AMD Radeon Instinct MI50
AMD graphics card specifications and benchmark scores
At a Glance
AMDAMD Radeon Instinct MI50 Specifications
Radeon Instinct MI50 GPU Core
Shader units and compute resources
The AMD Radeon Instinct MI50 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
Instinct MI50 Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the Radeon Instinct MI50's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The Radeon Instinct MI50 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
AMD's Radeon Instinct MI50 Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The Radeon Instinct MI50's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
Radeon Instinct MI50 by AMD Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the Instinct MI50, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
Instinct MI50 Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the AMD Radeon Instinct MI50 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
GCN 5.1 Architecture & Process
Manufacturing and design details
The AMD Radeon Instinct MI50 is built on AMD's GCN 5.1 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the Instinct MI50 will perform in GPU benchmarks compared to previous generations.
AMD's Radeon Instinct MI50 Power & Thermal
TDP and power requirements
Power specifications for the AMD Radeon Instinct MI50 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the Radeon Instinct MI50 to maintain boost clocks without throttling.
Radeon Instinct MI50 by AMD Physical & Connectivity
Dimensions and outputs
Physical dimensions of the AMD Radeon Instinct MI50 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
AMD API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the AMD Radeon Instinct MI50. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
Radeon Instinct MI50 Product Information
Release and pricing details
The AMD Radeon Instinct MI50 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the Radeon Instinct MI50 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
Radeon Instinct MI50 Benchmark Scores
No benchmark data available for this GPU.
About AMD Radeon Instinct MI50
The AMD Radeon Instinct MI50 is a data-center GPU built around the Vega 20 chip and GCN 5.1 architecture. TSMC manufactures the 331 mm² die on a 7 nm process, integrating 13,230 million transistors at a density of 40.0M / mm². The card provides 16 GB of HBM2 memory over a 4096-bit bus, with 1.02 TB/s of bandwidth. Its clock specification lists a 1200 MHz base, a 1746 MHz boost, and memory at 1000 MHz with a 2 Gbps effective data rate. The board is dual-slot, 267 mm (10.5 inches) long, and draws power through 2x 8-pin connectors with a 700 W suggested PSU. TDP is 300 W. The product-generation label reads Radeon Instinct (MIx), its predecessor is the FirePro Data Center series, and production status is end-of-life following a 2018-11-17 release.
Benchmark Performance
The benchmark section of the supplied data is empty. Average benchmark score is 0, and the percentile versus all GPUs is 50. A 50th percentile places the MI50 at the midpoint of the database population, but because the average score is 0 and no benchmark entries accompany that percentile, the position is a neutral placeholder rather than a measured outcome. The nearest-rivals list in the data contains no entries, meaning there are no rival scores or deltaPct values to cite; exact percentage comparisons to named competitors cannot be produced from this dataset.
Compute performance is described by the FP32 and FP16 throughput figures. The card delivers 13.41 TFLOPS FP32, and 26.82 TFLOPS FP16 at a 2:1 ratio. That ratio means the FP16 throughput is double the FP32 throughput. With 3840 shading units, the clock range from the 1200 MHz base to the 1746 MHz boost defines the operating envelope for those figures. The fixed-function throughput numbers are also listed: a 419.0 GTexel/s texture rate from 240 TMUs, and a 111.7 GPixel/s pixel rate from 64 ROPs. These rates are consistent with the TMU and ROP counts running near the 1746 MHz boost clock. The data lists only base and boost clocks; no intermediate game clock is provided.
Memory bandwidth is a defining specification. The 16 GB HBM2 array uses a 4096-bit interface, and the memory clock of 1000 MHz / 2 Gbps effective yields 1.02 TB/s of bandwidth. For workloads that are memory-bound, the 1.02 TB/s figure is the primary constraint; for arithmetic-bound workloads, the 13.41 TFLOPS FP32 and 26.82 TFLOPS FP16 figures set the ceiling. The API list includes DirectX 12 at feature level 12_1, OpenGL 4.6, and Vulkan 1.3; these are the only graphics APIs in the data. The single mini-DisplayPort 1.4a output is the sole display connector listed. The 3840 shading units, 240 TMUs, and 64 ROPs are the only compute-unit counts in the data; no ray-tracing cores and no tensor cores are listed. The card's bus interface is PCIe 4.0 x16, which is the host link over which all data transfers pass. The physical specification of the chip, 13,230 million transistors on a 331 mm² die, yields a transistor density of 40.0M / mm². The 7 nm process node and GCN 5.1 architecture are the fabric on which the 13.41 TFLOPS FP32 and 26.82 TFLOPS FP16 rates depend.
