AMD Radeon R1E Mobile Graphics

The AMD Radeon R1E Mobile Graphics is a GCN 2.0 integrated GPU built on the Beema chip. GlobalFoundries produces the 28 nm die, which holds 930 million transistors within 107 mm², for a transistor density of 8.7M / mm². The part is listed under the GCN 2.0 IGP (Mullins Mobile) generation, released on February 22, 2016, and designated end-of-life. It uses a system-shared memory architecture, an IGP bus interface, and portable-device-dependent display outputs, making it a host-integrated graphics solution rather than a discrete add-in card.

Benchmark Performance

The database's benchmark array is empty, and the nearestRivals list contains no entries. There are no rival names, scores, or deltaPct values to cite, so an exact percentage-delta comparison is impossible from this record. The one aggregate positioning is an average benchmark score of 0 and a percentileVsAllGpus of 50, which places the R1E at the midpoint of the database's GPU population. Because no tested workload results exist, the raw silicon limits provide the only quantitative performance baseline.

The silicon limits begin with 64 shading units, 8 texture mapping units, and 4 ROPs. The listed pixel rate is 1.988 GPixel/s, and the texture rate is 3.976 GTexel/s. FP32 compute is 63.62 GFLOPS. These numbers describe a small execution resource pool. The 8 TMUs supply texture fetching, while the 4 ROPs cap framebuffer writes. Since memory size, type, and bus width are system shared and bandwidth is system dependent, the actual rendering ceiling depends on the host memory subsystem rather than a fixed VRAM interface.

No base, boost, or game clock values are listed, so dynamic clock behavior cannot be analyzed from the data. The memory clock is also listed as system shared, meaning there is no dedicated video memory frequency to measure. Additionally, no FP16 figure is present, so mixed-precision compute analysis is not possible from this record. The benchmark section is therefore a fixed hardware profile rather than a tested performance graph. That profile — 64 shaders, 8 TMUs, 4 ROPs, 1.988 GPixel/s, 3.976 GTexel/s, and 63.62 GFLOPS — is consistent with a modest integrated GPU, although the percentile rank of 50 is the only relative placement the database provides.

Ray Tracing and Feature Set

No RT core count and no tensor core count are listed for the R1E. The GPU therefore has no dedicated hardware for ray tracing or tensor operations in the record. Feature support comes from API compatibility and the GCN 2.0 architecture rather than specialized acceleration blocks. The listed APIs are DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170. DirectX 12 support at feature level 12_0 enables DX12 pipelines, while Vulkan 1.2.170 and OpenGL 4.6 provide broad API coverage. None of these APIs change the fact that all programmable shading work runs through the 64 shading units.

Display outputs are portable device dependent, so the physical connector set is determined by the host system. The bus interface is IGP, and the slot width is IGP, reinforcing that this is not an add-in card. Memory is system shared in size, type, and bus width, with system dependent bandwidth. The GPU is therefore inseparable from the host platform's memory subsystem and output design. Software feature compatibility may be broad, but the underlying memory and output flexibility is tied to whatever portable device carries the chip.

Generationally, the R1E sits between TeraScale 3 IGP and GCN 3.0 IGP in AMD's IGP sequence. It uses GCN 2.0 on the Beema chip, manufactured on a 28 nm process at GlobalFoundries. The die occupies 107 mm² and contains 930 million transistors, yielding a density of 8.7M / mm². These silicon attributes confirm a compact integrated part rather than a discrete high-performance GPU. The absence of RT and tensor core listings is a noteworthy distinction: the feature set is defined by API exposure and general-purpose shaders, not by dedicated ray tracing or tensor hardware.

Who Should Consider It

With a pixel rate of 1.988 GPixel/s and a texture rate of 3.976 GTexel/s, the R1E is positioned for low-resolution, modest-settings rendering. The 64-shader configuration and 4-ROP count limit how much detail can be pushed per frame. FP32 compute of 63.62 GFLOPS reinforces that ceiling. Users should consider this GPU for portable devices where software compatibility matters more than raw throughput.

The API list — DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170 — gives a reasonably modern software foundation. However, because memory bandwidth is system dependent, performance will shift with the host platform. There is no dedicated VRAM allocation; memory size, type, and bus width are all system shared. For workloads that are light enough to fit within these limits, the R1E can serve as a baseline IGP for general-purpose rendering. The 15 W TDP also makes it suitable for power-conscious system designs, though the exact thermal behavior depends on the host device.

The absence of RT cores rules out hardware ray tracing. The 4 ROPs and 1.988 GPixel/s pixel rate set a firm cap on final framebuffer output. With end-of-life status and a February 22, 2016 release date, the R1E is not a target for new high-end systems; it is an integrated solution tied to its platform generation. Buyers evaluating this part should expect low-overhead 3D rendering and broad API compatibility, not high-fillrate or ray-traced workloads.

Power and Cooling

The TDP is 15 W. No power connectors are listed, and the suggested PSU field is null, so this IGP does not require a separate power supply specification. The slot width is IGP and the bus interface is IGP, meaning power delivery comes from the host board rather than auxiliary cables. There is no length, height, or width recorded for the card, and no cooler specification is present in the database.

Because the display outputs are portable device dependent and the memory subsystem is system shared, the power and cooling envelope is defined by the host device rather than by a standalone card design. The 15 W value is the only power figure in the record. A system integration plan would need to treat this GPU as part of the host platform's integrated design, with no connector-level power input and no discrete PSU recommendation to follow.

FAQ

Q: What architecture and process node does the Radeon R1E Mobile Graphics use?

A: It uses GCN 2.0, on the Beema chip, fabricated by GlobalFoundries on a 28 nm process. The generation is listed as GCN 2.0 IGP (Mullins Mobile).

Q: Does it have RT cores or tensor cores?

A: No RT core count and no tensor core count are listed for this GPU. The feature set is defined by GCN 2.0 and API support rather than dedicated ray tracing or tensor hardware.

Q: What APIs does it support?

A: It supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.2.170.

Q: How much video memory does it have?

A: The memory size, type, and bus width are all listed as system shared. Memory bandwidth is system dependent, so there is no fixed VRAM allocation.

Q: What is the TDP and does it need power connectors?

A: The TDP is 15 W. No power connectors are listed, and the slot width is IGP, so power is supplied by the host system rather than a separate connector.

Q: When was it released, and what comes before and after it?

A: It was released on February 22, 2016, and is end-of-life. Its predecessor is TeraScale 3 IGP and its successor is GCN 3.0 IGP.