AMD Radeon Instinct MI300A
AMD graphics card specifications and benchmark scores
MCM DesignAt a Glance
AMDAMD Radeon Instinct MI300A Specifications
Radeon Instinct MI300A GPU Core
Shader units and compute resources
The AMD Radeon Instinct MI300A GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.
Instinct MI300A Clock Speeds
GPU and memory frequencies
Clock speeds directly impact the Radeon Instinct MI300A's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The Radeon Instinct MI300A by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.
AMD's Radeon Instinct MI300A Memory
VRAM capacity and bandwidth
VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The Radeon Instinct MI300A's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.
Radeon Instinct MI300A by AMD Cache
On-chip cache hierarchy
On-chip cache provides ultra-fast data access for the Instinct MI300A, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.
Instinct MI300A Theoretical Performance
Compute and fill rates
Theoretical performance metrics provide a baseline for comparing the AMD Radeon Instinct MI300A against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.
CDNA 3.0 Architecture & Process
Manufacturing and design details
The AMD Radeon Instinct MI300A is built on AMD's CDNA 3.0 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the Instinct MI300A will perform in GPU benchmarks compared to previous generations.
AMD's Radeon Instinct MI300A Power & Thermal
TDP and power requirements
Power specifications for the AMD Radeon Instinct MI300A determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the Radeon Instinct MI300A to maintain boost clocks without throttling.
Radeon Instinct MI300A by AMD Physical & Connectivity
Dimensions and outputs
Physical dimensions of the AMD Radeon Instinct MI300A are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.
AMD API Support
Graphics and compute APIs
API support determines which games and applications can fully utilize the AMD Radeon Instinct MI300A. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.
Radeon Instinct MI300A Product Information
Release and pricing details
The AMD Radeon Instinct MI300A is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the Radeon Instinct MI300A by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.
Radeon Instinct MI300A Benchmark Scores
No benchmark data available for this GPU.
About AMD Radeon Instinct MI300A
AMD Radeon Instinct MI300A is a 5 nm data-center accelerator from AMD, built on the CDNA 3.0 architecture with the Aqua Vanjaram chip. Released on 2023-12-05, it carries 192 GB of HBM3 memory, 81.72 TFLOPS FP32 compute, a 750 W TDP, and no display outputs. Its only position metric in the database is a 50th-percentile rank, but because the benchmark array is empty and the average benchmark score is 0, the analysis that follows is driven by the specification fields rather than measured rival comparisons.
How It Compares
The nearestRivals list in the record is empty. There are no rival names, no rival scores, and no deltaPct values to quote. The only comparative data point available is percentileVsAllGpus: 50, which places this module at the median of the database's GPU population. Because avgBenchmarkScore is 0, that percentile should not be read as a measured performance average; it is a directory position rather than a validated score. The record lists the predecessor as FirePro Data Center, but no successor and no production status are provided. Without nearestRivals data, direct percentage comparisons against other accelerators cannot be stated.
Ray Tracing and Feature Set
The data records no ray tracing core count and no tensor core count; both rtCores and tensorCores fields are null. Consequently, no ray tracing or tensor core assertions can be made from this dataset. The feature set is instead documented through the CDNA 3.0 architecture, 19,456 shading units, 1,216 texture mapping units, and 0 ROPs. Pixel rate is 0 MPixel/s, while texture rate is 2,553.6 GTexel/s. API entries for DirectX, OpenGL, and Vulkan are all null, and display outputs are listed as "No outputs." The only precision-oriented compute figure in the pack is FP16 at 653.7 TFLOPS (8:1). This is a compute-focused specification sheet: no raster output stage, no documented graphics API surface, and no display path.
Power and Cooling
The TDP is 750 W. The suggested PSU is 1150 W. The power connector field is None, and the slot width is OAM Module. The bus interface is PCIe 5.0 x16, but the physical form factor is a module rather than a standard add-in card. Because no power connectors are listed, the electrical design relies on the OAM Module baseboard connection. The 1150 W PSU figure is the only power-supply guidance in the record. Length, height, and width fields are all null, so physical cooler sizing data is not present. The module has no display outputs, which also means no video output circuitry is part of this board. Thermal management for a 750 W OAM Module would be the responsibility of the chassis design, though the data does not specify a cooler.
FAQ
Q: What memory configuration does the MI300A have?
A: It has 192 GB of HBM3 memory on an 8192-bit bus. The memory clock is 2525 MHz, listed as 10.1 Gbps effective, and bandwidth is 10.3 TB/s.
Q: What are the core clock speeds?
A: The base clock is 1000 MHz and the boost clock is 2100 MHz.
Q: What compute throughput is listed?
A: FP32 is 81.72 TFLOPS, FP16 is 653.7 TFLOPS (8:1), texture rate is 2,553.6 GTexel/s, and pixel rate is 0 MPixel/s.
Q: What is the TDP and recommended PSU?
A: The TDP is 750 W. The suggested PSU is 1150 W. Power connectors are listed as None.
Q: Does the MI300A have display outputs or graphics API support?
A: Display outputs are listed as "No outputs." DirectX, OpenGL, and Vulkan are all null in the data.
Q: What process technology is used?
A: The process node is 5 nm at TSMC. The chip is Aqua Vanjaram, with 153,000 million transistors on a 1017 mm² die, giving a transistor density of 150.4M / mm². The architecture is CDNA 3.0.
Benchmark Performance
The benchmarks array is empty, and avgBenchmarkScore is 0. The nearestRivals list contains no entries, so there are no exact deltaPct values to analyze. The only recorded comparative metric, percentileVsAllGpus, is 50. Because no benchmark results populate the record, that percentile cannot be tied to an average score. The specification-side throughput peaks are 81.72 TFLOPS FP32, 653.7 TFLOPS FP16 (8:1), and 2,553.6 GTexel/s texture rate. These are raw hardware limits, not measured application results. No percentage lead or deficit against a named rival can be reported from this dataset, since no rival data exists in the record.
Memory Subsystem
Memory capacity is 192 GB of HBM3, on an 8192-bit bus, with 10.3 TB/s of bandwidth. The memory clock is 2525 MHz, expressed as 10.1 Gbps effective. The 8192-bit bus width is the defining interface characteristic: it is paired with the 10.3 TB/s bandwidth to move very large data sets. For high-resolution contexts, the relevant facts are the 192 GB capacity and 10.3 TB/s bandwidth rather than a display frame buffer, because the module reports no display outputs and a pixel rate of 0 MPixel/s. ROP count is 0, so there is no conventional pixel-generating pipeline. The memory subsystem is therefore best read as a data-movement resource for compute workloads, not as a graphics memory pool feeding a local display.
Who Should Consider It
This module is for compute environments that need large memory capacity and high FP16 throughput. The 81.72 TFLOPS FP32 and 653.7 TFLOPS FP16 (8:1) figures point toward FP32-heavy or FP16-heavy workloads, while 192 GB of HBM3 with 10.3 TB/s bandwidth supports large resident datasets. It is not for desktop graphics use: display outputs are "No outputs," ROPs are 0, pixel rate is 0 MPixel/s, and DirectX, OpenGL, and Vulkan are all null. There are no benchmark scores in the record, so measured settings recommendations cannot be derived. Resolution choices for direct rendering do not apply because there is no output path. The 750 W TDP and 1150 W suggested PSU mean the host system must be built around an OAM Module slot and sufficient power delivery. Any decision should be based on the specified compute and memory profile, not on benchmark deltas, because the database contains no rival benchmark entries for this accelerator.
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