AMD Radeon Instinct MI60

AMD's Radeon Instinct MI60 is a 7 nm accelerator built on the GCN 5.1 architecture with the Vega 20 chip. TSMC is the foundry, and the die contains 13,230 million transistors on a 331 mm² footprint, which works out to a transistor density of 40.0M per mm². The card uses 32 GB of HBM2 on a 4096-bit interface, with memory bandwidth rated at 1.02 TB/s. It belongs to the Radeon Instinct generation, and the database lists its predecessor as the FirePro Data Center series. Its release date is entered as 2018-11-17, its production status is end-of-life, and no successor is listed in the fact pack.

Benchmark Performance

The benchmark fields for the MI60 are not populated. The benchmarks array is empty, the average benchmark score is 0, and the nearestRivals list contains no entries. As a result, exact percentage deltas to other accelerators cannot be computed from this fact pack, and the usual rival-scoring language cannot be used here. The only relative metric present is percentileVsAllGpus, which is 50. That places the MI60 at the median of the database's GPU distribution, but with no average score and no rival records, there is no way to turn that percentile into a specific victory or deficit margin.

What the record does contain is theoretical throughput data. FP32 compute is listed at 14.75 TFLOPS. FP16 compute is listed at 29.49 TFLOPS with a 2:1 ratio, meaning the FP16 path is exactly twice the FP32 rate. The card also has a pixel fill rate of 115.2 GPixel/s and a texture fill rate of 460.8 GTexel/s. These fill rates are backed by 4096 shading units, 256 texture mapping units, and 64 ROPs. The core clocks enter the database as 1200 MHz base and 1800 MHz boost; the memory clock is listed as 1000 MHz, with 2 Gbps effective data rate. No game clock is listed in the fact pack.

Because there are no nearestRivals entries, no competitor names and no deltaPct values are available to compare against. The benchmark section can therefore validate raw compute rates and the median overall percentile, but it cannot validate application-specific performance claims. The data should be read as a specification-level profile rather than a measured-score ranking.

Power and Cooling

The MI60 is rated at a 300 W TDP, and the database suggests a 700 W power supply for systems using it. Power delivery requires a 6-pin PCIe connector and an 8-pin PCIe connector, so both rails must be present. The slot width is dual-slot, meaning the card occupies a dual-slot bracket. Its length is listed as 267 mm, or 10.5 inches, and its height is 111 mm, or 4.4 inches. Width is not given in the fact pack, so chassis clearance on that axis cannot be evaluated from this record.

The physical and electrical design sits on a 7 nm TSMC process. The die size is 331 mm², with 13,230 million transistors. That produces the 40.0M per mm² density figure. Those process and packaging details are the context for a 300 W accelerator with 4096 shading units and a 4096-bit memory interface. The fact pack does not describe the cooler itself, so fan type, heatsink mass, and noise behavior are not specified in the data.

The card interfaces with the host through PCIe 4.0 x16. System builders should note the dual-slot footprint, the 267 mm length, the 111 mm height, the need for a 6-pin plus 8-pin power connection, and the suggested 700 W PSU. The only display output is a single mini-DisplayPort 1.4a, which is not a multi-monitor output suite. The production status is end-of-life, so the card is recorded as past its original release period, with no successor listed in the fact pack.

Ray Tracing and Feature Set

The fact pack records rtCores as null and tensorCores as null. That means the data includes no dedicated ray tracing core count and no dedicated tensor core count for the MI60. No hardware-accelerated ray tracing claims can be made from this record, and no tensor-accelerated operation claims can be made either. The MI60's feature set instead rests on the GCN 5.1 architecture and the Vega 20 chip. The generation field is Radeon Instinct (MIx), so the card is tied to that product generation.

Shader resources are substantial on paper. The card has 4096 shading units, 256 TMUs, and 64 ROPs, with pixel and texture rates of 115.2 GPixel/s and 460.8 GTexel/s respectively. The FP16 compute rate of 29.49 TFLOPS, exactly double the FP32 rate of 14.75 TFLOPS, is the most compute-focused feature in the record. This is a 2:1 FP16/FP32 ratio, which is useful for workloads that can operate at reduced precision.

API support is listed as DirectX 12 (12_1), OpenGL 4.6, and Vulkan 1.3. DirectX 12 (12_1) indicates a 12_1 feature level. OpenGL 4.6 and Vulkan 1.3 give the card modern graphics and compute API paths. Display connectivity is just one mini-DisplayPort 1.4a, reinforcing that the board is an accelerator rather than a desktop graphics adapter. No tensor cores and no RT cores are present in the data, so the MI60's feature set is built around standard shader compute and memory bandwidth, not dedicated tensor or ray tracing hardware.

Who Should Consider It

With no application benchmark scores in the fact pack, resolution and settings recommendations cannot be tied to measured frame rates. Instead, the sensible guidance comes from the card's capacity and throughput. The MI60 has 32 GB of HBM2, 1.02 TB/s of memory bandwidth, 14.75 TFLOPS of FP32, and 29.49 TFLOPS of FP16. Software that needs more than typical memory capacity or very high memory bandwidth is the most plausible target. Software that can use FP16 at a 2:1 rate gets a substantially higher compute ceiling than software limited to FP32.

The 50th percentile overall placement is a neutral signal. It does not indicate a top-of-database part, but it also cannot be interpreted as poor performance without rival benchmark data. The empty nearestRivals field means no other GPU is directly compared in this record. Therefore, the MI60 should be considered by users whose primary requirement is large memory capacity and high bandwidth in a 300 W dual-slot card, rather than by users chasing maximum measured performance on a broad benchmark suite.

System integration is another deciding factor. The card requires a dual-slot bracket, 267 mm of length, 111 mm of height, a 6-pin and an 8-pin power connector, and a suggested 700 W PSU. It also uses a PCIe 4.0 x16 host interface. End-of-life production status is recorded, and no successor is listed. Users with an existing FirePro Data Center workflow may see the MI60 as a direct entry in that lineage, since the predecessor field is FirePro Data Center.

Memory Subsystem

The memory subsystem is the most distinctive part of the MI60's specification. It consists of 32 GB of HBM2 on a 4096-bit bus, with bandwidth rated at 1.02 TB/s. The memory clock is listed at 1000 MHz, with 2 Gbps effective data rate. The 4096-bit bus is what enables 1.02 TB/s at that clock; a narrower bus would need a much higher memory clock to reach the same bandwidth.

Capacity and bandwidth work together here. The 32 GB capacity can hold large framebuffers, large model weights, or large data sets, while the 1.02 TB/s bandwidth can feed those buffers to the compute units quickly. The texture rate of 460.8 GTexel/s and pixel rate of 115.2 GPixel/s place significant demand on memory reads, and the HBM2 interface is sized accordingly. In memory-bound tasks, the bottleneck is likely to be capacity or latency rather than the raw bandwidth figure, though the fact pack provides no latency measurements.

For high-resolution scenarios, memory footprint grows with resolution and asset size. The MI60's 32 GB and 1.02 TB/s make it a candidate for workloads that exceed the memory pools of smaller cards. Because no RT or tensor cores are recorded in the data, memory traffic goes to the standard shader units rather than dedicated tensor or ray tracing hardware. The memory subsystem is therefore the clearest evidence in this fact pack that the MI60 is a compute-focused accelerator, not a multi-monitor display card.