RADEON

ATI FirePro V3750

AMD graphics card specifications and benchmark scores

256 MB
VRAM
MHz Boost
48W
TDP
128
Bus Width

At a Glance

AMD
VRAM 256 MB
Shaders 320
Bus Width 128-bit
TDP 48W
Memory Type GDDR3
Architecture TeraScale
nm
Process 55 nm
Released Sep 2008

ATI FirePro V3750 Specifications

GPU Core

Shader units and compute resources

The ATI FirePro V3750 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
320
Shaders
320
TMUs
32
ROPs
8
Compute Units
4

ATI FirePro V3750 Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the ATI FirePro V3750's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The ATI FirePro V3750 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

GPU Clock
550 MHz
Memory Clock
700 MHz 1400 Mbps effective
GDDR GDDR 6X 6X

AMD's ATI FirePro V3750 Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The ATI FirePro V3750's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
256 MB
VRAM
256 MB
Memory Type
GDDR3
VRAM Type
GDDR3
Memory Bus
128 bit
Bus Width
128-bit
Bandwidth
22.40 GB/s

ATI FirePro V3750 by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the ATI FirePro V3750, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
16 KB (per CU)
L2 Cache
128 KB

ATI FirePro V3750 Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the ATI FirePro V3750 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
352.0 GFLOPS
Pixel Rate
4.400 GPixel/s
Texture Rate
17.60 GTexel/s

TeraScale Architecture & Process

Manufacturing and design details

The ATI FirePro V3750 is built on AMD's TeraScale architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the ATI FirePro V3750 will perform in GPU benchmarks compared to previous generations.

Architecture
TeraScale
GPU Name
RV730
Process Node
55 nm
Foundry
TSMC
Transistors
514 million
Die Size
146 mm²
Density
3.5M / mm²

Power & Thermal

TDP and power requirements

Power specifications for the ATI FirePro V3750 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the ATI FirePro V3750 to maintain boost clocks without throttling.

TDP
48 W
TDP
48W
Power Connectors
None
Suggested PSU
200 W

ATI FirePro V3750 by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the ATI FirePro V3750 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
Single-slot
Length
168 mm 6.6 inches
Height
111 mm 4.4 inches
Bus Interface
PCIe 2.0 x16
Display Outputs
1x DVI2x DisplayPort 1.0
Display Outputs
1x DVI2x DisplayPort 1.0

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the ATI FirePro V3750. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
10.1 (10_1)
DirectX
10.1 (10_1)
OpenGL
3.3
OpenGL
3.3
OpenCL
1.1
Shader Model
4.1

ATI FirePro V3750 Product Information

Release and pricing details

The ATI FirePro V3750 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the ATI FirePro V3750 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
Sep 2008
Launch Price
199 USD
Production
End-of-life
Predecessor
FireGL
Successor
Radeon Pro GCN

About ATI FirePro V3750

The ATI FirePro V3750 is an AMD GPU built around the RV730 chip and the TeraScale architecture. TSMC fabricated the 514-million-transistor die on a 55 nm process, with a die size of 146 mm² and a transistor density of 3.5M per mm². It was released on 2008-09-10, belongs to the FirePro Terascale (Vx700) generation, and is listed as end-of-life. The launch MSRP was 199 USD, and its predecessor and successor in the lineup are FireGL and Radeon Pro GCN respectively.

Who Should Consider It

The database record for the FirePro V3750 contains no benchmark entries, and the average benchmark score is listed as 0. The percentile versus all GPUs is 50, which places the card at the median of the database distribution, but there are no measured scores to support resolution-specific performance claims. This means any guidance about resolutions and settings has to be read from the published specifications rather than from benchmark results.

The memory subsystem is 256 MB of GDDR3 on a 128-bit bus, with a bandwidth of 22.40 GB/s. A 256 MB framebuffer is a hard constraint for scene complexity, so high-resolution, high-texture workloads are not realistic targets. The pixel rate of 4.400 GPixel/s and texture rate of 17.60 GTexel/s indicate a modest fill and texture throughput envelope. The execution resources are 320 shading units, 32 TMUs, and 8 ROPs, with FP32 compute rated at 352.0 GFLOPS. Those figures point toward lower resolutions, lighter shader loads, and less demanding texture settings.

