RADEON

AMD Radeon Instinct MI355X

AMD graphics card specifications and benchmark scores

288 GB
VRAM
2400
MHz Boost
1400W
TDP
8192
Bus Width
MCM Design

At a Glance

AMD
VRAM 288 GB
Boost Clock 2,400 MHz
Shaders 16,384
Bus Width 8192-bit
TDP 1400W
Memory Type HBM3e
Architecture CDNA 3.0
nm
Process 5 nm

AMD Radeon Instinct MI355X Specifications

Radeon Instinct MI355X GPU Core

Shader units and compute resources

The AMD Radeon Instinct MI355X GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
16,384
Shaders
16,384
TMUs
1,024
Compute Units
256

Instinct MI355X Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the Radeon Instinct MI355X's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The Radeon Instinct MI355X by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

Base Clock
1000 MHz
Base Clock
1,000 MHz
Boost Clock
2400 MHz
Boost Clock
2,400 MHz
Memory Clock
2000 MHz 8 Gbps effective
GDDR GDDR 6X 6X

AMD's Radeon Instinct MI355X Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The Radeon Instinct MI355X's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
288 GB
VRAM
294,912 MB
Memory Type
HBM3e
VRAM Type
HBM3e
Memory Bus
8192 bit
Bus Width
8192-bit
Bandwidth
8.19 TB/s

Radeon Instinct MI355X by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the Instinct MI355X, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
16 KB (per CU)
L2 Cache
16 MB
Infinity Cache
256 MB

Instinct MI355X Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD Radeon Instinct MI355X against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
78.64 TFLOPS
FP64 (Double)
78.64 TFLOPS (1:1)
FP16 (Half)
629.1 TFLOPS (8:1)
Pixel Rate
0 MPixel/s
Texture Rate
2,457.6 GTexel/s

CDNA 3.0 Architecture & Process

Manufacturing and design details

The AMD Radeon Instinct MI355X is built on AMD's CDNA 3.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the Instinct MI355X will perform in GPU benchmarks compared to previous generations.

Architecture
CDNA 3.0
GPU Name
Aqua Vanjaram
Process Node
5 nm
Foundry
TSMC
Transistors
153,000 million
Die Size
1017 mm²
Density
150.4M / mm²

AMD's Radeon Instinct MI355X Power & Thermal

TDP and power requirements

Power specifications for the AMD Radeon Instinct MI355X determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the Radeon Instinct MI355X to maintain boost clocks without throttling.

TDP
1400 W
TDP
1400W
Power Connectors
None
Suggested PSU
1800 W

Radeon Instinct MI355X by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD Radeon Instinct MI355X are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
OAM Module
Bus Interface
PCIe 5.0 x16
Display Outputs
No outputs
Display Outputs
No outputs

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD Radeon Instinct MI355X. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

OpenCL
3.0

Radeon Instinct MI355X Product Information

Release and pricing details

The AMD Radeon Instinct MI355X is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the Radeon Instinct MI355X by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Predecessor
FirePro Data Center

Radeon Instinct MI355X Benchmark Scores

No benchmark data available for this GPU.

About AMD Radeon Instinct MI355X

The AMD Radeon Instinct MI355X is a data-center accelerator built on the CDNA 3.0 architecture, featuring the Aqua Vanjaram chip fabricated on TSMC’s 5 nm process. With 153,000 million transistors packed into a 1017 mm² die, this module targets compute-heavy workloads rather than traditional graphics output, as indicated by its zero display outputs and OAM slot width.

Benchmark Performance

The MI355X occupies the 50th percentile among all GPUs in the benchmark database, with an average benchmark score of 0. This percentile placement indicates that the card does not rank at the top of the overall GPU hierarchy, but the database contains no direct comparative scores for this accelerator. The absence of nearestRivals data means the analysis must rely on raw compute specifications to contextualize performance.

In terms of raw throughput, the MI355X delivers 78.64 TFLOPS of FP32 compute and 629.1 TFLOPS of FP16 compute, utilizing an 8:1 ratio between the two precision formats. That FP16 figure is roughly eight times the FP32 output, which is a typical pattern for accelerators designed for mixed-precision workloads. The texture rate stands at 2,457.6 GTexel/s, driven by 1,024 texture mapping units, while the pixel rate is 0 MPixel/s—consistent with a card that has no ROPs configured for rasterization output.