Who Should Consider It
The MI50 is designed to be fed by a large memory pipe. The 16 GB HBM2 frame buffer on a 4096-bit bus produces 1.02 TB/s bandwidth, a figure that matters for keeping the 3840 shading units busy. Workloads that can stage large working sets in 16 GB of HBM2 will benefit more from this card than workloads that touch small data repeatedly. The 16 GB memory capacity sets a hard limit on working-set size; datasets exceeding 16 GB cannot reside entirely in HBM2. The 1.02 TB/s bandwidth does not compensate for capacity overflow, so the card suits workloads whose resident data fits within 16 GB but requires high transfer rates. The 2:1 FP16 ratio is another qualifier: mixed-precision code paths that tolerate FP16 arithmetic have 26.82 TFLOPS available, while FP32-only code is capped at 13.41 TFLOPS.
The data provides no game or compute benchmark scores, so resolution or settings guidance cannot be tied to measured frame rates. The only graphics-related data is the API list and display output: one mini-DisplayPort 1.4a, DirectX 12 (12_1), OpenGL 4.6, and Vulkan 1.3. The single display connector is the only output listed in the data, which is consistent with a board whose primary data path is the PCIe 4.0 x16 host interface. The physical profile also limits placement. The 267 mm (10.5 inches) length and dual-slot cooler require an appropriate chassis. PCIe 4.0 x16 is the bus interface, so a host system needs a PCIe 4.0 slot to operate the card at the full listed interface speed. The 1200 MHz base and 1746 MHz boost clocks bracket the operating range; without a measured game clock, sustained load behavior is not specified. Because production status is end-of-life, the card targets specialists maintaining existing systems rather than net-new fleet deployments. The release date of 2018-11-17 anchors it to a fixed point in the product timeline. The predecessor, FirePro Data Center, is the only lineage reference available, and the Radeon Instinct (MIx) generation label is the product-family marker. Users with FP16-heavy or bandwidth-heavy workloads have more to gain from this specification than users seeking a general-purpose desktop card.
Power and Cooling
The MI50's power requirements are explicit: 300 W TDP, 2x 8-pin PCIe power connectors, and a 700 W suggested PSU. The 300 W figure is the thermal design power that the cooling solution must shed; the 700 W figure is the system-level PSU guidance. With 2x 8-pin connectors, both inputs must be populated to satisfy the card's power specification. The cooler is dual-slot, occupying two expansion slots, and the board length is 267 mm / 10.5 inches; height and width are not specified in the data. The 7 nm process, 331 mm² die, and 13,230 million transistors are the physical context for the 300 W TDP; the data does not present a separate cooler rating or maximum temperature. The transistor density of 40.0M / mm² is a consequence of the 7 nm node and die size. Memory operates at 1000 MHz with 2 Gbps effective data rate, and the 16 GB HBM2 stack is part of the board's power envelope; however, the data separates the 300 W TDP from individual component draws. For a system builder, the 700 W suggested PSU and 2x 8-pin connectors define the minimum delivery infrastructure: a supply rated below 700 W or with fewer than two 8-pin connectors would fall outside the stated requirement.
FAQ
Q: What process node and foundry are used for the MI50?
A: TSMC fabricates the Vega 20 chip on a 7 nm process. The die measures 331 mm² and contains 13,230 million transistors, for a density of 40.0M / mm².
Q: What memory specifications does the MI50 list?
A: The card has 16 GB of HBM2 on a 4096-bit interface. Memory clock is 1000 MHz with 2 Gbps effective, yielding 1.02 TB/s of bandwidth.
Q: What power supply and connectors are required?
A: TDP is 300 W. The board has 2x 8-pin power connectors, and the suggested PSU is 700 W. It is dual-slot and 267 mm (10.5 inches) long.
Q: What FP32 and FP16 compute rates are listed?
A: FP32 is 13.41 TFLOPS and FP16 is 26.82 TFLOPS. The ratio is 2:1, so the FP16 rate is double the FP32 rate.
Q: Which APIs and display outputs are supported?
A: DirectX 12 (feature level 12_1), OpenGL 4.6, and Vulkan 1.3 are listed. The only display output is one mini-DisplayPort 1.4a connector.
Q: What is the host bus interface?
A: The card uses PCIe 4.0 x16, the only bus interface listed in the data.
Q: Is the MI50 still in production?
A: No. The production status is end-of-life. The release date is 2018-11-17, and the predecessor series is FirePro Data Center.
How It Compares
The data set lists no nearest rivals for the MI50, so a named-competitor comparison is impossible. The percentile versus all GPUs stands at 50, with an average benchmark score of 0; because no benchmark runs populate the score field, this percentile is not evidence of measured superiority or deficit relative to any specific card. The predecessor, FirePro Data Center, is the only product-family reference in the data, and no specifications or scores are provided for it. No successor is listed in the data. Without nearest-rival entries, the MI50's comparative standing in this database is undefined beyond the neutral 50th percentile.
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