The API list reinforces that positioning: the card supports DirectX 10.1 (10_1) and OpenGL 3.3, while Vulkan is not listed. Users running applications built around those API levels are the relevant audience. By contrast, software that depends on Vulkan or on modern high-framebuffer rendering does not align with this specification. The power envelope also matters: the GPU has a 48 W TDP, requires no auxiliary power connectors, and carries a suggested PSU rating of 200 W. For systems with that power ceiling, the card is a plausible fit. The single-slot form factor, 168 mm (6.6 inches) length, and 111 mm (4.4 inches) height further define the mechanical footprint.

In short, the data describes a low-power, legacy-API card best suited to modest resolution and settings levels, not to high-end modern rendering.

How It Compares

Nearest-rival information is not present in the database record. The nearestRivals array is empty, so there are no named competitors, no comparative scores, and no deltaPct values to cite. The only cross-model signal available is percentileVsAllGpus, which is 50. That places the FirePro V3750 at the median of all GPUs in the database, but a median percentile without rival entries does not establish a relationship to any specific product.

The absence of benchmarks is equally important. With an empty benchmarks array and an average benchmark score of 0, there is no measured performance average to use as a comparison baseline. As a result, the data cannot support a statement that the FirePro V3750 is faster or slower than any particular rival. Any head-to-head claim would require competitor data that the record does not include.

Power and Cooling

Power and cooling requirements are clearly specified. The TDP is 48 W, and the suggested PSU rating is 200 W. The card has no auxiliary power connectors; the powerConnectors field is listed as “None.” It is a single-slot card, with a length of 168 mm (6.6 inches) and a height of 111 mm (4.4 inches). The memory clock is 700 MHz, listed as 1400 Mbps effective, producing a memory bandwidth of 22.40 GB/s over the 128-bit bus. The bus interface is PCIe 2.0 x16. No further cooling-solution details are listed in the data, but the external power connector requirement is nil.

FAQ

Q: What architecture and process node does the FirePro V3750 use?

A: It uses the TeraScale architecture with the RV730 chip. TSMC fabricates the 514-million-transistor die on a 55 nm process, with a die area of 146 mm² and a transistor density of 3.5M per mm².

Q: What memory configuration does the card have?

A: It has 256 MB of GDDR3 on a 128-bit bus. The memory clock is 700 MHz, or 1400 Mbps effective, and the resulting bandwidth is 22.40 GB/s.

Q: What are the power requirements?

A: The TDP is 48 W. The suggested PSU is rated at 200 W, and no auxiliary power connectors are required.

Q: Does the FirePro V3750 support ray tracing or tensor cores?

A: No. The database record lists RT cores as null and tensor cores as null. The supported APIs are DirectX 10.1 (10_1) and OpenGL 3.3, with Vulkan not listed.

Q: What display outputs are available?

A: The card provides 1x DVI and 2x DisplayPort 1.0 outputs.

Q: What is the production status and release date?

A: It was released on 2008-09-10 and is listed as end-of-life. The predecessor is FireGL, and the successor is Radeon Pro GCN.

Ray Tracing and Feature Set

The feature set of the FirePro V3750 is defined by the absence of ray tracing and tensor hardware: both rtCores and tensorCores are null in the record. The GPU uses the RV730 TeraScale architecture, with 320 shading units, 32 TMUs, and 8 ROPs. Pixel throughput is 4.400 GPixel/s, texture throughput is 17.60 GTexel/s, and FP32 compute is 352.0 GFLOPS.

API support is DirectX 10.1 (10_1) and OpenGL 3.3. Vulkan is not listed, so there is no Vulkan API entry in the specification. The display configuration consists of 1x DVI and 2x DisplayPort 1.0. The card connects through a PCIe 2.0 x16 interface. With RT cores and tensor cores both recorded as null, no dedicated ray tracing acceleration or tensor core capability is present in the specification. The chip itself contains 514 million transistors on a 55 nm TSMC process, with a die size of 146 mm².

Detailed benchmark scores and charts for the ATI FirePro V3750 are below.

Benchmark Scores

No benchmark data available for this GPU.

Compare with Other GPUs

Select another GPU to compare specifications and benchmarks side-by-side.

Browse GPUs