Memory bandwidth is a defining characteristic: the MI355X pairs 288 GB of HBM3e memory with an 8192-bit bus, achieving 8.19 TB/s of bandwidth. This bandwidth figure is exceptionally high, dwarfing what typical consumer GPUs offer, and it directly supports the large FP16 compute throughput. The effective memory clock is 2000 MHz, translating to 8 Gbps effective, which is modest per-pin but multiplied across the enormous bus width.

Benchmark results, as reflected by the percentile and average score, do not show this card competing with consumer or gaming GPUs in standard rasterization tests. Instead, the data suggests a specialized compute accelerator where memory capacity and bandwidth matter more than pixel output. The FP32 throughput of 78.64 TFLOPS positions it as a high-end compute part, but without rival scores, the relative standing remains qualitative.

How It Compares

The FACT PACK lists no nearest rivals for the MI355X, so direct percentage deltas cannot be calculated. The nearestRivals array is empty, meaning there are no named competitors with scores or deltaPct values to reference. Consequently, the comparison must be framed through the accelerator’s own specifications against the broader database of GPUs.

Against typical consumer GPUs, the MI355X lacks any display outputs and has a pixel rate of 0 MPixel/s, making it incomparable in rasterization benchmarks. The FP32 compute of 78.64 TFLOPS is far above what most desktop cards achieve, but the 1400 W TDP and 1800 W suggested PSU indicate a power envelope that excludes it from standard desktop configurations. The 288 GB memory capacity exceeds any gaming card, and the 8.19 TB/s bandwidth is similarly beyond consumer offerings.

Relative to other data-center accelerators, the MI355X’s 153,000 million transistors on a 1017 mm² die represent a high transistor density of 150.4M per mm². This density reflects the 5 nm process from TSMC, which allows more logic in the same area. The FP16 throughput of 629.1 TFLOPS suggests it is designed for AI training or inference, where half-precision math dominates. However, without rival data, the exact performance gap cannot be quantified.

The percentileVsAllGpus value of 50 indicates a median position in the database, but this is likely skewed by the inclusion of many consumer GPUs that the MI355X would not directly compete against. The average benchmark score of 0 reinforces that standard benchmark suites do not apply to this hardware, as it has no ROPs and no display outputs.

Who Should Consider It

Given the compute specifications, the MI355X is suited for environments that prioritize FP16 throughput and massive memory capacity over conventional graphics rendering. The 629.1 TFLOPS FP16 figure, combined with 288 GB of HBM3e memory at 8.19 TB/s bandwidth, makes it appropriate for large-scale AI model training or inference tasks where data fits within the memory pool.

For workloads that require FP32 precision, the 78.64 TFLOPS output is substantial, but the 8:1 FP16 ratio suggests the card is optimized for half-precision operations. Users running mixed-precision training—where FP16 accumulates into FP32—would see the most benefit from the high FP16 rate. The 8.19 TB/s bandwidth ensures that memory-bound operations, such as embedding lookups or large matrix multiplications, are not starved for data.

The 1400 W TDP and 1800 W suggested PSU imply a rack-mounted server environment with dedicated power delivery, not a workstation with a standard ATX supply. The OAM Module slot width confirms this, as OAM (Open Accelerator Module) is a server form factor. System integrators building AI clusters or high-performance computing nodes would be the target audience, especially those needing more than 100 GB of memory per accelerator.

At lower resolutions or for gaming, the MI355X is entirely unsuitable due to the 0 MPixel/s pixel rate and lack of display outputs. For scientific computing that relies on FP64, the FACT PACK does not list FP64 performance, so that use case cannot be evaluated. The data indicates a compute-only accelerator, so any recommendation must center on FP16-heavy workloads with large memory footprints.

Architecture and Design

The MI355X is built on the CDNA 3.0 architecture, which is AMD’s compute-focused design lineage, distinct from the RDNA series used in gaming cards. The chip, codenamed Aqua Vanjaram, is manufactured by TSMC on a 5 nm process node. The die measures 1017 mm², which is large by any standard, and houses 153,000 million transistors, yielding a transistor density of 150.4M per mm². This density is a direct result of the 5 nm lithography, allowing more compute units per area than older nodes.

