ATI FirePro V8700
AMD graphics card specifications and benchmark scores
At a Glance
AMDATI FirePro V8700 Specifications
ATI FirePro V8700 GPU Core
Shader units and compute resources
The ATI FirePro V8700 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
ATI FirePro V8700 Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the ATI FirePro V8700's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The ATI FirePro V8700 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
AMD's ATI FirePro V8700 Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The ATI FirePro V8700's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
ATI FirePro V8700 by AMD Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the ATI FirePro V8700, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
ATI FirePro V8700 Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the ATI FirePro V8700 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
TeraScale Architecture & Process
Manufacturing and design details
The ATI FirePro V8700 is built on AMD's TeraScale architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the ATI FirePro V8700 will perform in GPU benchmarks compared to previous generations.
AMD's ATI FirePro V8700 Power & Thermal
TDP and power requirements
Power specifications for the ATI FirePro V8700 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the ATI FirePro V8700 to maintain boost clocks without throttling.
ATI FirePro V8700 by AMD Physical & Connectivity
Dimensions and outputs
Physical dimensions of the ATI FirePro V8700 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
AMD API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the ATI FirePro V8700. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
ATI FirePro V8700 Product Information
Release and pricing details
The ATI FirePro V8700 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the ATI FirePro V8700 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
ATI FirePro V8700 Benchmark Scores
No benchmark data available for this GPU.
About ATI FirePro V8700
How It Compares
The ATI FirePro V8700 occupies the 50th percentile among all GPUs in the database, placing it squarely in the middle of the pack. This is a professional workstation card from AMD’s FirePro Terascale (Vx700) generation, built on the RV770 chip. With no nearest rivals listed in the benchmark data, its positioning must be understood through its architectural traits and raw compute figures rather than direct head-to-head comparisons. The card’s 50th percentile ranking indicates it outperforms roughly half of all recorded GPUs while trailing the other half, a reasonable standing for a 2008-era workstation part that has long since reached end-of-life status.
The V8700’s predecessor is the FireGL series, and its successor is the Radeon Pro GCN lineup. This places it at a transitional moment in AMD’s professional graphics history, bridging older fixed-function workstation designs and the later Graphics Core Next architecture. The card uses the TeraScale architecture, which was AMD’s unified shader design of that period, and it is fabricated on a 55 nm process at TSMC. The die contains 956 million transistors on a 256 mm² slice of silicon, yielding a transistor density of 3.7 million transistors per square millimeter, a figure that reflects the manufacturing capabilities of its era rather than modern standards.
Ray Tracing and Feature Set
The FirePro V8700 does not include dedicated ray tracing cores or tensor cores; both fields are null in the specification data. This is consistent with its 2008 release, predating hardware-accelerated ray tracing by more than a decade. The card’s API support is limited to DirectX 10.1 (shader model 10_1) and OpenGL 3.3, with no Vulkan support listed. For professional workloads of its time, this meant compatibility with DirectX 10-era applications and OpenGL 3.3-based CAD and DCC tools, but no path forward for modern graphics APIs.
The shading pipeline consists of 800 shading units, 40 texture mapping units, and 16 raster operation pipelines. These figures define the card’s parallel processing capability: the 800 shaders handle vertex and pixel work in a unified fashion, while the 40 TMUs and 16 ROPs manage texture filtering and pixel output. The pixel rate is 12.00 GPixel/s, and the texture rate is 30.00 GTexel/s. Floating-point performance is rated at 1,200.0 GFLOPS for FP32 operations, a substantial number for a workstation card of its generation, though FP16 and ray tracing capabilities are entirely absent. The card’s display outputs include one DVI port, two DisplayPort 1.0 connectors, and one S-Video output, enabling multi-monitor professional setups common in CAD and digital content creation environments.
Benchmark Performance
The benchmark data for the FirePro V8700 lists no individual scores and no nearest rivals, leaving the 50th percentile ranking and the average benchmark score of zero as the only quantitative performance indicators. The zero average score likely reflects the absence of standardized benchmark submissions rather than actual performance, making percentile comparisons the more meaningful metric. At the 50th percentile, the card sits at the median of the database’s GPU population, a position that suggests competent mid-range performance for its era, capable of handling professional workloads but not competing with high-end cards of its time.
Without rival scores or delta percentages, performance analysis must rely on the card’s raw specifications. The 1,200.0 GFLOPS FP32 throughput, combined with a 30.00 GTexel/s texture fill rate and 12.00 GPixel/s pixel fill rate, indicates a card designed for compute-heavy professional tasks rather than gaming. The 800 shading units provide substantial parallel processing headroom for OpenGL-based CAD applications, while the 16 ROPs limit pixel throughput relative to the shader count, a common trade-off in workstation cards that prioritize geometry and compute over fill-rate-heavy workloads. The 50th percentile standing suggests the V8700 delivers roughly median performance across all GPUs in the database, which for a 2008 workstation part is a credible result given the rapid advancement of GPU technology in subsequent years.
FAQ
Q: What is the manufacturing process for the ATI FirePro V8700?
A: The card is fabricated on a 55 nm process at TSMC, containing 956 million transistors on a 256 mm² die.
Q: Does the FirePro V8700 support hardware ray tracing?
A: No. The card has no ray tracing cores or tensor cores, and its API support is limited to DirectX 10.1 and OpenGL 3.3, with no Vulkan support.
Q: What is the FP32 performance of this card?
A: The FirePro V8700 delivers 1,200.0 GFLOPS of FP32 compute performance, alongside a pixel rate of 12.00 GPixel/s and a texture rate of 30.00 GTexel/s.
Q: How much memory does the FirePro V8700 have and what type is it?
A: It comes with 1024 MB of GDDR5 memory on a 256-bit bus, providing 108.8 GB/s of memory bandwidth.
Q: What is the power consumption and power connector requirement?
A: The card has a TDP of 151 W and requires two 6-pin power connectors, with a suggested power supply rating of 450 W.
Q: When was the FirePro V8700 released and what was its launch MSRP?
A: It was released on September 10, 2008, with a launch MSRP of 1,499 USD.
Memory Subsystem
The FirePro V8700 is equipped with 1024 MB of GDDR5 memory, a notable feature for a 2008 workstation card given that GDDR5 was just entering the mainstream market. The memory operates at 850 MHz, which translates to an effective data rate of 3.4 Gbps, and is connected via a 256-bit bus. This configuration yields a memory bandwidth of 108.8 GB/s, a figure that balances capacity and throughput for professional applications of its generation.
For high-resolution workloads, the 1024 MB capacity is a limiting factor by modern standards, but it was adequate for the display resolutions and texture sizes common in 2008-era CAD and DCC tools. The 256-bit bus width provides a solid foundation for memory bandwidth, and the GDDR5 type offers higher data rates per pin compared to the GDDR3 memory found in many contemporaries. The 108.8 GB/s bandwidth allows the 800 shading units to remain fed with data during compute-intensive operations, though the relatively small frame buffer means large textures or multi-display configurations could strain memory capacity. The dual DisplayPort 1.0 outputs support high-resolution monitors of the period, and the card’s dual-slot form factor with a 254 mm length and 111 mm height accommodates the memory and cooling infrastructure required for the 151 W TDP. The memory subsystem as a whole reflects a deliberate balance between capacity, bandwidth, and power consumption, prioritizing sustained throughput for professional rendering and simulation tasks over the raw capacity that would become common in later generations.
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