ATI Mobility FireGL T2

The ATI Mobility FireGL T2 is a mobile workstation GPU built around the M10 chip using the R300 architecture, manufactured by AMD at TSMC on a 130 nm process. The die integrates 76 million transistors across 92 mm², for a transistor density of 826.1K per mm². Released on 2003-10-31 as part of the Mobility FireGL generation, the part is now end-of-life, with FirePro Mobility listed as its successor. The database records no benchmark scores for this GPU, yet its 50th percentile placement among all tracked GPUs provides a reference point for its overall standing.

Benchmark Performance

The average benchmark score for the Mobility FireGL T2 is recorded as 0, indicating that no standardized performance samples have been captured. Consequently, there are no direct score comparisons to draw upon. The GPU's 50th percentile placement among all GPUs is the sole comparative metric available; it places the part at the median of the database's population. The pixel fill rate of 1.280 GPixel/s and the texture fill rate of 1.280 GTexel/s are numerically identical, a consequence of the 4 ROPs and 4 TMUs operating at the same effective rate. This balance implies that pixel-bound and texture-bound workloads would encounter similar throughput ceilings. The memory clock of 200 MHz, operating at a 400 Mbps effective data rate, sets the pace at which the 6.400 GB/s of bandwidth can be delivered to the rendering units. Without measured scores, the fill rates and bandwidth figures serve as the primary quantitative descriptors of performance. The 50th percentile ranking situates the part in the middle of the GPU landscape rather than at the top or bottom. The absence of benchmark data means that any performance difference relative to other parts cannot be expressed as a percentage delta. The architectural parameters, 4 TMUs, 4 ROPs, and the 128-bit memory path, are the only concrete indicators of throughput available.

How It Compares

The nearestRivals field for the Mobility FireGL T2 is empty, so the database provides no named competitors and no deltaPct values for comparison. This precludes any rival-specific percentage analysis. The only positional reference is the 50th percentile standing, which indicates a median placement across the entire GPU database. Within its own generation, the Mobility FireGL series, the part uses the R300 architecture, which is shared with other products of the same era, though the database does not enumerate those products. The successor, FirePro Mobility, represents the next step in AMD's professional mobile lineup, but no performance delta is recorded for that transition. The production status of end-of-life further distinguishes this part from actively supported GPUs. Because the database lacks rival entries, the comparison must rely on the GPU's own specifications and its percentile position. The 130 nm process node and 76 million transistor count place it in the early-2000s era of GPU manufacturing, and the AGP 4x bus interface reflects the connectivity standard of that period. The 50th percentile ranking is the most informative comparative data point: it tells us the part is neither a low-end outlier nor a high-end performer, but rather sits at the midpoint of the tracked distribution.

Memory Subsystem

The Mobility FireGL T2 is configured with 128 MB of DDR memory on a 128-bit bus. The memory clock is 200 MHz, with a 400 Mbps effective data rate, yielding a total bandwidth of 6.400 GB/s. The DDR type doubles the data rate relative to single-data-rate memory, but the modest 200 MHz clock keeps the absolute bandwidth at 6.400 GB/s. For high resolutions, the 128 MB capacity is the more pressing constraint. A framebuffer at elevated resolutions, combined with depth and stencil buffers, can consume a substantial portion of the 128 MB pool, leaving reduced space for textures and vertex data. The 6.400 GB/s bandwidth then becomes the limiting factor when textures are large or multiple render targets are in use. The pixel rate of 1.280 GPixel/s and texture rate of 1.280 GTexel/s are matched to this bandwidth, suggesting that in balanced workloads the memory subsystem can keep pace with the rasterizer. However, workloads that exceed the 128 MB capacity would force the GPU to use system memory over the AGP 4x interface, which operates at a far lower bandwidth than the dedicated 6.400 GB/s figure. The 128-bit bus width is a middle-ground configuration, and the 200 MHz memory clock is modest by the standards of later GPUs in the database. For users running high-resolution displays, the 128 MB frame buffer and 6.400 GB/s bandwidth would likely prove insufficient for texture-heavy scenes, necessitating reduced resolutions or smaller texture budgets.

Who Should Consider It

The Mobility FireGL T2 is suited to workloads that align with its specifications: OpenGL 2.0-based professional applications running at moderate resolutions. The 128 MB VRAM and 6.400 GB/s bandwidth support texture loads that fit within that capacity. The 50th percentile placement indicates that, among all GPUs in the database, this part delivers median-level performance, adequate for professional OpenGL 2.0 workloads of its era, but not for demanding high-end rendering. The DirectX 9.0 (9_0) support allows for early DirectX 9 applications, while the OpenGL 2.0 support addresses the professional market segment that the FireGL branding targets. The 4 TMUs and 4 ROPs, combined with the 1.280 GPixel/s pixel rate and 1.280 GTexel/s texture rate, bound the complexity of scenes that can be rendered smoothly. Users with high-resolution displays or large texture sets would exceed the 128 MB frame buffer and 6.400 GB/s bandwidth. The end-of-life production status means the GPU is only available in legacy systems; new purchases would target the successor, FirePro Mobility, instead. For users maintaining older mobile workstations, the Mobility FireGL T2 provides hardware acceleration for OpenGL 2.0 and DirectX 9.0 (9_0) workloads within the limits of its memory and fill-rate constraints.

Ray Tracing and Feature Set

The Mobility FireGL T2 has no dedicated ray tracing cores; the rtCores field is null. Tensor cores are also absent, with the tensorCores field likewise null. This leaves the 4 TMUs and 4 ROPs as the only rendering hardware, with no acceleration for ray-traced effects or tensor-based compute. The API support consists of DirectX 9.0 (9_0) and OpenGL 2.0; Vulkan is not listed. DirectX 9.0 (9_0) represents the DirectX generation that this part can accelerate, while OpenGL 2.0 provides the professional API compatibility expected of the FireGL line. The absence of Vulkan is consistent with the 2003 release date, as that API had not yet been introduced. Real-time ray tracing is not available on this hardware; the 1.280 GPixel/s pixel rate and 1.280 GTexel/s texture rate define the maximum rasterization throughput. The R300 architecture underpins the feature set, and the 130 nm process with 76 million transistors represents the physical implementation. For users requiring modern rendering features such as ray tracing or tensor-accelerated AI, this GPU offers no such capability. The feature set is firmly rooted in the early programmable-pipeline era, with DirectX 9.0 (9_0) as the highest API level supported.

Power and Cooling

The database does not specify a TDP for the Mobility FireGL T2; the tdp field is null. No suggested PSU is provided, and no power connector requirements are listed. These absences mean the power draw cannot be quantified from the available data. The physical characteristics offer indirect context: the chip is built on TSMC's 130 nm process with 76 million transistors on a 92 mm² die, giving a transistor density of 826.1K per mm². For a mobile part released in 2003, the power envelope would have been constrained by laptop thermal design, but the exact figure is not recorded. The AGP 4x bus interface is the connectivity standard, and in mobile implementations, power delivery is integrated into the motherboard rather than through standalone connectors. The end-of-life production status means that thermal solutions for this GPU are no longer manufactured. Users maintaining legacy systems would rely on the original cooling implementation. The lack of a TDP value and PSU recommendation limits the analysis to qualitative statements: the Mobility FireGL T2 is a mobile GPU, so its cooling requirements are tied to the laptop chassis rather than a separate power supply. The 130 nm process node is the only process-related data available; no wattage figure is recorded to characterize the thermal envelope further.