The core configuration includes 16,384 shading units and 1,024 texture mapping units, but zero ROPs. This configuration is unusual for a GPU—ROPs handle pixel output, and their absence confirms the card does not rasterize images. The texture rate of 2,457.6 GTexel/s derives from the TMU count and clock speeds, but the pixel rate of 0 MPixel/s means no display or render target output.

Clocks are set at a base of 1000 MHz and a boost of 2400 MHz, which are moderate frequencies for such a large die. The memory clock is 2000 MHz, with 8 Gbps effective transfer rate per pin. The 8192-bit bus width is the key enabler of the 8.19 TB/s bandwidth, as each pin transfers at a relatively low rate but the aggregate width is enormous.

Power delivery is specified at 1400 W TDP, with no power connectors listed—typical for OAM modules that receive power through the socket rather than external cables. The suggested PSU is 1800 W, indicating a system-level power budget that accounts for the rest of the server. The bus interface is PCIe 5.0 x16, which provides ample host bandwidth for data transfer, though the 8.19 TB/s memory bandwidth far exceeds PCIe capabilities, meaning the accelerator relies on local memory for most operations.

Ray Tracing and Feature Set

The FACT PACK lists no ray tracing cores and no tensor cores for the MI355X. The rtCores and tensorCores fields are both null, indicating that the accelerator does not implement dedicated hardware for these features. This aligns with its CDNA 3.0 architecture, which prioritizes matrix math for compute rather than real-time graphics effects.

API support is similarly absent: the directx, opengl, and vulkan fields are all null. This means the MI355X does not expose standard graphics APIs, reinforcing its role as a compute-only device. Without Vulkan or DirectX support, no gaming or real-time rendering workloads can run on this hardware. The lack of display outputs (No outputs) further confirms that it is not designed to drive monitors.

The feature set, therefore, consists solely of the raw compute capabilities: FP32 at 78.64 TFLOPS, FP16 at 629.1 TFLOPS, and memory bandwidth at 8.19 TB/s. The absence of tensor cores does not preclude AI workloads—CDNA 3.0 can handle matrix operations through shader cores—but the 8:1 FP16 ratio suggests the card is tuned for half-precision throughput. The predecessor is listed as FirePro Data Center, which indicates a lineage of compute accelerators rather than gaming GPUs.

For ray tracing, there is no data to analyze. The card has no RT cores, no pixel rate, and no graphics API support, so ray-traced workloads are impossible. The focus remains on dense compute, such as linear algebra, neural network inference, or simulation, where memory bandwidth and FP16 throughput are the limiting factors.

FAQ

Q: What is the FP32 compute performance of the AMD Radeon Instinct MI355X?

A: The MI355X delivers 78.64 TFLOPS of FP32 compute, based on its 16,384 shading units and boost clock of 2400 MHz.

Q: How much memory does the MI355X have, and what is its bandwidth?

A: It has 288 GB of HBM3e memory on an 8192-bit bus, achieving 8.19 TB/s of memory bandwidth at an effective 8 Gbps per pin.

Q: Does the MI355X support display outputs or graphics APIs?

A: No. The card has no display outputs, and its DirectX, OpenGL, and Vulkan support are all listed as null, making it compute-only.

Q: What is the transistor count and die size of the MI355X?

A: The chip contains 153,000 million transistors on a 1017 mm² die, produced on TSMC’s 5 nm process, yielding a density of 150.4M transistors per mm².

Q: What is the power requirement for the MI355X?

A: The TDP is 1400 W, and the suggested PSU is 1800 W. The card uses an OAM Module slot width and has no power connectors, drawing power from the module socket.

Q: Does the MI355X have ray tracing or tensor cores?

A: The FACT PACK lists null for both ray tracing cores and tensor cores, indicating no dedicated hardware for either feature. The card focuses on FP32 and FP16 compute instead.

Q: How does the MI355X rank among all GPUs in the benchmark database?

A: It sits at the 50th percentile among all GPUs, with an average benchmark score of 0, reflecting that standard graphics benchmarks do not apply to this compute accelerator.

The NVIDIA Equivalent of Radeon Instinct MI355X

Looking for a similar graphics card from NVIDIA? The NVIDIA GeForce RTX 5070 SUPER offers comparable performance and features in the NVIDIA lineup.

NVIDIA GeForce RTX 5070 SUPER

NVIDIA • 18 GB VRAM

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