AMD Radeon Pro WX 7100 Mobile

The AMD Radeon Pro WX 7100 Mobile is a professional-grade graphics solution built on the GCN 4.0 architecture, targeting mobile workstations. Positioned as an end-of-life product with a 50th percentile standing against all GPUs, this card offers a balanced mix of compute and memory capabilities for its generation. The data indicates a focus on sustained professional workloads rather than raw gaming performance, with the 14 nm process node from GlobalFoundries housing 5,700 million transistors on a 232 mm² die.

Benchmark Performance

The benchmark data shows the Radeon Pro WX 7100 Mobile sits at the median of all GPUs, with a percentile rank of 50. This places it in a neutral position — not a top-tier performer, but equally not a weak contender. The average benchmark score of 0 should be interpreted as a baseline reference point, indicating that this card's performance profile is defined more by its architectural traits than by standout synthetic numbers.

The FP32 compute throughput of 5.728 TFLOPS is the primary indicator of its processing capability. This level of single-precision performance is directly tied to the card's 2304 shading units operating at a base clock of 1188 MHz and a boost clock of 1243 MHz. The texture rate of 179.0 GTexel/s and pixel rate of 39.78 GPixel/s further define its throughput limits, suggesting the card is well-suited for tasks that rely on sustained shader execution rather than rapid geometry processing.

With no nearest rivals listed in the data, the performance analysis relies on absolute figures. The 5.728 TFLOPS FP32 figure represents a solid compute foundation for professional applications like CAD or engineering simulation, where precision and consistency matter more than peak burst performance. The 50th percentile ranking confirms this card delivers average performance across a broad spectrum of workloads, making it a predictable choice for a mobile workstation where thermal constraints limit outright speed.

How It Compares

The absence of nearest rival data means direct comparisons are limited to the card's own metrics. However, the architectural choices provide context. The GCN 4.0 design with 144 texture mapping units and 32 ROPs suggests a configuration that balances texturing and pixel output for professional visualization tasks. This is a deliberate trade-off — fewer ROPs than gaming-focused cards of the same era, but a higher texture rate to handle complex material rendering in professional applications.

The 14 nm process node and 5,700 million transistor count indicate a mid-range die size for its generation. This positions the card as a mainstream professional solution, not a flagship. The 232 mm² die size allows for reasonable power efficiency within the 130 W TDP envelope, which is critical for mobile implementations. The card's predecessor is FirePro Mobile, placing it in a lineage of professional mobile GPUs, though no successor is listed in the available data.

Ray Tracing and Feature Set

The Radeon Pro WX 7100 Mobile does not include dedicated ray tracing cores or tensor cores, as indicated by the null values for these specifications. Instead, the card relies on the GCN 4.0 architecture's traditional shader-based approach for rendering effects. This means any ray tracing workloads would be handled through compute shaders via the 2304 shading units, which is less efficient than dedicated hardware but still functional for professional pre-visualization tasks.

API support is a strong point for this card. It supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.3. The Vulkan 1.3 support is particularly relevant for modern professional applications that leverage this API for cross-platform performance. OpenGL 4.6 ensures compatibility with legacy CAD and GIS software that often requires this API. The DirectX 12 (12_0) feature level provides access to modern rendering features, though the lack of hardware ray tracing means it cannot take full advantage of the highest-tier DirectX 12 Ultimate features.

The display outputs are listed as "Portable Device Dependent," meaning the connectivity options vary based on the laptop manufacturer's design. This is typical for mobile workstation GPUs, where the chassis determines the actual ports available to the user. The PCIe 3.0 x16 bus interface provides ample bandwidth for data transfer between the GPU and the host system.

FAQ

Q: What is the thermal design power of this GPU?

A: The TDP is rated at 130 W, which is a moderate power draw for a mobile professional GPU, requiring adequate cooling within the laptop chassis.

Q: Does this card support hardware ray tracing?

A: No, the specifications list no ray tracing cores. The GPU relies on its 2304 shading units for any ray tracing calculations via software methods.

Q: What memory configuration does the Radeon Pro WX 7100 Mobile use?

A: It uses 8 GB of GDDR5 memory on a 256-bit bus, providing a memory bandwidth of 160.0 GB/s.

Q: What is the production status of this GPU?

A: The production status is listed as "End-of-life," meaning AMD has ceased manufacturing this model.

Q: Which APIs are supported by this card?

A: The card supports DirectX 12 (12_0), OpenGL 4.6, and Vulkan 1.3.

Q: What form factor does this GPU use?

A: It is an MXM Module, a standardized mobile expansion form factor, with a length of 25 mm (1 inch).

Power and Cooling

The Radeon Pro WX 7100 Mobile is rated at a TDP of 130 W. This power draw is a critical consideration for mobile workstation design, as it requires a cooling solution capable of dissipating this heat sustainably under load. The card uses no external power connectors, relying instead on the MXM module interface to draw power from the laptop's internal power delivery system. This integration simplifies installation but means the laptop's power brick and internal voltage regulators must be rated for the GPU's demands.

With no suggested PSU listed, the power requirements are entirely dependent on the host laptop's design. The absence of power connectors indicates a self-contained module that receives power through the MXM slot, which typically provides up to 100-130 W depending on the slot's specification. The 130 W TDP sits at the upper limit of what MXM modules can draw, so the laptop must have robust power delivery circuitry to maintain stable performance.

Cooling is handled by the laptop's thermal solution, as the GPU itself has no integrated fan or heatsink. The 14 nm process node helps manage heat density, but the 5,700 million transistors on a 232 mm² die still require active cooling under sustained workloads. The card's end-of-life status means replacement availability may be limited, so thermal management in existing systems should be monitored to prevent performance degradation over time.

Memory Subsystem

The memory subsystem is built around 8 GB of GDDR5 memory, operating at an effective speed of 5 Gbps. The 256-bit bus width provides a memory bandwidth of 160.0 GB/s. This configuration is well-suited for high-resolution professional work, where large datasets and textures must be accessed quickly. The 8 GB capacity allows for multiple large models or high-resolution textures to reside in VRAM simultaneously, reducing the need for constant data transfers from system memory.

At 160.0 GB/s, the bandwidth is adequate for the card's 5.728 TFLOPS compute throughput, ensuring that the shading units do not starve for data. For 4K resolution workloads, this bandwidth supports smooth texture streaming and geometry processing, though it may not be sufficient for the most demanding real-time 3D scenes with heavy post-processing effects. The memory clock of 1250 MHz (5 Gbps effective) is a standard speed for GDDR5 of this generation, balancing power consumption with performance.

The 256-bit bus width is a key factor in achieving this bandwidth. Wider buses generally require more complex PCB layouts, but in an MXM module format, the design is optimized for the physical constraints of a laptop. The 8 GB capacity is generous for 2017-era professional workloads, allowing multitasking between multiple applications without out-of-memory errors. The memory subsystem's performance characteristics suggest the card is best utilized in scenarios where moderate to high resolution rendering is required, with the understanding that extreme resolutions or massive scene complexities may hit bandwidth limitations.