capacity and bandwidth figures.

Ray Tracing and Feature Set

The architecture name in the record is Ultra-Threaded SE, built around the RV530 chip. The data set lists no RT cores and no tensor cores; both fields are null. The API list is DirectX 9.0c (9_3) and OpenGL 2.1, with no Vulkan version populated. This defines a feature set that stops at the DirectX 9-era feature level in the available data. The Vulkan field being null means no Vulkan support level is recorded.

The pixel pipeline is composed of 4 ROPs and 4 texture units, producing 2.400 GPixel/s and 2.400 GTexel/s. Shading-unit count, FP32 throughput, and FP16 throughput values are not populated in the data set. Display connectivity is provided through 1x DVI, 1x VGA, and 1x S-Video. The generation field labels the product as Radeon R500 PCIe (X1650). With no RT or tensor core counts in the record, there is no ray tracing or tensor-processing specification to report.

How It Compares

The nearestRivals field is empty. Therefore there are no rival names, scores, or deltaPct values to cite. The record cannot support statements such as “the X1650 PRO is a certain percentage faster than product Y,” because no product Y exists in the data. The only comparative anchor is percentileVsAllGpus = 50, which places the board at the midpoint of the database’s GPU rankings. Because avgBenchmarkScore is 0 and the benchmarks array is empty, that midpoint rank is not accompanied by any measured average score.

In the product lineage, the predecessor is the Radeon R400 PCIe and the successor is the Radeon R600, which positions the card between those two generations but not against a score-based rival list. A comparison against each nearest rival is therefore not possible from the FACT PACK, because the FACT PACK does not define any nearest rivals.

FAQ

Q: What GPU chip and architecture does the ATI Radeon X1650 PRO use?

A: It uses the RV530 chip on AMD’s Ultra-Threaded SE architecture, fabricated by TSMC on a 90 nm process.

Q: What is the memory configuration of the X1650 PRO?

A: It has 256 MB of GDDR3 memory on a 128-bit bus, with memory clocked at 700 MHz / 1400 Mbps effective and bandwidth of 22.40 GB/s.

Q: What graphics APIs are recorded for this card?

A: The data lists DirectX 9.0c (9_3) and OpenGL 2.1; no Vulkan value is listed.

Q: Does the record include any benchmark scores or nearest rival comparisons?

A: No. The benchmarks array is empty, the nearestRivals array is empty, and the average benchmark score is 0.

Q: What are the pixel and texture rates?

A: The pixel rate is 2.400 GPixel/s, and the texture rate is 2.400 GTexel/s, based on 4 ROPs and 4 texture units.

Q: What is the production status and release date?

A: The production status is end-of-life, and the release date is 2007-01-31.

Power and Cooling

Power and cooling data is present but partial. The suggested PSU is 200 W, and the card uses no auxiliary power connectors. The slot width is single-slot. No TDP value is provided in the record, so there is no thermal design power number to report. The bus interface is PCIe 1.0 x16. The absence of external power connectors means the board does not require a dedicated power cable from the PSU for its own operation, while the 200 W figure serves as the data’s overall power-supply recommendation. The single-slot designation indicates that the cooling solution occupies one expansion slot.