AMD Radeon Instinct MI300X

The AMD Radeon Instinct MI300X is an AMD accelerator built on the CDNA 3.0 architecture with the Aqua Vanjaram chip. TSMC manufactures it on a 5 nm process, with 153,000 million transistors in a 1017 mm² die and a transistor density of 150.4M / mm². The generation field is Radeon Instinct (MIx), and the release date is 2023-12-05. The listed base clock is 1000 MHz and the boost clock is 2100 MHz. The device uses 19,456 shading units, 1,216 TMUs, and 0 ROPs, with a 0 MPixel/s pixel rate and a 2,553.6 GTexel/s texture rate. Memory is 192 GB of HBM3 on an 8192-bit bus, with 10.3 TB/s of bandwidth. The host interface is PCIe 5.0 x16. There are no display outputs. The database lists no benchmark scores and no nearest rivals; the average benchmark score is 0, and the percentile among all GPUs is 50.

How It Compares

The nearestRivals array is empty. There are, therefore, no rival names, rival scores, or deltaPct values available, and a per-rival placement cannot be constructed from the FACT PACK. The only comparative field is percentileVsAllGpus, which is 50. A value of 50 places the MI300X at the midpoint of the all-GPU ranking: 50 percent of the ranked GPUs sit below it, and 50 percent sit above it. That placement is separate from the average benchmark score, which is 0, and from the benchmarks array, which is empty. The empty benchmarks array and empty nearestRivals array leave percentileVsAllGpus as the only cross-GPU metric in the record. The predecessor is listed as FirePro Data Center, and no successor is recorded. The series and codename fields are null. Production status is not recorded. Because the nearestRivals field contains no entries, no percentage delta over or under a specific rival can be reported.

Ray Tracing and Feature Set

The rtCores field is null, so no ray tracing core count is specified. The tensorCores field is null, so no tensor core count is specified. The architecture is CDNA 3.0, and the display output field reads "No outputs". The game clock field is null; the listed clock fields are 1000 MHz base and 2100 MHz boost. Consistent with the absence of display output, the pixel pipeline is listed at 0 ROPs and 0 MPixel/s. Texture resources are present and quantified: 1,216 TMUs and a 2,553.6 GTexel/s texture rate. The programmable side uses 19,456 shading units, with FP32 throughput of 81.72 TFLOPS and FP16 throughput of 653.7 TFLOPS (8:1). The DirectX, OpenGL, and Vulkan API fields are all null, so the data records no graphics API compatibility. Because the RT core and tensor core counts are null, dedicated acceleration for those feature classes cannot be quantified. The feature set is therefore defined by the compute rates, the texture rate, the memory system, and the absence of display output.

Benchmark Performance

The benchmarks array is empty, so no measured performance samples are present. The average benchmark score is 0, which is consistent with an empty sample set. That zero is not a performance result; it is the placeholder for an empty benchmark list. The percentileVsAllGpus value is 50, meaning the entry is positioned in the middle of the database ranking. NearestRivals is empty, so deltaPct values are absent; exact performance gaps against other GPUs cannot be formed. The only throughput figures in the record are the listed peak rates: 81.72 TFLOPS FP32 and 653.7 TFLOPS FP16 (8:1). These are not benchmark results, because the benchmarks array contains no entries. The 50th percentile is, therefore, a placement value rather than a measured score. Without nearest rivals, the data cannot state whether the MI300X leads or trails any specific product by a percentage.

Who Should Consider It

No resolution or settings-based recommendation can be grounded in measured scores, because the benchmarks array is empty. The relevant selection criteria are the listed capabilities. The 8192-bit bus and 192 GB capacity are the strongest indicators of intended use. The MI300X has 192 GB of HBM3 memory and 10.3 TB/s of bandwidth, which suits workloads that require a large locally resident data set. The 81.72 TFLOPS FP32 rate and the 653.7 TFLOPS FP16 rate describe arithmetic throughput for compute-oriented work. The card has no display outputs, 0 ROPs, and a 0 MPixel/s pixel rate, so the data does not support monitor-driven use. The OAM Module slot width and 750 W TDP separate it from desktop expansion card use. The 1000 MHz base clock and 2100 MHz boost clock define the stated operating rate range. Consider this product when the workload can use the 8192-bit memory bus, the 192 GB capacity, and 10.3 TB/s of HBM3 bandwidth. For high-resolution display rendering, the 0 ROPs and 0 MPixel/s pixel rate are disqualifying on their own.

Memory Subsystem

The memory subsystem is 192 GB of HBM3 with an 8192-bit bus and 10.3 TB/s of bandwidth. The memory clock is 2525 MHz, listed as 10.1 Gbps effective. The memory type is HBM3, and the bus width is 8192 bit; together with the 10.3 TB/s figure, these values describe the entire memory path. The 8192-bit bus connects the 192 GB capacity to the compute logic. With 10.3 TB/s of aggregate bandwidth, the memory can feed the 19,456 shading units at the listed throughput rates. For high-resolution display work, the 0 MPixel/s pixel rate would be the limiting factor, but the card has no display outputs. For high-resolution compute grids, the 192 GB capacity and 10.3 TB/s bandwidth are the relevant resources. The data records both the 2525 MHz memory clock and the 10.1 Gbps effective data rate. The 10.3 TB/s bandwidth is the aggregate figure associated with the 8192-bit bus. This memory subsystem, rather than the pixel pipeline, defines the product's data-handling character.

Power and Cooling

The TDP is 750 W. The suggested PSU is 1150 W. The power connectors field is None, so no power connector is listed. This None value is separate from the suggested PSU figure of 1150 W. The slot width is OAM Module. No length, height, or width dimensions are recorded. No cooler or fan specifications are recorded. The 750 W TDP is smaller than the 1150 W suggested PSU, and the two figures serve different roles in the data: one is the module's TDP, and the other is the recommended system supply. The 5 nm process, 153,000 million transistors, and 1017 mm² die size provide the silicon context for the 750 W TDP. Because the power connectors field is None, the OAM Module interface is the only power path recorded. The PCIe 5.0 x16 host interface is present as the data path, while the 1150 W suggested PSU is the system-level recommendation.