AMD Radeon R9 M275

The AMD Radeon R9 M275 is a GCN 1.0 mobile GPU from the Gem System (R9 M200) generation, fabricated on TSMC's 28 nm process. The specification sheet lists 640 shading units, 40 texture mapping units, and 16 ROPs, with a peak FP32 throughput of 1,184.0 GFLOPS. The database places it at the 50th percentile across all GPUs, yet no benchmark entries and no nearest rivals are recorded, so the published compute, memory, and API data define the entire evaluation.

Benchmark Performance

The FACT PACK contains no benchmark scores and no nearest-rival entries for the R9 M275; the average benchmark score is 0 and the percentileVsAllGpus field is 50. That percentile is the single positional data point available: it indicates the GPU sits exactly at the median of the database, outperforming half of all recorded GPUs and trailing the other half. In the absence of rival deltas, the raw throughput figures must carry the interpretation.

The compute ceiling is defined by three numbers. FP32 performance is 1,184.0 GFLOPS, which is the peak single-precision rate from the 640 shading units at the 925 MHz boost clock. The pixel fill rate is 14.80 GPixel/s, derived from 16 ROPs, and the texture rate is 37.00 GTexel/s from 40 TMUs. These three figures are consistent with a small, low-power mobile chip of the GCN 1.0 era, and they set expectations for standard-resolution workloads rather than high-refresh or high-resolution rendering.

Because the data does not include any rival scores, percentage deltas cannot be computed. The 50th percentile, however, is a meaningful anchor: it tells us that the R9 M275 is not an outlier in either direction — it is a middle-of-the-road part. The lack of benchmark entries in the pack means no synthetic or gaming score can be cited, but the compute and memory figures give a coherent picture of a GPU that can handle modest rendering tasks without the headroom required for demanding titles.

Who Should Consider It

The memory subsystem is the primary constraint for any use case. With 2 GB of GDDR5 and 64.00 GB/s of bandwidth, the R9 M275 is suited to standard-resolution gaming at conservative detail settings. The 2 GB frame buffer is enough for ordinary textures at that resolution, but it will be strained by high-resolution texture packs or by moving to higher resolutions where the 128-bit bus and 64 GB/s bandwidth become limiting factors. The data does not include any game-specific scores, so recommendations must be drawn from the capacity and bandwidth figures alone.

The compute throughput of 1,184 GFLOPS and the pixel rate of 14.80 GPixel/s suggest the GPU can drive basic 3D rendering and light gaming, but the modest ROP count of 16 and the 64 GB/s bandwidth cap the effective performance at lower settings. Users running older or less demanding titles with reduced effects would be the natural audience. The GPU is not positioned for high-refresh monitors or for high-resolution rendering, as the 2 GB buffer and bandwidth would be exceeded quickly. For productivity tasks that rely on OpenGL 4.6 or Vulkan 1.2.170, the API support is present, but the raw throughput is limited.

Ray Tracing and Feature Set

The FACT PACK lists no ray tracing cores and no tensor cores for the R9 M275; both fields are null. This means the GPU has no dedicated hardware acceleration for ray-traced effects or for tensor-based workloads such as deep learning inference. Any ray tracing would have to be handled in software or via compute shaders, which is not a practical path given the 1,184 GFLOPS FP32 budget.

The API support is more complete than the hardware feature set. The GPU supports DirectX 12 (11_1), OpenGL 4.6, and Vulkan 1.2.170. The DirectX 12 entry is specifically feature level 11_1, which is the shader model and resource binding tier exposed by the GCN 1.0 architecture. Vulkan 1.2.170 and OpenGL 4.6 provide modern cross-platform access, but the underlying hardware is from the 2014 release period and lacks the fixed-function ray tracing or tensor units found in later architectures. The architecture is GCN 1.0, which predates the dedicated acceleration blocks that appear in newer GPU generations.

FAQ

Q: What is the memory configuration of the Radeon R9 M275?

A: It has 2 GB of GDDR5 memory on a 128-bit bus, with 64.00 GB/s of bandwidth and a memory clock of 1000 MHz (4 Gbps effective).

Q: Which graphics APIs does the R9 M275 support?

A: It supports DirectX 12 (11_1), OpenGL 4.6, and Vulkan 1.2.170.

Q: Does the R9 M275 have ray tracing or tensor cores?

A: No. The data lists no RT cores and no tensor cores, so there is no dedicated hardware for ray tracing or tensor workloads.

Q: What is the underlying architecture and process node?

A: The GPU uses the GCN 1.0 architecture with the Venus chip, fabricated by TSMC on a 28 nm process. It contains 1,500 million transistors on a 123 mm² die, giving a transistor density of 12.2M per mm².

Q: When was the R9 M275 released, and is it still in production?

A: It was released on 2014-01-27 and is now end-of-life.

Q: What are the core counts and clock speeds?

A: It has 640 shading units, 40 TMUs, and 16 ROPs. The base clock is 900 MHz with a boost clock of 925 MHz.

Power and Cooling

The FACT PACK does not include a TDP figure, a slot width, power connector requirements, or a suggested PSU rating for the R9 M275. All four fields — tdp, slotWidth, powerConnectors, and suggestedPsu — are null. This means no power draw number can be cited, and no cooling or power supply recommendation can be derived from the data.

What is available is the process and transistor context. The GPU is built on TSMC's 28 nm process with 1,500 million transistors on a 123 mm² die. These figures are consistent with a modestly sized mobile chip, but they do not translate into a specific wattage. The absence of a TDP field is notable for a mobile GPU, where thermal design power is a key specification; the database entry simply does not record it. Similarly, the lack of a suggested PSU and power connector data means the integration requirements are unspecified. Integrators would need to consult original vendor documentation for thermal and power specifications.

Memory Subsystem

The memory subsystem is fully specified. The R9 M275 uses 2 GB of GDDR5 on a 128-bit bus, with a memory clock of 1000 MHz and an effective data rate of 4 Gbps. Total bandwidth is 64.00 GB/s. The 128-bit bus width is a common choice for mobile GPUs of this class, and the 64 GB/s bandwidth reflects the combination of the 4 Gbps effective rate and the narrow bus.

The implications for high resolutions are direct. A 64 GB/s bandwidth figure is modest by modern standards, and it will limit texture streaming and fill-rate-heavy workloads. The 2 GB capacity is the other constraint: at standard resolutions, ordinary textures fit comfortably, but higher resolutions or large texture sets will exceed the buffer, forcing lower quality settings or causing asset thrashing. The pixel rate of 14.80 GPixel/s and texture rate of 37.00 GTexel/s are the downstream consumers of this bandwidth, and they are in line with a GPU designed for entry-level mobile gaming rather than high-end rendering.

How It Compares

The FACT PACK lists no nearest rivals for the R9 M275; the nearestRivals array is empty. Consequently, no percentage deltas, rival names, or comparative scores can be cited. The only positional data is the 50th percentile, which places the GPU at the median of the database.

In terms of generation context, the predecessor is listed as "Solar System" and the successor as "Polaris Mobile" — both generation names from the same product family lineage, with no specifications provided. The R9 M275 itself belongs to the Gem System (R9 M200) generation. Without rival entries, a head-to-head comparison is not possible from the data; the GPU must be assessed on its own published specifications: 1,184 GFLOPS FP32, 64 GB/s bandwidth, 2 GB VRAM, and GCN 1.0 feature support.